Imager and imaging device
An imager includes: a fixing member as defined herein; a sealing member as defined herein; a circuit board as defined herein; and a conductive member as defined herein, in a state of being viewed from a direction perpendicular to a light receiving surface of the imaging sensor chip, an outer edge of a region where the conductive member is disposed overlaps the wall portion of the fixing member, and a distance between a position overlapping the outer edge in the wall portion and an end of the wall portion on a side of the concave portion is 20% or more of a width of the wall portion in a direction parallel to the light receiving surface.
1. An imager comprising:
a fixing member that has a concave portion in which an imaging sensor chip is fixed to a bottom surface of the concave portion, a wall portion surrounding the concave portion, and a plurality of first terminals electrically connected to the imaging sensor chip;
a sealing member that seals the imaging sensor chip by closing the concave portion in a state of overlapping the wall portion of the fixing member;
a circuit board that is disposed facing a surface, opposite to the bottom surface, of the fixing member and has a larger linear expansion coefficient than the fixing member; and
a conductive member that is provided between the first terminals exposed from the surface of the fixing member and a second terminal formed on the circuit board to fix the fixing member and the circuit board and electrically connect the first terminal and the second terminal to each other,
wherein, in a state of being viewed from a direction perpendicular to a light receiving surface of the imaging sensor chip, an outer edge of a region where the conductive member is disposed overlaps the wall portion of the fixing member, and
a distance between a position overlapping the outer edge in the wall portion and an end of the wall portion on a side of the concave portion is 20% or more of a width of the wall portion in a direction parallel to the light receiving surface.
2. The imager according to claim 1 ,
wherein the distance is 60% or less of the width of the wall portion in the direction parallel to the light receiving surface.
3. The imager according to claim 1 ,
wherein the sealing member and the wall portion are fixed by an adhesion material having a thickness of 50 μm or less.
4. The imager according to claim 2 ,
wherein the sealing member and the wall portion are fixed by an adhesion material having a thickness of 50 μm or less.
5. The imager according to claim 1 ,
wherein the sealing member and the wall portion are fixed by an adhesion material having a Young's modulus of 1000 MPa or more.
6. The imager according to claim 2 ,
wherein the sealing member and the wall portion are fixed by an adhesion material having a Young's modulus of 1000 MPa or more.
7. An imaging device comprising:
the imager according to claim 1 .