Radio frequency transmission line

1. A radio frequency transmission line configured for use in a radio frequency circuit, the radio frequency transmission line comprising:

a bonding layer having a bonding surface, the bonding surface being bonded to a wire bond that extends from a die to the bonding surface, the die including a radio frequency component configured to provide a radio frequency signal, and the bonding surface being electrically connected to the radio frequency component by way of the wire bond;

a barrier layer proximate the bonding layer;

a diffusion barrier layer proximate the barrier layer, the diffusion barrier layer including nickel and having a thickness in a range from 0.04 um to 0.2 um, the diffusion barrier layer and the barrier layer configured to prevent contaminant from entering the bonding layer; and

a conductive layer proximate to the diffusion barrier layer, the diffusion barrier layer having a thickness that allows the radio frequency signal to penetrate the diffusion barrier layer to the conductive layer.

2. The radio frequency transmission line of claim 1 wherein the thickness of the diffusion barrier layer is less than the skin depth of the diffusion barrier layer at a frequency of about 5 GHz.

3. The radio frequency transmission line of claim 1 wherein the bonding layer includes gold and the barrier layer includes palladium.

4. The radio frequency transmission line of claim 3 wherein the bonding layer has a thickness in a range from 0.05 um to 0.15 um.

5. The radio frequency transmission line of claim 1 wherein the radio frequency signal has a frequency of at least 1.9 GHz.

6. A radio frequency module comprising:

a radio frequency transmission line including a bonding layer having a bonding surface, the bonding layer configured to receive a radio frequency signal; a barrier layer proximate the bonding layer; a diffusion barrier layer proximate the barrier layer, the diffusion barrier layer and the barrier layer configured to prevent contaminant from entering the bonding layer; and a conductive layer proximate to the diffusion barrier layer, the diffusion barrier layer including nickel and having a thickness of less than 0.3 um that allows the radio frequency signal to penetrate the diffusion barrier layer to the conductive layer;

a die including a radio frequency component configured to provide the radio frequency signal; and

a wire bond extending from the die to the bonding surface of the radio frequency transmission line, the bonding surface being electrically connected to the radio frequency component by way of the wire bond.

7. The radio frequency module of claim 6 wherein the bonding layer includes gold and the barrier line includes palladium.

8. The radio frequency module of claim 7 wherein the bonding layer has a thickness in a range from 0.05 um to 0.15 um.

9. The radio frequency module of claim 6 wherein the thickness of the diffusion barrier layer is in a range from 0.04 um and 0.2 um.

10. The radio frequency module of claim 6 wherein the radio frequency component includes a power amplifier.

11. The radio frequency module of claim 10 further comprising a matching network configured to receive the radio frequency signal from the power amplifier via the radio frequency transmission line.

12. The radio frequency module of claim 6 wherein the radio frequency signal has a frequency of at least 1.9 GHz.

13. The radio frequency module of claim 6 wherein the thickness of the diffusion barrier layer is less than the skin depth of the diffusion barrier layer at a frequency of 5 GHz.

14. A mobile device comprising:

a radio frequency transmission line including a bonding layer having a bonding surface, the bonding layer configured to receive a radio frequency signal; a barrier layer proximate the bonding layer; a diffusion barrier layer proximate the barrier layer, the diffusion barrier layer and the barrier layer configured to prevent contaminant from entering the bonding layer; and a conductive layer proximate to the diffusion barrier layer, the diffusion barrier layer including nickel and having a thickness of less than 0.3 um that allows the radio frequency signal to penetrate the diffusion barrier layer to the conductive layer;

a die including a radio frequency component;

a wire bond extending from the die to the bonding surface of the radio frequency transmission line, the bonding surface being electrically connected to the radio frequency component by way of the wire bond; and

an antenna coupled to the radio frequency transmission line, the antenna configured to transmit the radio frequency signal.

15. The mobile device of claim 14 wherein the radio frequency component is a power amplifier.

16. The radio frequency module of claim 15 further comprising a matching network configured to receive the radio frequency signal from the power amplifier via the radio frequency transmission line, the radio matching network being in a signal path between the radio frequency transmission line and the antenna.

17. The mobile device of claim 14 wherein the barrier layer is a palladium layer and the bonding layer is a gold layer.

18. The mobile device of claim 14 wherein the thickness of the diffusion barrier layer is in a range from 0.04 um and 0.2 um.

19. The mobile device of claim 14 wherein the thickness of the diffusion barrier layer is less than the skin depth of the diffusion barrier layer at a frequency of 5 GHz.

20. The mobile device of claim 14 wherein the radio frequency signal has a frequency of at least 1.9 GHz.