Semiconductor memory device
A semiconductor memory device includes an electrode structure including a plurality of electrode layers and a plurality of interlayer dielectric layers which are alternately stacked on a source plate defined with a cell area and a connection area in a first direction; a vertical channel passing through the electrode structure in the cell area; a hard mask pattern disposed on the electrode structure in the connection area, and having a plurality of opening holes; a plurality of contact holes defined in the electrode structure under the opening holes, and exposing pad areas of the electrode layers; and a slit dividing the hard mask pattern into units smaller than the electrode structure in the connection area.
1. A semiconductor memory device comprising:
an electrode structure including a plurality of electrode layers and a plurality of interlayer dielectric layers which are alternately stacked on a source plate defined with a cell area and a connection area in a first direction;
a vertical channel passing through the electrode structure in the cell area;
a hard mask pattern disposed on the electrode structure in the connection area, and having a plurality of opening holes;
a plurality of contact holes defined in the electrode structure under the opening holes, and exposing pad areas of the electrode layers; and
a slit dividing the hard mask pattern into units smaller than the electrode structure in the connection area.
2. The semiconductor memory device according to claim 1 , wherein the electrode structure has a line shape extending in a first direction, and one or more units of the hard mask pattern are arranged in the first direction.
3. The semiconductor memory device according to claim 2 , further comprising:
a bit line coupled to the vertical channel and disposed on the hard mask pattern,
wherein the bit line extends in a second direction, which intersects with the first direction to form a plane substantially parallel to a surface of the electrode structure or of the source plate.
4. The semiconductor memory device according to claim 3 , wherein one or more units of the hard mask pattern are formed by a slit with a line shape that extends in the second direction.
5. The semiconductor memory device according to claim 3 , wherein a width of the one or more units of the hard mask pattern, in the second direction, is the same as a width of the electrode structure in the second direction.
6. The semiconductor memory device according to claim 3 , further comprising:
separation patterns disposed on both sides of the electrode structure and the hard mask pattern in the second direction,
wherein the slit extends in the second direction between a pair of adjacent separation patterns.
7. The semiconductor memory device according to claim 1 , further comprising:
a discharge path coupled to the hard mask pattern.