IP Library › Granted Patent US 10,964,689
Granted Patent B2
US 10,964,689 · App. 15/705,026 · Granted Mar 30, 2021

Semiconductor structure

Inventors: Jui-Fa Lu (Tainan, TW); Chien-Nan Lin (Hsinchu, TW); Ching-Hua Yeh (Tainan, TW)
Assignee: UNITED MICROELECTRONICS CORP.
H01L27/0629G06F30/39G06F30/392H01L23/528H01L23/5228H01L23/53257H01L28/20H01L29/0649H01L29/4966H01L29/66545G06F2119/18
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Quick Facts
Patent No.
US 10,964,689
App. No.
15/705,026
Granted
Mar 30, 2021
Kind
B2
Abstract

A semiconductor structure including a substrate, dummy conductive structures, and resistor elements is provided. The substrate includes a resistor region and has isolation structures and dummy support patterns located in the resistor region. Each of the isolation structures is located between two adjacent dummy support patterns. Each of the dummy conductive structures is disposed on each of the isolation structures and equidistant from the dummy support patterns on both sides. The resistor elements are disposed above the dummy conductive structures and aligned with the dummy conductive structures.

Claims (21)

1. A semiconductor structure, comprising:

a substrate comprising a resistor region and a dense region and having isolation structures and dummy support patterns located in the resistor region, wherein each of the isolation structures is located between two adjacent dummy support patterns;

dummy conductive structures, wherein each of the dummy conductive structures is disposed on each of the isolation structures and equidistant from the dummy support patterns on both sides;

resistor elements disposed above the dummy conductive structures and aligned with the dummy conductive structures, wherein the resistor elements are separated from the dummy conductive structures, and a width of each of the resistor elements is equal to a width of each of the dummy conductive structures; and

at least one conductive structure disposed on the substrate in the dense region, wherein the at least one conductive structure in the dense region and the dummy conductive structures in the resistor region have the same width.

2. The semiconductor structure of claim 1 , wherein the dummy support patterns are a portion of the substrate.

3. The semiconductor structure of claim 1 , wherein a width of a top portion of each of the dummy support patterns is less than a distance between two adjacent dummy conductive structures.

4. The semiconductor structure of claim 1 , wherein each of the dummy support patterns is located at a central location between two adjacent dummy conductive structures.

5. The semiconductor structure of claim 1 , wherein a width of a top portion of each of the isolation structures is greater than the width of each of the dummy conductive structures.

6. The semiconductor structure of claim 1 , wherein the dummy conductive structures comprise dummy metal gate structures or dummy contacts.

7. The semiconductor structure of claim 1 , wherein each of the dummy conductive structures is located at a central location of each of the isolation structures.

8. The semiconductor structure of claim 1 , wherein the dense region is located at one side or two sides of the resistor region.

9. The semiconductor structure of claim 8 , wherein the isolation structures are further disposed in the substrate in the dense region.

10. The semiconductor structure of claim 9 , further comprising at least one active region located between two adjacent isolation structures in the dense region.

11. The semiconductor structure of claim 9 , wherein the at least one conductive structure is disposed between two adjacent isolation structures.

12. The semiconductor structure of claim 11 , wherein the at least one conductive structure comprises a metal gate structure.

13. The semiconductor structure of claim 1 , wherein the resistor elements comprise high-resistance resistors.

14. The semiconductor structure of claim 1 , wherein the resistor region has no contact disposed in a dielectric layer.

15. The semiconductor structure of claim 1 , wherein the resistor elements are embedded and suspended within a dielectric layer.

16. The semiconductor structure of claim 1 , wherein an empty area and one of the dummy support patterns are disposed between adjacent dummy conductive structures configured along an extending direction of the dummy conductive structures, respectively.

17. The semiconductor structure of claim 1 , wherein the resistor region has no contact disposed in a dielectric layer, and the resistor elements are embedded and suspended within the dielectric layer.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S DATA PREVIOUSLY RECORDED ON REEL 043595 FRAME 0052. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 7, 2017
From: LU, JUI-FA; LIN, CHIEN-NAN; YEH, CHING-HUA
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 044810/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2017
From: LU, JUI-FA; LIN, CHIEN-NAN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 043595/0052 →
Priority Claims (1)
CN 201710706341.4 · Aug 17, 2017 · national
Continuity (1)
Related Publication 20190057962A1 · Feb 21, 2019
Cited By (1)
US 12,513,918