Sensor unit, temperature sensor including the same, method of manufacturing the sensor unit, and method of manufacturing the temperature sensor

1. An apparatus, comprising:

a temperature sensor including:

a sensor unit for temperature sensing having an electrical resistance that varies according to a temperature, the sensor unit positioned on a carrier substrate and comprising a base layer and an electric conductive layer, the base layer having surface hygroscopicity, and the electric conductive layer being on an external surface of the base layer, wherein the base layer comprises a paper-making material;

a pad unit electrically connected to opposite ends of the sensor unit, the pad unit usable by an external device to measure the electrical resistance of the sensor unit to determine the temperature; and

a cover unit positioned on the sensor unit and covering the sensor unit.

2. The apparatus of claim 1 , wherein the pad unit comprises a first pad and a second pad, the first pad being connected to one of the opposite ends of the sensor unit, and the second pad being connected to the other one of the opposite ends of the sensor unit;

wherein a width of the first and second pads in a first direction is substantially equal to a width of the electric conductive layer of the sensor unit in the first direction.

3. The apparatus of claim 1 , wherein the electric conductive layer comprises a conductive polymeric material.

4. The apparatus of claim 1 , wherein the electric conductive layer comprises one of silicon oxide (SiOx) and graphene oxide (GO).

5. The apparatus of claim 1 , wherein the external surface pf the base layer comprises a first surface of the base layer, wherein the base layer has a second surface opposite the first surface, wherein the sensor unit further comprises a coating layer, and wherein the coating layer is positioned on the second surface of the base layer.

6. The apparatus of claim 5 , wherein the pad unit is in direct contact with the electric conductive layer.

7. A method of manufacturing a sensor unit for temperature sensing, the method comprising:

preparing a base layer comprising a paper-making material, the base layer having surface hygroscopicity;

forming a conductive polymer solution comprising a conductive polymeric material;

forming an electric conductive layer on a surface of the base layer by soaking the base layer in the conductive polymer solution;

performing a heat treatment on the base layer having the electric conductive layer thereon to change a response characteristic of the conductive polymeric material; and

setting an initial electrical resistance of the sensor unit, the sensor unit with the initial electrical resistance usable to sense a temperature by measuring a change in electrical resistance of the sensor unit.

8. The method of claim 7 , wherein the forming of the conductive polymer solution comprises mixing and stirring the conductive polymeric material with a non-conductive material.

9. The method of claim 8 , wherein the non-conductive material comprises one of silicon oxide (SiOx) and graphene oxide (GO).

10. The method of claim 7 , wherein setting the initial resistance is controlled by a duration of the soak time and by cutting the base layer to selected dimensions.

11. The method of claim 7 , wherein the surface of the base layer comprises a first surface of the base layer, wherein the base layer comprises a second surface, and wherein the method further comprises forming a coating layer on the second surface of the base layer before the forming of the electric conductive layer.

12. The method of claim 8 , further comprising manufacturing a temperature sensor from the sensor unit, the manufacturing the temperature sensor comprising:

positioning the sensor unit on a carrier substrate;

forming a pad unit at opposite ends of the sensor unit, the pad unit being electrically connected to the sensor unit, the pad unit usable by an external device to measure the change in the electrical resistance of the sensor unit to determine the temperature; and

forming a cover unit on the sensor unit to cover the sensor unit.

13. The method of claim 12 , wherein the forming of the pad unit comprises forming a first pad and a second pad, the first pad being connected to one of the opposite ends of the sensor unit, and the second pad being connected to the other one of the opposite ends of the sensor unit;

wherein a width of the first and second pads in a first direction is substantially equal to a width of the sensor unit in the first direction.