IP Library › Granted Patent US 10,978,250
Granted Patent B2
US 10,978,250 · App. 15/944,376 · Granted Apr 13, 2021

Method of manufacturing capacitor

Inventors: Hye Young Choi (Suwon-Si, KR); Jae Yeol Choi (Suwon-Si, KR); Hyun Hee Gu (Suwon-Si, KR); Bum Su Kim (Suwon-Si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/30H01G4/012H01G4/232
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Quick Facts
Patent No.
US 10,978,250
App. No.
15/944,376
Granted
Apr 13, 2021
Kind
B2
Abstract

A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.

Claims (28)

1. A method of manufacturing a capacitor comprising:

forming a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, in which a portion of an internal electrode pattern is exposed to the second surface, and in which dummy electrode patterns are disposed on the third surface and the fourth surface and are spaced apart from the internal electrode pattern, by stacking and sintering a plurality of dielectric layers on which the internal electrode pattern is formed; and

after forming the dummy electrode patterns, coating the second surface of the body with external electrode paste to be connected to the portion of the internal electrode pattern, exposed to the second surface.

2. The method of manufacturing a capacitor of claim 1 , wherein the dummy electrode patterns are formed of a conductive paste the same as that of the internal electrode pattern.

3. The method of manufacturing a capacitor of claim 1 , wherein 10 μm≤La≤(Lt/2)−10 μm is satisfied, in which Lt is a length of the body and La are lengths of the dummy electrode patterns formed on edges at which the second surface of the body meets the third surface and the fourth surface.

4. The method of manufacturing a capacitor of claim 1 , wherein 10 μm≤Wa≤Wt is satisfied, in which Wt is a width of the body and Wa are widths of the dummy electrode patterns.

5. The method of manufacturing a capacitor of claim 1 , wherein the external electrode paste is applied to edges at which the second surface of the body meets the third surface and the fourth surface.

6. The method of manufacturing a capacitor of claim 1 , wherein the dummy electrode patterns are formed to have at least one of a triangular shape, a rectangular shape, and a trapezoidal shape.

7. The method of manufacturing a capacitor of claim 1 , wherein among the dummy electrode patterns, the dummy electrode pattern formed on the third surface and the dummy electrode pattern formed on the fourth surface have different shapes.

8. The method of manufacturing a capacitor of claim 1 , wherein the coating of the external electrode paste is performed after the sintering of the plurality of dielectric layers.

9. A method of manufacturing a capacitor comprising:

forming a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, in which a portion of an internal electrode pattern is exposed to the second surface, and in which dummy electrode patterns are disposed on the third surface and the fourth surface, by stacking and sintering a plurality of dielectric layers on which the internal electrode pattern is formed; and

coating the second surface of the body with external electrode paste to be connected to the portion of the internal electrode pattern, exposed to the second surface,

wherein the coating of the external electrode paste is performed after the formation of the dummy electrode patterns and the sintering of the plurality of dielectric layers.

10. The method of manufacturing a capacitor of claim 9 , wherein the dummy electrode patterns are formed of a conductive paste the same as that of the internal electrode pattern.

11. The method of manufacturing a capacitor of claim 9 , wherein 10 μm≤La≤(Lt/2)−10 μm is satisfied, in which Lt is a length of the body and La are lengths of the dummy electrode patterns formed on edges at which the second surface of the body meets the third surface and the fourth surface.

12. The method of manufacturing a capacitor of claim 9 , wherein 10 μm≤Wa≤Wt is satisfied, in which Wt is a width of the body and Wa are widths of the dummy electrode patterns.

13. The method of manufacturing a capacitor of claim 9 , wherein the external electrode paste is applied to edges at which the second surface of the body meets the third surface and the fourth surface.

14. The method of manufacturing a capacitor of claim 9 , wherein the dummy electrode patterns are formed to have at least one of a triangular shape, a rectangular shape, and a trapezoidal shape.

15. The method of manufacturing a capacitor of claim 9 , wherein among the dummy electrode patterns, the dummy electrode pattern formed on the third surface and the dummy electrode pattern formed on the fourth surface have different shapes.

16. A method of manufacturing a capacitor comprising:

forming a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, in which a portion of an internal electrode pattern is exposed to the second surface, and in which dummy electrode patterns are disposed on the third surface and the fourth surface, by stacking and sintering a plurality of dielectric layers on which the internal electrode pattern is formed;

after forming the dummy electrode patterns, coating the second surface of the body with external electrode paste to be electrically connected to the portion of the internal electrode pattern, exposed to the second surface; and

forming a plating layer to cover the external electrode paste and one of the dummy electrode patterns so as to connect the external electrode paste and the one of the dummy electrode patterns to each other.

17. The method of manufacturing a capacitor of claim 16 , wherein the dummy electrode patterns are formed of a conductive paste the same as that of the internal electrode pattern.

18. The method of manufacturing a capacitor of claim 16 , wherein 10 μm≤La≤(Lt/2)−10 μm is satisfied, in which Lt is a length of the body and La are lengths of the dummy electrode patterns formed on edges at which the second surface of the body meets the third surface and the fourth surface.

19. The method of manufacturing a capacitor of claim 16 , wherein 10 μm≤Wa≤Wt is satisfied, in which Wt is a width of the body and Wa are widths of the dummy electrode patterns.

20. The method of manufacturing a capacitor of claim 16 , wherein the external electrode paste is applied to edges at which the second surface of the body meets the third surface and the fourth surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2018
From: CHOI, HYE YOUNG; CHOI, JAE YEOL; GU, HYUN HEE; KIM, BUM SU
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 045830/0802 →
Priority Claims (1)
KR 10-2016-0033906 · Mar 22, 2016 · national
Continuity (2)
Division 15296695 · Oct 18, 2016
Related Publication 20180226192A1 · Aug 9, 2018