IP Library › Granted Patent US 10,964,780
Granted Patent B2
US 10,964,780 · App. 16/516,272 · Granted Mar 30, 2021

Semiconductor device

Inventors: Kenichi Furuta (Miyazaki, JP); Toshifumi Kobe (Miyazaki, JP); Toshiyuki Orita (Miyazaki, JP); Tsuyoshi Inoue (Miyazaki, JP); Tomoko Yonekura (Miyazaki, JP); Masahiro Haraguchi (Miyazaki, JP); Yoshinobu Takeshita (Miyazaki, JP); Kiyofumi Kondo (Miyazaki, JP)
Assignee: LAPIS Semiconductor Co., Ltd.
H01L29/0623H01L29/0619H01L29/0661H01L29/0692H01L29/402
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Quick Facts
Patent No.
US 10,964,780
App. No.
16/516,272
Granted
Mar 30, 2021
Kind
B2
Abstract

The semiconductor device includes a semiconductor substrate of first conductivity type including a cell area and a peripheral area surrounding cell area on a principal surface thereof, a first diffusion layer which is disposed in peripheral area, surrounds the cell area and has a second conductivity type different from the first conductivity type, an electrode which is disposed in the peripheral area, is in contact with the principal surface through an opening provided in an insulating member and is connected to the first diffusion layer, and a second diffusion layer of the first conductivity type which is formed on the principal surface of a region enclosed in the electrode distant from the first diffusion layer when viewed in a direction perpendicular to the principal surface and includes a linear portion having a first width and a curved portion having a portion with a second width greater than the first width.

Claims (21)

1. A semiconductor device, comprising:

a semiconductor substrate of a first conductivity type comprising a cell area and a peripheral area surrounding the cell area on a principal surface thereof;

a first diffusion layer which is disposed in the peripheral area, surrounds the cell area and has a second conductivity type different from the first conductivity type;

an electrode which is disposed in the peripheral area, is in contact with the principal surface through an opening provided in an insulating member and is connected to the first diffusion layer; and

a second diffusion layer of the first conductivity type which is formed on the principal surface of a region enclosed in the electrode distant from the first diffusion layer when viewed in a direction perpendicular to the principal surface and comprises a linear portion having a first width and a curved portion having a portion with a second width greater than the first width,

wherein an impurity concentration of the second diffusion layer is higher than an impurity concentration of the semiconductor substrate.

2. The semiconductor device according to claim 1 , wherein the electrode is disposed to surround the cell area.

3. The semiconductor device according to claim 2 , wherein the second diffusion layer is disposed to surround the first diffusion layer.

4. The semiconductor device according to claim 2 , wherein the linear portion has a first impurity concentration and the curved portion has a second impurity concentration lower than the first impurity concentration.

5. The semiconductor device according to claim 1 , wherein the second diffusion layer is disposed to surround the first diffusion layer.

6. The semiconductor device according to claim 5 , wherein the linear portion has a first impurity concentration and the curved portion has a second impurity concentration lower than the first impurity concentration.

7. The semiconductor device according to claim 1 , wherein the linear portion has a first impurity concentration and the curved portion has a second impurity concentration lower than the first impurity concentration.

8. A semiconductor device, comprising:

a semiconductor substrate of a first conductivity type comprising a cell area and a peripheral area surrounding the cell area on a principal surface thereof;

a first diffusion layer which is disposed in the peripheral area, surrounds the cell area and has a second conductivity type different from the first conductivity type;

an electrode which is disposed in the peripheral area, is in contact with the principal surface through an opening provided in an insulating member and is connected to the first diffusion layer; and

a second diffusion layer of the first conductivity type which is formed on the principal surface of a region enclosed in the electrode distant from the first diffusion layer when viewed in a direction perpendicular to the principal surface and comprises a linear portion having a first impurity concentration and a curved portion having a portion with a second impurity concentration lower than the first impurity concentration,

wherein an impurity concentration of the second diffusion layer is higher than an impurity concentration of the semiconductor substrate.

9. The semiconductor device according to claim 8 , wherein the electrode is disposed to surround the cell area.

10. The semiconductor device according to claim 9 , wherein the second diffusion layer is disposed to surround the first diffusion layer.

11. The semiconductor device according to claim 8 , wherein the second diffusion layer is disposed to surround the first diffusion layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2019
From: FURUTA, KENICHI; KOBE, TOSHIFUMI; ORITA, TOSHIYUKI; INOUE, TSUYOSHI; YONEKURA, TOMOKO; HARAGUCHI, MASAHIRO; TAKESHITA, YOSHINOBU; KONDO, KIYOFUMI
To: LAPIS SEMICONDUCTOR CO., LTD
Reel/Frame 049825/0019 →
Priority Claims (1)
JP JP2018-140560 · Jul 26, 2018 · national
Continuity (1)
Related Publication 20200035783A1 · Jan 30, 2020
Cited By (1)
US 12,713,647