IP Library › Granted Patent US 10,939,552
Granted Patent B2
US 10,939,552 · App. 16/887,585 · Granted Mar 2, 2021

Electronic device including interposer

Inventors: Jungsik Park (Suwon-si, KR); Soyoung Lee (Gwacheon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H05K1/144G06F1/1626G06F1/1635G06F1/1656G06F1/1658G06F1/1698G06F1/203G06F1/263H01Q1/526H01Q9/0407H01R12/53H04B1/3883H04M1/026H04M1/0262H04M1/0277H05K1/116H01Q1/243H01Q9/42H01Q21/065H05K1/0216H05K1/147H05K1/181H05K2201/042H05K2201/10037H05K2201/10098H05K2201/10189H05K2201/10371H05K2201/10378
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Quick Facts
Patent No.
US 10,939,552
App. No.
16/887,585
Granted
Mar 2, 2021
Kind
B2
Abstract

An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.

Claims (21)

1. A portable communication device comprising:

a first printed circuit board (PCB);

a second PCB disposed over or under the first PCB; and

an interposer disposed between the first PCB and the second PCB, the interposer comprising:

a first surface facing the first PCB,

a second surface facing the second PCB,

an insulating layer disposed between the first surface and the second surface,

a plurality of signal paths disposed through the insulating layer and electrically connected with the first PCB and the second PCB, the plurality of signal paths including a first signal path and a second signal path at least partially spaced apart from each other, and

a ground member disposed on the second surface, the ground member including a first ground portion and a second ground portion extended from the first ground portion, an end portion of the first signal path being exposed at the second surface surrounded by the first ground portion, an end portion of the second signal path being exposed at the second surface surrounded by the second ground portion,

wherein the interposer further comprises another ground member disposed on the second surface and electrically connected with the ground member via a bridge portion.

2. The portable communication device of claim 1 , wherein a width of the bridge portion is narrower than a width of the other ground member.

3. The portable communication device of claim 1 , wherein the other ground member comprises a substantially circular shape when viewed in a direction substantially perpendicular to the second surface.

4. The portable communication device of claim 1 , wherein the end portion of the first signal path or the end portion of the second signal path comprises a substantially circular shape when viewed in a direction substantially perpendicular to the second surface.

5. The portable communication device of claim 4 , wherein the substantially circular shape comprises a fully-filled shape without any empty area formed therein.

6. The portable communication device of claim 1 ,

wherein each of the first PCB and the second PCB includes a first surface and a second surface, the second surface of the first PCB and the first surface of the second PCB facing the interposer, and

wherein a first chip is mounted on the second surface of the first PCB, and a second chip is mounted on the second surface of the second PCB.

7. The portable communication device of claim 6 , wherein the first chip comprises an application processor (AP).

8. The portable communication device of claim 6 , wherein the second chip comprises a transceiver.

9. The portable communication device of claim 6 , wherein a third chip is mounted on the first surface of the first PCB.

10. The portable communication device of claim 9 , wherein the third chip comprises a communication processor (CP).

Priority Claims (1)
KR 10-2017-0116517 · Sep 12, 2017 · national
Continuity (2)
Continuation 16121085 · Sep 4, 2018
Related Publication 20200296833A1 · Sep 17, 2020