Electronic module including an ambient light sensor stacked over a proximity sensor

1. An electronic module, comprising:

an ambient light sensor comprising an ambient light photodetector; and

a proximity sensor comprising an infrared photoemitter configured to emit infrared photons, a reference infrared photodetector configured to directly receive infrared photons emitted by the infrared photoemitter and another infrared photodetector configured to indirectly receive infrared photons emitted by the infrared photoemitter and reflected from an object;

wherein the ambient light sensor is arranged in a stack over the proximity sensor at a position which allows infrared photons transmitted by the infrared photoemitter to be directly received by the reference infrared photodetector.

2. The electronic module of claim 1 , wherein the stack arrangement of the ambient light sensor over the reference infrared photodetector serves to reduce ambient light photons from being received by the reference infrared photodetector.

3. The electronic module according to claim 1 , further comprising a light guide arranged in the stack between the ambient light sensor and the proximity sensor to convey infrared photons transmitted by the infrared photoemitter toward the reference infrared photodetector.

4. The electronic module according to claim 3 , further comprising an interposer arranged in the stack between the ambient light sensor and the proximity sensor and extending over the light guide.

5. The electronic module according to claim 4 , wherein the interposer comprises one or more electrical connectors connected to one or more electrical connectors of the ambient light sensor, one or more electrical connectors of the proximity sensor and/or one or more electrical connectors of a substrate.

6. The electronic module according to claim 4 , wherein the interposer comprises an aperture in the optical path of the infrared photoemitter to allow infrared photons transmitted by the infrared photoemitter out of the electronic module.

7. The electronic module according to claim 1 , further comprising a light guide configured to convey infrared photons transmitted by the infrared photoemitter toward the reference infrared photodetector and an interposer arranged in the stack between the ambient light sensor and the proximity sensor and positioned beside the light guide.

8. The electronic module according to claim 7 , wherein the interposer comprises one or more electrical connectors connected to one or more electrical connectors of the ambient light sensor, one or more electrical connectors of the proximity sensor and/or one or more electrical connectors of a substrate.

9. The electronic module according to claim 7 , wherein the interposer comprises an aperture in the optical path of the infrared photoemitter to allow infrared photons transmitted by the infrared photoemitter out of the electronic module.

10. The electronic module according to claim 1 , further comprising an ambient light filter in the optical path of the another infrared photodetector to reduce ambient light photons received by the another infrared photodetector.

11. The electronic module according to claim 1 , further comprising a package covering at least the infrared photoemitter and the another infrared photodetector of the proximity sensor.

12. The electronic module according to claim 11 , wherein the package comprises a window arranged in the optical path of the infrared photoemitter to allow infrared photons transmitted by the infrared photoemitter out of the electronic module.

13. The electronic module according to claim 11 , wherein the package covers the ambient light sensor and comprises a window arranged in the optical path of an ambient light photodetector to allow ambient light photons in the electronic module.

14. The electronic module according to claim 11 , wherein the package comprises an opening arranged to expose a front side of the ambient light sensor.

15. The electronic module according to claim 11 , wherein the package comprises a wall delimiting:

a first cavity comprising the ambient light sensor, the infrared photoemitter and the reference infrared photodetector of the proximity sensor; and

a second cavity comprising the another infrared photodetector of the proximity sensor.

16. An electronic module, comprising:

a support substrate having a top surface;

a first integrated circuit die mounted to the top surface of the support substrate, the first integrated circuit die including an infrared photoemitter;

a second integrated circuit die mounted to the top surface of the support substrate, the second integrated circuit die including a reference infrared photodetector and another infrared photodetector;

a third integrated circuit die including an ambient light sensing photodetector;

wherein the third integrated circuit die is mounted in a stacked arrangement over the reference infrared photodetector of the second integrated circuit die to: a) permit infrared photons emitted from the infrared photoemitter to directly reach the reference infrared photodetector and b) block ambient light from reaching the reference infrared photodetector.

17. The electronic module of claim 16 , further comprising a light guide in the stacked arrangement positioned between the second and third integrated circuit dies to convey infrared photons from the infrared photoemitter toward the reference infrared photodetector.

18. The electronic module according to claim 17 , further comprising an interposer in the stacked arrangement positioned between the second and third integrated circuit dies and extending over the light guide.

19. The electronic module according to claim 18 , wherein the interposer comprises electrical connectors configured for making electrical connections to electrical connectors of the third integrated circuit die, electrical connectors of the second integrated circuit die and electrical connectors of the support substrate.

20. The electronic module according to claim 18 , wherein the interposer comprises an aperture through which infrared photons emitted by the infrared photoemitter pass.

21. The electronic module according to claim 17 , further comprising an interposer in the stacked arrangement positioned between the second and third integrated circuit dies and beside the light guide.

22. The electronic module according to claim 21 , wherein the interposer comprises electrical connectors configured for making electrical connections to electrical connectors of the third integrated circuit die, electrical connectors of the second integrated circuit die and electrical connectors of the support substrate.

23. The electronic module according to claim 21 , wherein the interposer comprises an aperture through which infrared photons emitted by the infrared photoemitter pass.

24. The electronic module according to claim 16 , further comprising a package mounted to the support substrate and covering the first, second and third integrated circuit dies, said package including a first window arranged in the optical path of the infrared photoemitter and a second window arranged in the optical path of the ambient light sensing photodetector.