Optoelectronic device and method of manufacturing the same
View Patent ↗There is provided an optoelectronic device including: first and second optical waveguides arranged on a bulk silicon substrate to be spaced apart from each other in a first direction parallel to an upper surface of the bulk silicon substrate; and an active region interposed between the first and second optical waveguides on the bulk silicon substrate such that one side of the active region contacts the first optical waveguide and the other side contacts the second optical waveguide portion, wherein the first and second optical waveguides and the active region include germanium-silicon (GeSi) alloy.
1. An optoelectronic device comprising first and second optical waveguides arranged on a bulk silicon substrate to be spaced apart from each other in a first direction parallel to an upper surface of the bulk silicon substrate;
an active region interposed between the first and second optical waveguides on the bulk silicon substrate; and
buffer layers interposed between one side of the active region and the first optical waveguide and between the other side of the active region and the second optical waveguide,
wherein the first and second optical waveguides and the active region comprise germanium-silicon (GeSi) alloy,
wherein at least one of the first and second optical waveguides and the active region comprise GeSi alloy of different composition ratios, respectively, and
wherein the first and second optical waveguides and the active region are directly disposed on the bulk silicon substrate.
2. The optoelectronic device of claim 1 , wherein Si content of at least one of the first and second optical waveguides is greater than Si content of the active region.
3. The optoelectronic device of claim 1 , wherein at least one of the first and second optical waveguides and the active region comprise GeSi alloy having the same composition ratio.
4. The optoelectronic device of claim 1 , wherein a length of the active region in the first direction is about 5 μm to about 300 μm.
5. The optoelectronic device of claim 1 , wherein a cross section perpendicular to the first direction of at least one of the first and second optical waveguides is symmetrical with a cross section perpendicular to the first direction of the active region.
6. The optoelectronic device of claim 1 , wherein, in a cross section perpendicular to the first direction of each of at least one of the first and second optical waveguides and the active region, a width of the cross section in a second direction orthogonal to the first direction is constant in a third direction perpendicular to the upper surface of the bulk silicon substrate.
7. The optoelectronic device of claim 1 , further comprising:
a first contact electrode in contact with an upper surface of the active region and connected to a first extension electrode for applying a bias voltage to the active region or for detecting light passing through the active region.
8. The optoelectronic device of claim 7 , further comprising:
a second contact electrode, which is formed between the bulk silicon substrate and the active region and connected to a second extension electrode for applying a bias voltage to the active region or for detecting light passing through the active region.
9. The optoelectronic device of claim 1 , further comprising:
first and second contact electrodes extended from each side of the active region to the bulk silicon substrate and connected to first and second extension electrodes for applying a bias voltage to the active region or for detecting light passing through the active region.