IP Library Granted Patent US 10,935,698
Granted Patent B2
US 10,935,698 · App. 15/903,787 · Granted Mar 2, 2021

High aspect ratio glass wafer

Inventors: Michael Lucien Genier (Horseheads, NY); John Tyler Keech (Painted Post, NY); Robert Sabia (Parkland, FL)
Assignee: Corning Incorporated
G02B1/11C03C1/00C03C3/06C03C17/002C03C2201/42C03C2217/73C03C2217/732
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,935,698
App. No.
15/903,787
Granted
Mar 2, 2021
Kind
B2
Abstract

A glass wafer having a first major surface, a second major surface that is parallel to and opposite of the first major surface, a thickness between the first major surface and the second major surface, and an annular edge portion that extends from an outermost diameter of the glass wafer toward the geometrical center of the glass wafer. The glass wafer has a diameter from greater than or equal to 175 mm to less than or equal to 325 mm and a thickness of less than 0.350 mm. A width of the edge portion is less than 10 mm.

Claims (43)

1. A glass wafer comprising:

a first major surface;

a second major surface that is parallel to and opposite the first major surface;

a thickness between the first major surface and the second major surface; and

an annular edge portion that extends from an outermost diameter of the glass wafer toward a geometrical center of the glass wafer, wherein a width of the annular edge portion is 0.2 mm to 5 mm, wherein the annular edge portion comprises a chamfer having an angle of 15° to about 75° ,

wherein a diameter of the glass wafer is from greater than or equal to 205 mm to less than or equal to 325 mm,

wherein a variance in diameter d across a circumference of the glass wafer is ±0.20 mm or less, and

wherein the thickness of the glass wafer is less than 0.350 mm.

2. A glass wafer comprising:

a first major surface;

a second major surface that is parallel to and opposite the first major surface;

a thickness between the first major surface and the second major surface; and

an annular edge portion that extends from an outermost diameter of the glass wafer toward a geometrical center of the glass wafer, wherein

a diameter of the glass wafer is from greater than or equal to 175 mm to less than or equal to 325 mm, wherein a variance in diameter d across a circumference of the glass wafer is ± 0.20 mm or less,

the thickness is less than 0.350 mm, and

a width of the annular edge portion is 0.2 mm to 5 mm.

3. The glass wafer of claim 1 , wherein the diameter of the glass wafer is from greater than or equal to 200 mm to less than or equal to 300 mm.

4. The glass wafer of claim 1 , wherein the thickness is from greater than or equal to 0.225 mm to less than or equal to 0.325 mm.

5. The glass wafer of claim 2 , wherein the width of the annular edge portion is 0.2 mm to 3 mm.

6. The glass wafer of claim 2 , wherein an aspect ratio of the glass wafer is from greater than or equal to 475:1 to less than or equal to 700:1.

7. The glass wafer of claim 1 , wherein the glass wafer has a total thickness variation (TTV) of less than 5 μm.

8. The glass wafer of claim 1 , wherein the glass wafer has a bow of less than or equal to 35 μm.

9. The glass wafer of claim 1 , wherein the glass wafer has a warp of less than or equal to 45 μm.

10. The glass wafer of claim 1 , wherein the glass wafer has an optical wedge of less than 0.030 arc-sec.

11. The glass wafer of claim 1 , wherein the glass wafer has a scratch-dig of 40/20 or less.

12. The glass wafer of claim 1 , wherein the glass wafer further comprises an anti-reflective coating.

13. An optical, electrical, or mechanical device comprising the glass wafer of claim 1 .

14. A glass wafer comprising:

a first major surface;

a second major surface that is parallel to and opposite the first major surface;

a thickness between the first major surface and the second major surface; and

an annular edge portion that extends from an outermost diameter of the glass wafer toward a geometrical center of the glass wafer, wherein the annular edge portion surrounds a finished portion of the glass wafer, and wherein

a diameter of the glass wafer is from greater than or equal to 200 mm to less than or equal to 325 and wherein a variance in diameter d across a circumference of the glass wafer is ±0.20 mm or less,

the thickness is from greater than or equal to 0.225 mm to less than or equal to 0.325 mm,

a width of the annular edge portion is 0.2 mm to 5 mm,

a total thickness variation (TTV) of the glass wafer is less than 1 μm,

a bow of the glass wafer is less than or equal to ±15 μm, and

a warp of the glass wafer is less than or equal to 30 μm.

15. The glass wafer of claim 14 , wherein the glass wafer has a refractive index from greater than or equal to 1.45 to less than or equal to 1.90.

16. The glass wafer of claim 14 , wherein the glass wafer has a surface roughness (R a ) of less than or equal to 2 nm.

17. The glass wafer of claim 14 , wherein the glass wafer has a scratch-dig of 20/10 or less.

18. The glass wafer of claim 14 , wherein the glass wafer has an optical wedge of less than 0.030 arc-sec.

19. The glass wafer of claim 14 , wherein the glass wafer further comprises an anti-reflective coating.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2018
From: GENIER, MICHAEL LUCIEN; KEECH, JOHN TYLER; SABIA, ROBERT
To: CORNING INCORPORATED
Reel/Frame 045022/0001 →
Continuity (2)
Provisional Application 62463320 · Feb 24, 2017
Related Publication 20180246257A1 · Aug 30, 2018