Method of manufacturing semiconductor device
View Patent ↗A method of manufacturing a semiconductor device includes: forming a metal film containing Al on a surface of a substrate product including a substrate and a nitride semiconductor layer on the substrate, the metal film covering a via hole forming predetermined region, and the surface of the substrate product being located on the nitride semiconductor layer side, forming an etching mask having an opening for exposing the via hole forming predetermined region on a back surface of the substrate product, the back surface of the substrate product being located on the substrate side, and forming a via hole in the substrate product by reactive ion etching, the via hole reaching the surface from the back surface and exposing the metal film. In the forming of the via hole, a reaction gas containing fluorine is used during a period at least including a termination of etching.
1. A method of manufacturing a semiconductor device, comprising:
forming a metal film containing Al on a surface of a substrate product including a substrate and a nitride semiconductor layer on the substrate, the metal film covering a via hole forming predetermined region, and the surface of the substrate product being located on the nitride semiconductor layer side;
forming an etching mask having an opening for exposing the via hole forming predetermined region on a back surface of the substrate product, the back surface of the substrate product being located on the substrate side;
forming a via hole in the substrate product by reactive ion etching, the via hole reaching the surface from the back surface and exposing the metal film;
forming an etch stopper film containing aluminum fluoride and aluminum oxide on the exposed metal film; and
removing the etch stopper film on the exposed metal film,
wherein, in the forming the via hole, a reaction gas containing fluorine is used during a period at least including a termination of etching.
2. The method of manufacturing a semiconductor device according to claim 1 ,
wherein the substrate is a SiC substrate, and
wherein, in the forming the via hole, at least a portion of the SiC substrate in the via hole forming predetermined region is etched using the reaction gas containing fluorine.
3. The method of manufacturing a semiconductor device according to claim 1 ,
wherein the etching mask contains at least one of Ni and Cu.
4. The method of manufacturing a semiconductor device according to claim 1 ,
wherein the reaction gas containing fluorine is a mixed gas of SF 6 and O 2 .
5. The method of manufacturing a semiconductor device according to claim 1 ,
wherein, in the forming the via hole, the nitride semiconductor layer in the via hole forming predetermined region is etched using the reaction gas containing fluorine.
6. The method of manufacturing a semiconductor device according to claim 1 ,
wherein, in the forming the via hole, a portion of the nitride semiconductor layer in the via hole forming predetermined region is etched using a reaction gas containing chlorine, and the remaining portion of the nitride semiconductor layer in the via hole forming predetermined region is then etched using the reaction gas containing fluorine.
7. The method of manufacturing a semiconductor device according to claim 1 , further comprising:
after the forming the via hole, exposing the metal film exposed in the via hole to plasma containing an inert gas.
8. The method of manufacturing a semiconductor device according to claim 7 , wherein the inert gas includes argon gas.
9. The method of manufacturing a semiconductor device according to claim 1 , wherein the forming the metal film includes:
forming a first layer made of Ti or Ta on the surface of the substrate product;
forming a second layer made of Al on the first layer; and
alloying the first layer and the second layer.