Electronic device including printed circuit board

1. An electronic device comprising:

a housing comprising:

a first surface,

a second surface facing the first surface, and

a side surface surrounding a space between the first and second surfaces;

a printed circuit board (PCB) disposed inside the housing and including at least one antenna; and

a communication circuit disposed inside the PCB or between the PCB and the housing,

wherein the PCB comprises:

a first substrate,

a second substrate facing the first substrate, and

a spacer disposed between the first and second substrates, the spacer including an opening extending from the first substrate to the second substrate, a side surface of the spacer being plated or surrounded by a conductive material,

wherein each of the at least one antenna comprises:

a first conductive member formed on the first substrate,

a second conductive member formed on the second substrate and facing the first conductive member through the opening, and

a feeder connecting the second conductive member to the communication circuit, and

wherein the communication circuit is configured to:

feed the feeder, and

transmit and receive a signal of a specified frequency band through an electrical path formed through the feeder and through the second conductive member.

2. The electronic device of claim 1 , further comprising a dielectric material disposed in a space between the second conductive member and the first conductive member.

3. The electronic device of claim 1 , wherein each of the at least one antenna further comprises a plurality of vias surrounding the opening.

4. The electronic device of claim 3 ,

wherein the at least one antenna comprises a first antenna and a second antenna, and

wherein the plurality of vias block interference between the first antenna and the second antenna.

5. The electronic device of claim 4 , wherein the first antenna and the second antenna are configured to transmit or receive signals of mutually different frequency bands.

6. The electronic device of claim 1 , wherein the first conductive member and the second conductive member are formed of a type of conductive material.

7. The electronic device of claim 1 ,

wherein the first conductive member is spaced a specified distance from the spacer, and

wherein the spacer is spaced the specified distance from the second conductive member.

8. The electronic device of claim 1 ,

wherein the first substrate and the spacer adhere to each other by an adhesive material, and

wherein the spacer and the second substrate adhere to each other by the adhesive material.

9. The electronic device of claim 1 ,

wherein the spacer comprises a plurality of non-conductive layers, and

wherein conductive layers are disposed between the plurality of non-conductive layers, respectively.

10. The electronic device of claim 1 ,

wherein the PCB is disposed between the second conductive member and the spacer, and

wherein the PCB further comprises a non-conductive material surrounding the second conductive member.

11. An electronic device comprising:

a housing comprising:

a first surface,

a second surface facing the first surface, and

a side surface surrounding a space between the first and second surfaces; and

a printed circuit board (PCB) disposed inside the housing or attached to the first surface,

wherein the PCB comprises:

at least one antenna, and

a wireless communication circuit electrically connected to each of the at least one antenna,

wherein each of the at least one antenna comprises:

a first conductive member disposed in a first region,

a second conductive member disposed in a second region facing the first region, and

a feeder electrically connecting the second conductive member to the wireless communication circuit,

wherein the wireless communication circuit is configured to:

feed the feeder, and

transmit and receive a signal of a specified frequency band through an electrical path formed through the feeder and through the second conductive member, and

wherein the PCB further comprises a spacer disposed between the first conductive member and the second conductive member, the spacer including an opening extending from the first conductive member to the second conductive member, a side surface of the spacer being plated or surrounded by a conductive material.

12. The electronic device of claim 11 ,

wherein the spacer configured to space the first and second regions apart from each other, and

wherein the first conductive member and the second conductive member face each other through the opening of the spacer.

13. The electronic device of claim 12 , wherein each of the at least one antenna further comprises a plurality of vias surrounding the opening.

14. The electronic device of claim 12 ,

wherein the PCB further comprises a first substrate and a second substrate facing the first substrate,

wherein the spacer is disposed between the first and second substrates,

wherein the first region includes at least a part of the first substrate, and

wherein the second region includes at least a part of the second substrate.

15. The electronic device of claim 1 , wherein the communication circuit is further configured to, in response to a current being fed, transmit and receive the signal of the specified frequency band based on the electrical path formed through the feeder and through the second conductive member.