Flexible heat transfer mechanism configurations
A flexible heat transfer mechanism is provided for transferring heat from a heat generating component to a heatsink. The heat transfer mechanism may include a pedestal coupled to the heatsink via a heat transfer element. The heat transfer element may be a compliant member that is capable of flexing in a vertical direction such that the pedestal may be vertically displaced relative to the heatsink.
1. A system comprising:
a heatsink component that dissipates heat from a heat generating component;
a heat transfer element having a first end and a second end, the heat transfer element connected to the heatsink component at the first end of the heat transfer element;
a pedestal connected to the heat transfer element at the second end of the heat transfer element; and
a spring coupled to the heatsink component at a first end of the spring, coupled to the pedestal at a second end of the spring, and in contact with the heat transfer element to reinforce stiffness of the heat transfer element;
wherein the heat transfer element comprises a compliant member to flex and exert an opposing spring-like force in a vertical direction, and
wherein the heat transfer element thermally links the heatsink component and the heat generating component to directly transfer heat between the pedestal and the heatsink component.
2. The system of claim 1 , wherein the heat generating component is coupled to a printed circuit board, and the heatsink component forms at least part of a housing for the printed circuit board.
3. The system of claim 1 , wherein the heat transfer element further comprises a hollow structure.
4. The system of claim 1 , wherein the compliant member of the heat transfer element is sufficiently stiff such that the heat transfer element, upon compression, presses the pedestal against the heat generating component.
5. The system of claim 1 , wherein the heat transfer element is positioned between the heatsink component and the pedestal and the second end of the heat transfer element is coupled to the pedestal at an off-center point.
6. The system of claim 1 , wherein the heat transfer element further comprises a C-shaped configuration.
7. The system of claim 1 , wherein the pedestal is a first pedestal of a plurality of pedestals coupled to the heatsink component via a plurality of heat transfer elements including the heat transfer element, wherein the first pedestal of the plurality of pedestals is in contact with the heat generating component, the heat generating component being of a first height, and a second pedestal of the plurality of pedestals is in contact with a different heat generating component of a second height different than the first height.
8. The system of claim 1 , wherein the spring flexes in the vertical direction.
9. The system of claim 1 , wherein the pedestal has greater thermal conductivity than the heatsink component.
10. A method of coupling a heatsink that forms at least a part of a housing of an electronic device to a first heat generating component within the housing, the method comprising:
attaching a first end of a first heat transfer element to the heatsink,
attaching a second end of the first heat transfer element to the first heat generating component via a first pedestal;
enclosing the first heat generating component within the housing, including compressing the first heat transfer element between the first heat generating component and the heatsink such that the first heat transfer element flexes responsive to a movement or change in size of the first heat generating component, and such that the first heat transfer element thermally links the heatsink and the first heat generating component to directly transfer heat between the first pedestal and the heatsink; and
attaching a first end of a spring to the heatsink and the first pedestal to a second end of the spring,
wherein the spring is in contact with the heat transfer element,
wherein the first heat transfer element responds to a vertical force with compliance and an opposing spring-like force, and
wherein the spring reinforces a stiffness of the first heat transfer element.
11. The method of claim 10 , wherein the spring flexes responsive to the movement or change in size of the first heat generating component.
12. The method of claim 10 , wherein the second end of the first heat transfer element is attached to the first pedestal and is attached to the first heat generating component by compressing the first pedestal against the first heat generating component.
13. The method of claim 12 , further comprising:
attaching a plurality of pedestals including the first pedestal to the heatsink via a plurality of heat transfer elements including the first heat transfer element,
wherein enclosing the first heat generating component within at least part of the housing includes enclosing a printed circuit board including the first heat generating component and a second heat generating component within the housing by vertically displacing the first pedestal of the plurality of pedestals to secure the first pedestal on top of the first heat generating component and vertically displacing a second pedestal of the plurality of pedestals to secure the second pedestal on top of the second heat generating component, wherein the first heat generating component and the second heat generating component are of different heights.