IP Library › Granted Patent US 10,980,111
Granted Patent B2
US 10,980,111 · App. 16/625,508 · Granted Apr 13, 2021

Circuit board and display device

Inventor: Qiong Wu (Chongqing, CN)
Assignees: HKC Corporation Limited; Chongqing HKC Optoelectronics Technology Co., Ltd.
H05K1/036H05K1/188H05K2201/017H05K2201/0195
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,980,111
App. No.
16/625,508
Granted
Apr 13, 2021
Kind
B2
Abstract

A circuit board and a display device are disclosed. The circuit board includes an insulating layer and a metal foil layer. The metal foil layer is disposed on a surface of the insulating layer. The insulating layer comprises the graphene. The insulating layer comprises a glass felt semicured layer and a glass cloth semicured layer. The glass felt semicured layer and the glass cloth semicured layer are stacked. The glass felt semicured layer includes a glass felt layer and a high thermal conductive adhesive layer covering a surface of the glass felt layer. The glass cloth semicured layer comprises a glass cloth layer and the high thermal conductive adhesive layer covering a surface of the glass cloth layer. The high thermal conductive adhesive layer comprises the graphene, and the glass felt semicured layer and the glass cloth semicured layer also comprise the graphene.

Claims (28)

1. A circuit board, comprising:

an insulating layer; and

a metal foil layer covering the insulating layer;

wherein the metal foil layer is disposed on a surface of the insulating layer, the insulating layer includes at least one layer, and the insulating layer comprises graphene; the insulating layer comprises a glass felt semi-cured layer and a glass cloth semi-cured layer, and the glass felt semi-cured layer and the glass cloth semi-cured layer are stacked with each other; the glass felt semi-cured layer comprises a glass felt layer and a high thermal conductive adhesive layer, and the high thermal conductive adhesive layer covers a surface of the glass felt layer; the glass cloth semi-cured layer comprises a glass cloth layer and the high thermal conductive adhesive layer, and the high thermal conductive adhesive layer covers a surface of the glass cloth layer; the high thermal conductive adhesive layer comprises the graphene; and the glass felt semi-cured layer and the glass cloth semi-cured layer comprise the graphene.

2. A circuit board, comprising:

an insulating layer; and

a metal foil layer covering the insulating layer;

wherein the metal foil layer is disposed on a surface of the insulating layer, the insulating layer includes at least one layer, and the insulating layer comprises graphene,

wherein the insulating layer comprises a glass felt semi-cured layer and a glass cloth semi-cured layer, and the glass felt semi-cured layer and the glass cloth semi-cured layer are stacked with each other.

3. The circuit board according to claim 2 , wherein the metal foil layer is disposed on the glass felt semi-cured layer, and the glass felt semi-cured layer is disposed between the glass cloth semi-cured layer and the metal foil layer.

4. The circuit board according to claim 2 , wherein the glass felt semi-cured layer comprises a glass felt layer and a high thermal conductive adhesive layer, and the high thermal conductive adhesive layer covers a surface of the glass felt layer.

5. The circuit board according to claim 3 , wherein the glass cloth semi-cured layer comprises a glass cloth layer and a high thermal conductive adhesive layer, and the high thermal conductive adhesive layer covers a surface of the glass cloth layer.

6. The circuit board according to claim 4 , wherein the high thermal conductive adhesive layer comprises the graphene.

7. The circuit board according to claim 2 , wherein the glass felt semi-cured layer and the glass cloth semi-cured layer comprise the graphene.

8. The circuit board according to claim 2 , wherein the glass felt semi-cured layer or the glass cloth semi-cured layer comprises the graphene.

9. The circuit board according to claim 2 , wherein the graphene is acidified graphene.

10. A display device, comprising:

a control component;

a display panel; and

a backlight module comprising a circuit board, wherein the circuit board comprises an insulating layer and a metal foil layer, the metal foil layer is disposed on a surface of the insulating layer, the insulating layer includes at least one layer, and the insulating layer comprises graphene,

wherein the insulating layer comprises a glass felt semi-cured layer and a glass cloth semi-cured layer, and the glass felt semi-cured layer and the glass cloth semi-cured layer are stacked with each other.

11. The display device according to claim 10 , wherein the metal foil layer is disposed on the glass felt semi-cured layer, and the glass felt semi-cured layer is disposed between the glass cloth semi-cured layer and the metal foil layer.

12. The display device according to claim 10 , wherein the glass felt semi-cured layer comprises a glass felt layer and a high thermal conductive adhesive layer, and the high thermal conductive adhesive layer covers a surface of the glass felt layer.

13. The display device according to claim 10 , wherein the glass cloth semi-cured layer comprises a glass cloth layer and a high thermal conductive adhesive layer, and the high thermal conductive adhesive layer covers a surface of the glass cloth layer.

14. The display device according to claim 12 , wherein the high thermal conductive adhesive layer comprises the graphene.

15. The display device according to claim 10 , wherein the glass felt semi-cured layer and the glass cloth semi-cured layer comprise the graphene.

16. The display device according to claim 10 , wherein the glass felt semi-cured layer or the glass cloth semi-cured layer comprises the graphene.

17. The display device according to claim 10 , wherein the graphene is acidified graphene.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: WU, QIONG
To: HKC CORPORATION LIMITED; CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 051410/0571 →
Priority Claims (1)
CN 201710514912.4 · Jun 29, 2017 · national
Continuity (1)
Related Publication 20200344884A1 · Oct 29, 2020