Freeform distortion correction
Methods and systems are provided that, in some embodiments, print and process a layer. The layer can be on a wafer or on an application panel. Thereafter, locations of the features that were actually printed and processed are measured. Based upon differences between the measured differences and designed locations for those features at least one distortion model is created. Each distortion model is inverted to create a corresponding correction model. When there are multiple sections, a distortion model and a correction model can be created for each section. Multiple correction models can be combined to create a global correction model.
1. A method comprising:
printing and processing a first layer on a substrate, wherein the first layer comprises a plurality of sections;
measuring actual feature locations on the first layer, wherein the actual feature location corresponds to designed feature locations;
creating a distortion model from the actual feature locations for each section of the first layer and from the designed feature locations for each section of the first layer, wherein each section comprises a plurality of actual feature locations;
inverting the distortion model of each section of the first layer to create at least one correction model, wherein the at least one correction model comprises at least one non-linear correction to the distortion model; and
printing and processing a second layer on top of the first layer using the at least one correction model.
2. The method of claim 1 wherein at least one distortion model is represented in polynomial form.
3. The method of claim 1 wherein the distortion model for each section is selected in response to differences between the actual feature locations and the designed feature locations.
4. The method of claim 1 further comprising:
repeating,
the printing,
the measuring,
the creating, and
the inverting until a penultimate layer is printed and processed; and
printing and processing a last layer using the at least one correction model created from actual feature locations on the penultimate layer and design feature locations for the penultimate layer.
5. The method of claim 1 further comprising:
calculating linear distortion due to scaling, rotation and shift; and
correcting linear distortion before creating a distortion model.
6. The method of claim 1 wherein the at least one correction model is based on an average distortion measured from multiple representative processes.
7. The method of claim 1 wherein the at least one correction model is created from an average of at least two distortion models.
8. The method of claim 1 further comprising:
dividing, before measuring, the substrate, into sections.
9. The method of claim 8 wherein a distortion model in one section is different than a distortion model in another subsection.
10. The method of claim 8 wherein each correction model in the at least one correction model is combined to create a global correction model.
11. The method of claim 8 wherein a low pass filter is applied to adjoining borders of the sections.
12. The method of claim 11 wherein the low pass filter is a Gaussian Filter.
13. The method of claim 8 wherein the actual feature locations are a plurality of actual feature locations and the designed feature locations are a plurality of designed feature locations in at least one of the sections.
14. The method of claim 13 wherein there are at least four of the actual feature locations and at least four of the designed feature locations in the at least one of the sections.
15. A method comprising:
printing and processing a first layer on a first substrate;
aligning, for plate shift and rotation, a second layer with the first layer;
printing and processing the aligned second layer on top of the first layer; and
measuring separation between printed features on the first layer and printed features on the aligned second layer.
16. The method of claim 15 wherein the aligned second layer is each individual layer after the first layer,
aligning, for plate shift and rotation, each second layer with the first layer;
printing and processing each second layer; and
measuring separation between each second layer and the first layer.
17. The method of claim 15 further comprising:
reprinting the first layer and a corrected second layer using the measured separation between the first layer and the second layer, wherein the reprinting is on a second substrate different from the first substrate;
aligning, for plate shift and rotation, a third layer with the second layer;
printing and processing the aligned third layer; and
measuring separation between the aligned third layer and the second layer.
18. The method of claim 17 further comprising:
reprinting the first layer, the corrected second layer and a corrected third layer using the measured separation between the second layer and the third layer wherein the reprinting is on a third substrate different from the first and second substrates.
19. A method comprising:
printing and processing a first layer on a substrate;
aligning, for plate shift and rotation, a second layer with the first layer;
printing and processing the aligned second layer on the substrate;
measuring separation between printed features on the first layer and printed features on the second layer;
aligning, for plate shift and rotation, a third layer with the first layer;
printing and processing the aligned third layer on the substrate; and
measuring separation between printed features on the third layer and the printed features on the first layer.
20. The method of claim 19 further comprising at least one intermediate layer between the first layer and the third layer, wherein
each respective layer in the at least one intermediate layer has been:
aligned, for plate shift and rotation, with the first layer,
printed and processed on the substrate, and
measured for separation with the first layer.