Electronic component
An electronic component includes an element body including a plurality of side surfaces adjacent to each other, and an external electrode disposed on the plurality of side surfaces. The external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer. A clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body. The conductive resin layer includes a first portion located on one side surface of the plurality of side surfaces and a second portion located on another side surface of the plurality of side surfaces. An existence ratio of the gaps in the first portion is greater than an existence ratio of the gaps in the second portion.
1. An electronic component comprising:
an element body including a plurality of side surfaces adjacent to each other; and
an external electrode disposed on the plurality of side surfaces, wherein
the external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer,
a clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body,
the conductive resin layer includes a first portion located on one side surface of the plurality of side surfaces and a second portion located on another side surface of the plurality of side surfaces, and
an existence ratio of the gaps in the first portion is greater than an existence ratio of the gaps in the second portion.
2. The electronic component according to claim 1 , wherein
a maximum thickness of the first portion is larger than a maximum thickness of the second portion.
3. The electronic component according to claim 1 , wherein
a total area of the gaps in the first portion is within a range of 5 to 35% of an area of the first portion in a cross-section along a thickness direction of the first portion.
4. The electronic component according to claim 1 , wherein
the one side surface is arranged to constitute a mounting surface.
5. The electronic component according to claim 1 , wherein
the other side surface is arranged to constitute a mounting surface.
6. The electronic component according to claim 1 , wherein
the element body includes an end surface adjacent to the plurality of side surfaces,
the conductive resin layer is formed to continuously cover a part of each of the plurality of side surfaces and a part of the end surface, and
the plating layer is formed to cover the entire end surface.
7. The electronic component according to claim 1 , wherein
the element body includes an end surface adjacent to the plurality of side surfaces,
the one side surface is arranged to constitute a mounting surface,
the conductive resin layer is formed to continuously cover a part of each of the plurality of side surfaces and a part of the end surface,
the plating layer is formed to cover the entire end surface, and
an area of the first portion is larger than an area of the second portion.
8. The electronic component according to claim 1 , wherein
a maximum length of each of the plurality of gaps is within a range of 1 to 20 μm in a cross-section along a thickness direction of the conductive resin layer.
9. An electronic component comprising:
an element body; and
an external electrode disposed on the element body, wherein
the external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer, and
a clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body.
10. An electronic component comprising:
an element body including a side surface and an end surface adjacent to each other; and
an external electrode disposed on the side surface and the end surface, wherein
the external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer,
a clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body,
the conductive resin layer includes a first portion located on the side surface and a second portion located on the end surface, and
an existence ratio of the gaps in the first portion is greater than an existence ratio of the gaps in the second portion.
11. The electronic component according to claim 10 , wherein
a maximum thickness of the first portion is larger than a maximum thickness of the second portion.
12. The electronic component according to claim 10 , wherein
a total area of the gaps in the first portion is within a range of 5 to 35% of an area of the first portion in a cross-section along a thickness direction of the first portion.
13. The electronic component according to claim 10 , wherein
the side surface is arranged to constitute a mounting surface.
14. The electronic component according to claim 10 , wherein
the conductive resin layer is formed to continuously cover a part of the side surface and a part of the end surface, and
the plating layer is formed to cover the entire end surface.
15. The electronic component according to claim 10 , wherein
a maximum length of each of the plurality of gaps is within a range of 1 to 20 μm in a cross-section along a thickness direction of the conductive resin layer.