Cover for an electronic circuit package

1. A cover for an electronic circuit package, comprising:

a body having first and second surfaces and first and second through openings extending between the first and second surfaces, wherein the first and second through openings include first and second recesses, respectively, formed by respective walls in the first and second through openings;

a first element located in the first through opening and having a surface exposed at the first surface of the body, the first element having lateral sides spaced apart from the first recess;

a second element located in the second through opening and having a surface exposed at the first surface of the body, the second element having lateral sides spaced apart from the second recess; and

adhesive material bonding the lateral sides of the first and second elements to the respective walls of the body in the first and second through openings, respectively, wherein the adhesive material fills the first and second recesses and abuts the lateral sides of the first and second elements, respectively.

2. The cover of claim 1 , wherein the first element is one of: a transparent material, a filter, or a lens.

3. The cover of claim 1 , wherein the first and second through openings are wider at the second surface than at the first surface.

4. The cover of claim 1 , wherein the surface of the first element is coplanar with the first surface of the body.

5. The cover of claim 1 , wherein the adhesive material is glue or molding material.

6. The cover of claim 1 , wherein the adhesive material is bonded to walls of the first element and the second element and is a layer covering the second surface of the body.

7. The cover of claim 6 , wherein the adhesive material is a molding material.

8. The cover of claim 1 , comprising adhesive material covering the second surface of the body.

9. An electronic optical transmit and receive circuit, comprising:

a substrate;

a semiconductor chip coupled to the substrate; and

a cover coupled to the substrate and enclosing the semiconductor chip, the cover including:

a body having first and second surfaces, first and second through openings extending through the body from the first surface to the second surface, wherein the first and second through openings include respective first and second recesses formed by respective first and second shoulders in the respective first and second through openings;

a first optical element located in the first through opening and a second optical element located in the second through opening, wherein lateral sides of the first and second optical elements are spaced apart from the respective first and second recesses; and

wherein lateral sides of the first and second optical elements abut adhesive material that bonds the first and second optical elements to walls of the body.

10. The electronic optical transmit and receive circuit of claim 9 , wherein the first and second optical elements have first and second surfaces, respectively, wherein the first and second surfaces of the first and second optical elements are coplanar with the first and second surfaces of the body, respectively.

11. The electronic optical transmit and receive circuit of claim 9 , wherein the first surface of the body is non-planar, wherein the body is coupled to the substrate by adhesive.

12. The electronic optical transmit and receive circuit of claim 9 , wherein the adhesive material is glue or molding material.

13. The electronic optical transmit and receive circuit of claim 9 , wherein the body includes a first planar layer and a second layer, the second layer having a curved surface.

14. A method comprising:

forming a body with first and second through openings, the first and second through openings including respective shoulders formed by the body that form first and second recesses, respectively;

arranging the body on an adhesive support;

arranging first and second optical elements on the adhesive support and in the first and second through openings such that lateral sides of the first and second optical elements are spaced apart from the first and second recesses; and

using an adhesive material, filling the first and second recesses and coupling the first and second optical elements to the body.

15. The method of claim 14 , wherein the adhesive material is a molding material that is molded to side surfaces of the optical element and to a surface of the body.

16. The method of claim 14 , wherein coupling the optical element to the body comprises depositing adhesive material along side surfaces of the optical element and hardening the adhesive material.