Element chip manufacturing method
An element chip manufacturing method including: a preparing step of preparing a first conveying carrier including a holding sheet and a frame, and a substrate held on the holding sheet, the holding sheet having a first surface and a second surface opposite the first surface, the frame attached to at least part of a peripheral edge of the holding sheet; a placing step of placing the first conveying carrier holding the substrate, on a second conveying carrier; a preprocessing step of preprocessing the substrate, after the placing step; a removing step of removing the second conveying carrier, after the preprocessing step; and a dicing step of subjecting the substrate held on the first conveying carrier to plasma exposure, after the removing step, to form a plurality of element chips from the substrate.
1. An element chip manufacturing method comprising:
a preparing step of preparing a first conveying carrier including a holding sheet and a frame, and a substrate held on the holding sheet, the holding sheet having a first surface and a second surface opposite the first surface, the frame attached to at least part of a peripheral edge of the holding sheet;
a placing step of placing the first conveying carrier holding the substrate, on a second conveying carrier, the second conveying carrier being able to be conveyed together with the first conveying carrier;
a preprocessing step of preprocessing the substrate, after the placing step;
a removing step of removing the second conveying carrier, after the preprocessing step; and
a dicing step of subjecting the substrate held on the first conveying carrier to plasma exposure, after the removing step, to form a plurality of element chips from the substrate.
2. The element chip manufacturing method of claim 1 , wherein
the substrate is provided with a plurality of element regions, and a dicing region defining the element regions, and has a third surface not facing the first surface of the holding sheet, and a fourth surface opposite the third surface, and
the preprocessing step includes at least one of:
a coating step of coating the third surface of the substrate held on the holding sheet with a raw material of a protective film,
a curing step of curing the raw material, to form the protective film on the third surface, and
a patterning step of forming an aperture in the protective film, to expose the substrate along the dicing region.
3. The element chip manufacturing method of claim 1 , wherein the second conveying carrier supports the substrate, with the holding sheet interposed between the second conveying carrier and the substrate.
4. The element chip manufacturing method of claim 3 , wherein a portion of the second conveying carrier, the portion being in contact with the holding sheet, has a rough surface.
5. The element chip manufacturing method of claim 3 , wherein a portion of the second conveying carrier, the portion being in contact with the holding sheet, has electrical conductivity.
6. The element chip manufacturing method of claim 1 , wherein the second conveying carrier is an annular body, and supports the frame.
7. The element chip manufacturing method of claim 1 , wherein the second conveying carrier has a first portion rising so as to surround a circumference of the frame.