Multi-layer thin film composite thermal interface materials
A layered composite configured to form an interface between a heat exchanger and an integrated circuit includes a first polymer layer, a second polymer layer, a liquid metal in direct contact with the first polymer layer, a solid solute in direct contact with the second polymer layer, and a barrier between the liquid metal and the solid solute. The liquid metal is liquid at normal temperature and pressure. The solid solute includes microparticles, nanoparticles, or both and is solid at normal temperature and pressure. The barrier prevents contact of the liquid metal and the solid solute at normal temperature and pressure, and is configured to rupture under compression of the layered composite, thereby allowing the liquid metal and the solid solute to form a mixture between the first polymer layer and the second polymer layer.
1. A layered composite comprising:
a first polymer layer;
a second polymer layer;
a liquid metal in direct contact with the first polymer layer, wherein the liquid metal is liquid at normal temperature and pressure;
a solid solute in direct contact with the second polymer layer, wherein the solid solute comprises microparticles, nanoparticles, or both and is solid at normal temperature and pressure; and
a barrier between the liquid metal and the solid solute, wherein the barrier prevents contact of the liquid metal and the solid solute at normal temperature and pressure, and is configured to rupture under compression of the layered composite, thereby allowing the liquid metal and the solid solute to form a mixture between the first polymer layer and the second polymer layer,
wherein the layered composite is configured to form an interface between a heat exchanger and an integrated circuit.
2. The layered composite of claim 1 , wherein the mixture comprises an alloy or a colloid.
3. The layered composite of claim 1 , wherein the liquid metal comprises at least one of Ga, GaIn, GaInSn, BiSn, BiIn, and BiInSn.
4. The layered composite of claim 3 , wherein the liquid metal is in the form of droplets.
5. The layered composite of claim 3 , wherein the liquid metal is in the form of a thin film.
6. The layered composite of claim 1 , wherein the solid solute is selected to react with the liquid metal.
7. The layered composite of claim 6 , wherein the solid solute comprises one or more of nickel, copper, silver, and gold.
8. The layered composite of claim 1 , wherein the solid solute does not react with the liquid metal at room temperature.
9. The layered composite of claim 8 , wherein the solid solute comprises one or more of tungsten, single grain aluminum, alumina, silica, silicon, silicon carbide, boron nitride, and an allotrope of carbon.
10. The layered composite of claim 9 , wherein the allotrope of carbon comprises one or more of graphite, graphene, carbon nanotubes, and diamond.
11. The layered composite of claim 1 , wherein the first polymer layer, the second polymer layer, or both comprises polydimethylsiloxane.
12. The layered composite of claim 1 , wherein the first polymer layer, the second polymer layer, or both comprises a thermally conductive additive in a liquid state or a solid state.
13. The layered composite of claim 1 , wherein the barrier comprises a metal oxide, a polymer, or an allotrope of carbon.
14. The layered composite of claim 1 , wherein the liquid metal is in the form of a thin film, and the barrier forms a layer between the liquid metal and the solid solute.
15. The layered composite of claim 14 , wherein the liquid metal is in the form of droplets, and the barrier forms a coating on the droplets.
16. A device comprising:
a heat exchanger;
an integrated circuit; and
the layered composite of claim 1 between the heat exchanger and the integrated circuit.
17. The device of claim 16 , wherein compression of the layered composite between the heat exchanger and the integrated circuit is configured to rupture the barrier, such that the liquid metal and the solid solute react to form an alloy.
18. The device of claim 16 , wherein compression of the layered composite between the heat exchanger and the integrated circuit is configured to rupture the barrier, thereby forming a colloid comprising the liquid metal and the solid solute.
19. A method of thermally coupling a heat exchanger and an integrated circuit, the method comprising:
positioning the layered composite of claim 1 between a heat exchanger and an integrated circuit to form a multilayer device;
compressing the multilayer device to rupture the barrier between the liquid metal and the solid solute; and
forming a mixture of the liquid metal and the solid solute in situ between the heat exchanger and the integrated circuit.
20. The method of claim 19 , further comprising filling an area between the heat exchanger and the integrated circuit with the mixture.