IP Library › Granted Patent US 10,982,041
Granted Patent B2
US 10,982,041 · App. 15/052,888 · Granted Apr 20, 2021

Epoxy resin oligomer

Inventors: Kok-Sheng Tan (Nantou County, TW); Chen-Han Chien (Nantou County, TW); Yu-Tsan Tseng (Nantou County, TW)
Assignee: SWANCOR ADVANCED MATERIALS Co., Ltd.
C08G59/1477C08G59/066C08K7/06
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,982,041
App. No.
15/052,888
Granted
Apr 20, 2021
Kind
B2
Abstract

An epoxy resin oligomer is provided. The epoxy resin oligomer is obtained by the reaction of at least a first reactant and a second reactant, and the molecular weight of the epoxy resin oligomer is between 3000 and 9000, wherein the mole ratio of the first reactant and the second reactant is between 1:0.9 and 0.9:1, and each of the first reactant and the second reactant is a compound having two polymerizable groups.

Claims (21)

1. An epoxy resin oligomer obtained by a reaction of at least a first reactant and a second reactant, wherein a molecular weight of the epoxy resin oligomer is between 3000 and 8000, a mole ratio of the first reactant and the second reactant is between 1:0.9 and 0.9:1, each of the first reactant and the second reactant is a compound having two polymerizable groups, and the first reactant is a bifunctional epoxy resin selected from at least one of compounds represented by formula (1) to formula (3) below:

wherein X 1 is a C4 to C18 chain alkylene group; X 2 to X 13 are each independently a hydrogen atom, a phosphorus atom, a C1 to C18 chain alkyl group, or halogen; and n is 0 to 20.

2. The epoxy resin oligomer of claim 1 , wherein the epoxy resin oligomer is a solid at room temperature.

3. The epoxy resin oligomer of claim 1 , wherein the first reactant is a bifunctional epoxy resin, and the second reactant is an amine compound containing dual active hydrogen.

4. The epoxy resin oligomer of claim 3 , wherein the first reactant is selected from at least one of compounds represented by formula (1) to formula (3) below:

wherein X 1 is a C4 to C18 chain alkylene group; X 2 to X 13 are each independently a hydrogen atom, a phosphorus atom, a C1 to C18 chain alkyl group, or halogen; and n is 0 to 20.

5. The epoxy resin oligomer of claim 3 , wherein an epoxy equivalent of the first reactant is between 150 g/mol and 1000 g/mol.

6. The epoxy resin oligomer of claim 3 , wherein the second reactant is selected from at least one of compounds represented by formula (5) to formula (7) below:

wherein R a is a C1 to C20 chain alkyl group, a C5 to C12 cycloalkyl group, a C6 to C18 aryl group, or a C6 to C20 aralkyl group; R b is a C1 to C20 chain alkylene group or a C6 to C12 arylene group; and R c is a C1 to C20 chain alkylene group.

7. The epoxy resin oligomer of claim 3 , wherein the epoxy resin oligomer is obtained by a reaction of at least the first reactant, the second reactant, and an additive, wherein based on a total weight of the first reactant, the second reactant, and the additive, a usage amount of the additive is greater than 0 wt % and equal to or less than 5 wt %.

8. The epoxy resin oligomer of claim 7 , wherein the additive comprises a UV-resistant agent, an anti-yellowing agent, a flame retardant, a toughener, a plasticizer, or an abrasion-resistant additive.

9. The epoxy resin oligomer of claim 1 , wherein the epoxy resin oligomer is obtained by a reaction of at least the first reactant, the second reactant, and a catalyst, wherein the second reactant is a bisphenol compound, and based on a total weight of the first reactant, the second reactant, and the catalyst, a usage amount of the catalyst is 0.01 wt % to 3 wt %.

10. The epoxy resin oligomer of claim 9 , wherein an epoxy equivalent of the first reactant is between 150 g/mol and 1000 g/mol.

11. The epoxy resin oligomer of claim 9 , wherein the second reactant is selected from at least one of compounds represented by formula (8) to formula (9) below:

wherein W is a C1 to C20 chain alkylene group, a C5 to C12 chain cycloalkylene group, or a fluorenylene group, and X is a C1 to C20 chain alkyl group, a hydrogen atom, or halogen.

12. The epoxy resin oligomer of claim 9 , wherein the catalyst comprises a Lewis base or an organic base.

13. The epoxy resin oligomer of claim 9 , wherein the epoxy resin oligomer is obtained by a reaction of at least the first reactant, the second reactant, the catalyst, and an additive, wherein based on a total weight of the first reactant, the second reactant, the catalyst, and the additive, a usage amount of the additive is greater than 0 wt % and equal to or less than 5 wt %.

14. The epoxy resin oligomer of claim 13 , wherein the additive comprises a UV-resistant agent, an anti-yellowing agent, a flame retardant, a toughener, a plasticizer, or an abrasion-resistant additive.

15. The epoxy resin oligomer of claim 1 , wherein the second reactant includes a compound represented by formula (9) below:

wherein W is a C1 to C20 chain alkylene group, a C5 to C12 chain cycloalkylene group, or a fluorenylene group, and X is a C1 to C20 chain alkyl group or halogen.

16. The epoxy resin oligomer of claim 1 , wherein the first reactant is a bifunctional epoxy resin selected from a compound represented by formula (1).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2020
From: SWANCOR IND. CO., LTD.
To: SWANCOR ADVANCED MATERIALS CO., LTD.
Reel/Frame 051927/0037 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2016
From: TAN, KOK-SHENG; CHIEN, CHEN-HAN; TSENG, YU-TSAN
To: SWANCOR IND. CO., LTD.
Reel/Frame 037866/0539 →
Continuity (1)
Related Publication 20170247500A1 · Aug 31, 2017