Laminated electronic component and method of manufacturing the same
A laminated electronic component includes a multilayer body including multiple insulator layers that are laminated and including a bottom surface, a top surface, and multiple side surfaces. The laminated electronic component includes a shield film provided on at least one side surface of the multilayer body. In the laminated electronic component, at least one step difference is provided along a ridge at which the bottom surface and a corresponding one of the side surfaces of the multilayer body are connected to each other, and the shield film includes an edge portion disposed within the at least one step difference.
1. A laminated electronic component comprising:
a multilayer body including a plurality of insulator layers that are laminated, the multilayer body including a bottom surface, a top surface, and four side surfaces connecting the bottom surface and the top surface to each other; and
a shield film provided on at least the four side surfaces of the multilayer body; wherein
at least one step difference is provided along four ridges at which the bottom surface and the four side surfaces of the multilayer body are respectively connected to each other;
the at least one step difference has a rectangular or substantially rectangular and annular shape along the four ridges at which the four side surfaces and the bottom surface are respectively connected to each other; and
the shield film includes an edge portion disposed within the at least one step difference.
2. The laminated electronic component according to claim 1 , wherein the multilayer body includes an internal shield film disposed between adjacent ones of the plurality of insulator layers at or adjacent to the top surface.
3. The laminated electronic component according to claim 1 , wherein the shield film is provided over an entirety or substantially an entirety of the four side surfaces.
4. The laminated electronic component according to claim 1 , wherein each of the at least one step differences includes one surface parallel or substantially parallel to a corresponding one of the four side surfaces and another surface parallel or substantially parallel to the bottom surface.
5. The laminated electronic component according to claim 1 , wherein each of the at least one step difference has a stepwise shape.
6. The laminated electronic component according to claim 1 , wherein the shield film is also provided on the top surface.
7. A laminated electronic component, comprising:
a multilayer body including a plurality of insulator layers that are laminated, the multilayer body including a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface to each other; and
a shield film provided on at least one of the side surfaces of the multilayer body; wherein
the multilayer body includes rounded edges that connect adjacent ones of the top surface, the plurality of side surfaces and the bottom surface;
at least one step difference is provided along a ridge at which the bottom surface and the at least one of the side surfaces of the multilayer body are connected to each other; and
the shield film includes an edge portion disposed within the at least one step difference.
8. The laminated electronic component according to claim 7 , wherein each of the at least one step differences includes one surface parallel or substantially parallel to a corresponding one of the side surfaces and another surface parallel or substantially parallel to the bottom surface.
9. The laminated electronic component according to claim 7 , wherein each of the at least one step difference has a stepwise shape.
10. The laminated electronic component according to claim 7 , wherein the multilayer body includes an internal shield film disposed between adjacent ones of the plurality of insulator layers at or adjacent to the top surface.
11. A method of manufacturing a laminated electronic component, the method sequentially comprising:
a step of providing an unsintered multilayer body including a bottom surface, a top surface, and a plurality of side surfaces that connect the bottom surface and the top surface to each other and in which a plurality of ceramic green sheets are laminated and resin paste is applied on the bottom surface along peripheral edges thereof;
a step of pushing the resin paste into the bottom surface;
a step of firing the unsintered multilayer body to form a multilayer body in which at least one step difference is formed along a ridge at which the bottom surface and a corresponding one of the side surfaces are connected to each other; and
a step of forming a shield film on the corresponding one of the side surfaces of the multilayer body, the shield film including an edge disposed within the at least one step difference.
12. The method of manufacturing the laminated electronic component according to claim 11 , further comprising:
a step of rounding portions of the unsintered multilayer body, using barrel polishing, at which adjacent ones of the top surface, the plurality of side surfaces, and the bottom surface of the unsintered multilayer body are connected to each other, the step of rounding being performed between the step of pushing the resin paste into the bottom surface and the step of firing the unsintered multilayer body to form the multilayer body.
13. The method of manufacturing the laminated electronic component according to claim 11 , wherein the resin paste applied on the bottom surface of the unsintered multilayer body along the peripheral edges thereof is applied in advance on a bottom main surface of one of the plurality of ceramic green sheets that is laminated as a bottommost layer of the unsintered multilayer body along peripheral edges of the bottom main surface.
14. The method of manufacturing the laminated electronic component according to claim 11 , wherein the shield film is formed using sputtering.
15. The method of manufacturing the laminated electronic component according to claim 11 , wherein
the unsintered multilayer body includes four side surfaces;
the resin paste is applied on the bottom surface of the unsintered multilayer body rectangularly or substantially rectangularly and annularly along peripheral edges thereof; and
the at least one step difference is formed into a rectangular or substantially rectangular and annular shape along four ridges of the multilayer body at which the four side surfaces and the bottom surface are respectively connected to each other.
16. A laminated electronic component, comprising:
a multilayer body including a plurality of insulator layers that are laminated, the multilayer body including a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface to each other; and
a shield film provided on at least one of the side surfaces of the multilayer body; wherein
at least one step difference is provided along a ridge at which the bottom surface and the at least one of the side surfaces of the multilayer body are connected to each other; and
the shield film includes an edge portion disposed within the at least one step difference; and
the shield film is provided over an entirety or substantially an entirety of the top surface.
17. The laminated electronic component according to claim 16 , wherein each of the at least one step differences includes one surface parallel or substantially parallel to a corresponding one of the side surfaces and another surface parallel or substantially parallel to the bottom surface.
18. The laminated electronic component according to claim 16 , wherein each of the at least one step difference has a stepwise shape.
19. The laminated electronic component according to claim 16 , wherein the multilayer body includes an internal shield film disposed between adjacent ones of the plurality of insulator layers at or adjacent to the top surface.