High throughput vacuum deposition sources and system
A high throughput deposition apparatus includes a process chamber, a plurality of targets that form a first closed loop in the process chamber, wherein the first closed loop includes a long dimension defined by at least a first pair of targets and a short dimension defined by at least a second pair of targets, a first substrate carrier assembly that can hold one or more substrates and configured to receive a deposition material from the plurality of targets in the first closed loop, and a transport mechanism that can move the first substrate carrier assembly along an axial direction through the first closed loop in the first process chamber.
1. A high throughput deposition apparatus, comprising:
a process chamber;
a plurality of targets that form a first closed loop in the process chamber, wherein the first closed loop includes a long dimension defined by at least a first pair of targets and a short dimension defined by at least a second pair of targets;
a plurality of magnets positioned surrounding and concentric with the first closed loop of the plurality of targets;
a first substrate carrier assembly configured to hold one or more substrates and configured to receive a deposition material from the plurality of targets in the first closed loop; and
a transport mechanism configured to move the first substrate carrier assembly along an axial direction through the first closed loop in the first process chamber.
2. The high throughput deposition apparatus of claim 1 , wherein the targets have tapered shape along an edge along the first closed loop.
3. The high throughput deposition apparatus of claim 1 , wherein the one or more of substrates have one or more planar deposition surfaces configured to receive the deposition material, wherein the one or more planar deposition surfaces are parallel to the long dimension of the first closed loop.
4. The high throughput deposition apparatus of claim 1 , wherein the first substrate carrier assembly comprises:
a plurality of clamps; and
a pair of substrates that are clamped back-to-back by the plurality of clamps, wherein the pair of substrates comprise opposing surfaces configured to receive the deposition material from the plurality of targets in the first closed loop.
5. The high throughput deposition apparatus of claim 1 , wherein the first substrate carrier assembly comprises:
a heater plate configured to heat the one or more substrates.
6. The high throughput deposition apparatus of claim 1 , wherein the first substrate carrier assembly comprises:
a first substrate comprising opposing surfaces configured to receive the deposition material from the plurality of targets in the first closed loop.
7. The high throughput deposition apparatus of claim 1 , wherein the transport mechanism includes:
wheels mounted under the first substrate carrier assembly and configured to roll the first substrate carrier assembly along the axial direction.
8. The high throughput deposition apparatus of claim 7 , wherein the first substrate carrier assembly further comprises a cushion material under the one or more of substrates and over the wheels.
9. The high throughput deposition apparatus of claim 1 , wherein the first closed loop defines a plane that is perpendicular to the axial direction.
10. The high throughput deposition apparatus of claim 1 , further comprising:
a plurality of targets that form a second closed loop in the process chamber, wherein the second closed loop includes a long dimension defined by at least a third pair of targets and a short dimension defined by at least a fourth pair of targets; and
a second substrate carrier assembly configured to hold a single or a plurality of substrates and configured to receive a deposition material from the plurality of targets in the first closed loop,
wherein the transport mechanism is configured to move the second substrate carrier assembly along the axial direction through the second closed loop in the first process chamber.
11. The high throughput deposition apparatus of claim 10 , wherein the second substrate carrier assembly comprises:
a plurality of clamps; and
a pair of substrates that are clamped back-to-back to by the plurality of clamps.
12. The high throughput deposition apparatus of claim 1 , further comprising:
a cluster of deposition shields mounted on a shaft positioned adjacent to the plurality of targets in the first closed loop in the process chamber, wherein only a subset of the deposition shields in the cluster is exposed to deposition material from the plurality of targets in the first closed loop; and
a rotation mechanism configured to rotate the shaft to allow different one of deposition shields in the cluster to block a portion of the deposition material from the plurality of targets.
13. The high throughput deposition apparatus of claim 1 , further comprising:
a plurality of magnets that form a third closed loop in the process chamber,
wherein the third closed loop of the plurality of magnets is positioned surrounding the first closed loop formed by a plurality of targets.
14. The high throughput deposition apparatus of claim 1 , further comprising:
a backing plate as part of a deposition source comprising the plurality of targets;
at least one elastic seal between the backing plate and the plurality of targets; and
a channel between the plurality of targets and the backing plate, the channel configured to transport gas to cool the plurality of targets.
15. The high throughput deposition apparatus of claim 1 , wherein the first closed loop includes six or more targets in the first closed loop, wherein at least two adjacent targets in the first loop joint an angle higher than 90 degrees.
16. The high throughput deposition apparatus of claim 15 , wherein the first closed loop includes eight targets that form an octagon in the first closed loop.