Substrate processing method
View Patent ↗A substrate processing method includes a first discharge step of discharging, from the first discharge port which faces a predetermined first region including the rotating center of the upper surface, a low surface tension liquid containing gas containing steam of a low surface tension liquid having a larger specific gravity than air and lower surface tension than the processing liquid and not discharging the low surface tension liquid containing gas from the second discharge port which faces a predetermined second region surrounding the outside of the first region on the upper surface of the substrate, and a second discharge step of discharging the low surface tension liquid containing gas from the second discharge port after the first discharge step and not discharging the low surface tension liquid containing gas from the first discharge port.
1. A substrate processing method comprising:
a substrate holding step of horizontally holding a substrate having an upper surface on which patterns are formed;
a liquid film forming step of forming a liquid film of a processing liquid thicker than a height of the patterns on an upper surface of the substrate;
a discharge port positioning step of positioning a first discharge port and a second discharge port at respective fixed positions which are set such that the first discharge port faces a predetermined first region including a rotating center of an upper surface of the substrate and the second discharge port faces a predetermined second region which is an annular region surrounding the outside of the first region on an upper surface of the substrate;
a first discharge step of discharging, from the first discharge port, a low surface tension liquid containing gas containing steam of a low surface tension liquid having a larger specific gravity than air and lower surface tension than the processing liquid and not discharging the low surface tension liquid containing gas from the second discharge port;
a second discharge step of discharging the low surface tension liquid containing gas from the second discharge port after the first discharge step and not discharging the low surface tension liquid containing gas from the first discharge port; and
a rotation step of rotating the substrate around a predetermined vertical axis in parallel with the first and second discharge steps,
wherein the first discharge port and the second discharge port are stationarily placed at the respective fixed positions throughout the first discharge step and the second discharge step and until the liquid film of the processing liquid has been removed from the upper surface of the substrate.
2. The substrate processing method according to claim 1 , wherein a discharging direction of a gas discharged from the first discharge port includes a vertical downward direction, and
a discharging direction of a gas discharged from the second discharge port includes an outward obliquely downward direction.
3. The substrate processing method according to claim 1 , wherein the low surface tension liquid containing gas has a temperature higher than room temperature.
4. The substrate processing method according to claim 1 , wherein the second discharge step includes a step of discharging, from the first discharge port, an inert gas that does not include steam of the low surface tension liquid and has a smaller specific gravity than the low surface tension liquid.
5. The substrate processing method according to claim 1 , wherein the first discharge step includes a step of discharging, from the second discharge port, an inert gas that does not include steam of the low surface tension liquid and has a smaller specific gravity than the low surface tension liquid.
6. The substrate processing method according to claim 1 , wherein the processing liquid includes water, and
the low surface tension liquid includes an organic solvent.