Electronic component having an external electrode with a conductive resin layer
An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the third direction is smaller than a length of the conductive resin layer in the first direction.
1. An electronic component, comprising:
an element body of a rectangular parallelepiped shape including a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction; and
two external electrodes respectively disposed at both end portions of the element body in the third direction, one of the external electrodes including:
a conductive resin layer continuously covering one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces; and
a sintered metal layer disposed on the end portion of the element body to be positioned between the element body and the conductive resin layer, the sintered metal layer including an exposed region exposed from the conductive resin layer and a covered region covered with the conductive resin layer, the covered region being closer to the first principal surface than is the exposed region,
wherein for the one external electrode:
the conductive resin layer is disposed on the sintered metal layer and on the one part of the first principal surface, and includes a portion positioned on the first principal surface,
the portion positioned on the first principal surface includes a maximum thickness position,
a first length of the conductive resin layer in the third direction is smaller than a second length of the conductive resin layer in the first direction,
a third length from the maximum thickness position to an end edge of the conductive resin layer, in the third direction is larger than a fourth length from the maximum thickness position to an end edge of the sintered metal layer, in the third direction, and
the end edge of the sintered metal layer on the first principal surface is positioned closer to the end surface than the maximum thickness position, in the third direction.
2. The electronic component according to claim 1 , wherein a thickness of the portion positioned on the first principal surface gradually decreases from the maximum thickness position to the end edge of the conductive resin layer.
3. The electronic component according to claim 1 , wherein the second length of the conductive resin layer in the first direction is larger than a fifth length from the end edge of the sintered metal layer to the end edge of the conductive resin layer, in the third direction.
4. The electronic component according to claim 1 , wherein
the conductive resin layer includes a portion positioned on the first principal surface and a portion positioned on the end surface, and
an area of the portion positioned on the end surface is larger than an area of the portion positioned on the first principal surface.
5. The electronic component according to claim 1 , wherein
the conductive resin layer includes a portion positioned on the first principal surface and a portion positioned on the end surface, and
the maximum thickness position has a larger thickness than a maximum thickness of the portion positioned on the end surface.
6. An electronic component, comprising:
an element body of a rectangular parallelepiped shape including a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction; and
an external electrode that is disposed on the element body and includes:
a conductive resin layer; and
a sintered metal layer disposed on an end portion of the element body in the third direction, the sintered metal layer including an exposed region exposed from the conductive resin layer and a covered region covered with the conductive resin layer, the covered region being closer to the first principal surface than is the exposed region,
wherein the conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces to be disposed on the sintered metal layer and on the one part of the first principal surface, and includes a portion positioned on the first principal surface,
the portion positioned on the first principal surface includes a maximum thickness position,
a length of the conductive resin layer in the third direction is smaller than a length of the conductive resin layer in the first direction,
a length from the maximum thickness position to an end edge of the conductive resin layer, in the third direction is larger than a length from the maximum thickness position to an end edge of the sintered metal layer, in the third direction, and
the end edge of the sintered metal layer on the first principal surface is positioned closer to the end surface than the maximum thickness position, in the third direction.
7. An electronic component, comprising:
an element body of a rectangular parallelepiped shape including a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction; and
two external electrodes respectively disposed at both end portions of the element body in the third direction, one of the external electrodes including:
a conductive resin layer continuously covering one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces; and
a sintered metal layer disposed on the end portion of the element body to be positioned between the element body and the conductive resin layer, the sintered metal layer including an exposed region exposed from the conductive resin layer and a covered region covered with the conductive resin layer, the covered region being closer to the first principal surface than is the exposed region,
wherein for the one external electrode:
the conductive resin layer is disposed on the sintered metal layer and on the one part of the first principal surface, and includes a portion positioned on the first principal surface,
the portion positioned on the first principal surface includes a maximum thickness position,
a first length of the conductive resin layer in the third direction is smaller than a second length of the conductive resin layer in the first direction,
a third length from the maximum thickness position to an end edge of the conductive resin layer, in the third direction is larger than a fourth length from the maximum thickness position to an end edge of the sintered metal layer, in the third direction, and
the fourth length is larger than zero.
8. An electronic component, comprising:
an element body of a rectangular parallelepiped shape including a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction; and
two external electrodes respectively disposed at both end portions of the element body in the third direction, one of the external electrodes including:
a conductive resin layer continuously covering one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces; and
a sintered metal layer disposed on the end portion of the element body to be positioned between the element body and the conductive resin layer, the sintered metal layer including an exposed region exposed from the conductive resin layer and a covered region covered with the conductive resin layer, the covered region being closer to the first principal surface than is the exposed region,
wherein for the one external electrode:
the conductive resin layer is disposed on the sintered metal layer and on the one part of the first principal surface, and includes a portion positioned on the first principal surface,
the portion positioned on the first principal surface includes a maximum thickness position,
a first length of the conductive resin layer in the third direction is smaller than a second length of the conductive resin layer in the first direction,
a third length from the maximum thickness portion to an end edge of the conductive resin layer, in the third direction is larger than a fourth length from the maximum thickness position to an edge of the sintered metal layer, in the third direction, and
the end edge of the sintered metal layer on the first principal surface and the maximum thickness position are separated from each other in the third direction.