IP Library › Granted Patent US 10,957,984
Granted Patent B2
US 10,957,984 · App. 16/185,322 · Granted Mar 23, 2021

Wireless communication device

Inventor: Noboru Kato (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01Q9/42G06K19/07773H01Q1/2225H01Q1/36H01Q1/48H01Q5/321H01Q7/00H01Q9/065H01Q23/00H01Q25/005
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Quick Facts
Patent No.
US 10,957,984
App. No.
16/185,322
Granted
Mar 23, 2021
Kind
B2
Abstract

A wireless communication device for transmitting/receiving a high-frequency signal having a predetermined communication frequency. The wireless communication device includes an antenna pattern having an inductance component, an RFIC element connected electrically to the antenna pattern and a capacitive coupling portion capacitively coupling specific confronting regions facing each other of the antenna pattern at multiple points on the antenna pattern, to make up an LC parallel resonant circuit.

Claims (39)

1. A wireless communication device for transmitting/receiving a high-frequency signal having a predetermined communication frequency, the wireless communication device comprising:

an antenna pattern having an inductance component;

an RFIC element connected electrically to the antenna pattern; and

a capacitance pattern configured to capacitively couple confronting regions at a plurality of points of the antenna pattern that face each other, such that the capacitance pattern and confronting regions of the antenna pattern form an LC parallel resonant circuit,

wherein the LC parallel resonant circuit uses a resonant frequency that is higher than the predetermined communication frequency.

2. The wireless communication device of claim 1 ,

wherein the antenna pattern comprises a meandering shape having a plurality of turn portions, and

wherein the capacitance pattern is configured to capacitively couple adjacent turn portions of the antenna pattern, respectively.

3. The wireless communication device of claim 1 ,

wherein the antenna pattern is disposed on a first surface of an antenna substrate comprises a dielectric, and

wherein the capacitance pattern is disposed on a second other surface of the antenna substrate that opposes the first surface.

4. The wireless communication device of claim 1 ,

wherein the antenna pattern and the capacitance pattern are disposed on a first surface of an antenna substrate, and

wherein the capacitance pattern comprises a conductor plate disposed between the respective confronting portions of the antenna pattern that face each other.

5. The wireless communication device of claim 4 , wherein the antenna pattern and the capacitance pattern are laminated via a dielectric on the first surface of the antenna substrate.

6. The wireless communication device of claim 1 , wherein the LC parallel resonant circuit comprises a line length that is shorter than ½ wavelength of the predetermined communication frequency.

7. The wireless communication device of claim 6 , wherein the line length of the LC parallel resonant circuit is shorter than ½ wavelength of a frequency used in electromagnetic wave heating.

8. The wireless communication device of claim 1 , wherein the resonant frequency of the LC parallel resonant circuit is a frequency used in electromagnetic wave heating.

9. The wireless communication device of claim 1 , wherein the resonant frequency of the LC parallel resonant circuit is a frequency of a band of 2.4 to 2.5 GHz that is a frequency band used in electromagnetic wave heating.

10. The wireless communication device of claim 1 , wherein the antenna pattern has a line width that is narrower than a line width of the capacitance pattern.

11. The wireless communication device of claim 1 ,

wherein the antenna pattern comprises a meandering shape having a plurality of turn portions, and

wherein, in an amplitude direction of the meandering shape, a length of the antenna pattern is longer than a length of the capacitance pattern.

12. The wireless communication device of claim 1 , further comprising a resin antenna substrate with the antenna pattern formed thereon.

13. The wireless communication device of claim 12 , further comprising a film disposed on the resin antenna substrate, wherein the film has a heat resistance higher than that of the resin antenna substrate.

14. The wireless communication device of claim 1 , wherein the antenna pattern is configured from a dipole antenna having two dipole elements, and the capacitance pattern is disposed on each of the two dipole elements.

15. A wireless communication device for transmitting/receiving a high-frequency signal having a predetermined communication frequency, the wireless communication device comprising:

an antenna pattern having an inductance component;

an RFIC element connected electrically to the antenna pattern; and

a capacitance pattern configured to capacitively couple confronting regions at a plurality of points of the antenna pattern that face each other, such that the capacitance pattern and the confronting regions of the antenna pattern form an LC parallel resonant circuit,

wherein the antenna pattern comprises a current path with a least a portion thereof that forms the LC parallel resonant circuit being slimmer than other portions on the current path that do not form the LC parallel resonant circuit.

16. A wireless communication device for transmitting/receiving a high-frequency signal having a predetermined communication frequency, the wireless communication device comprising:

an antenna pattern having an inductance component;

an RFIC element connected electrically to the antenna pattern; and

a capacitance pattern configured to capacitively couple confronting regions at a plurality of points of the antenna pattern that face each other, such that the capacitance pattern and the confronting regions of the antenna pattern form an LC parallel resonant circuit,

wherein the antenna pattern comprises a current path with a least a portion thereof that forms the LC parallel resonant circuit being thinner than other portions on the current path that do not form the LC parallel resonant circuit.

17. The wireless communication device of claim 1 , wherein the antenna pattern is configured for data communication using a communication frequency in a UHF band.

18. The wireless communication device of claim 1 , wherein the antenna pattern is configured for data communication using a communication frequency in an HF band.

19. The wireless communication device of claim 1 , wherein the antenna pattern comprises a resonant frequency in the absence of the capacitance pattern that is higher than the communication frequency.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2018
From: KATO, NOBORU
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 047460/0634 →
Priority Claims (3)
JP JP2017-083957 · Apr 20, 2017 · national
JP JP2017-203663 · Oct 20, 2017 · national
JP JP2018-009946 · Jan 24, 2018 · national
Continuity (2)
Continuation PCTJP2018016363 · Apr 20, 2018
Related Publication 20190081402A1 · Mar 14, 2019