IP Library Granted Patent US 10,985,768
Granted Patent B2
US 10,985,768 · App. 16/990,905 · Granted Apr 20, 2021

Ultra-high speed digital-to-analog (DAC) conversion methods and apparatus having sub-DAC systems for data interleaving and power combiner with no interleaving

Inventors: Ark-Chew Wong (Irvine, CA); Richard Dennis Alexander (Lake Forest, CA); Craig A. Hornbuckle (Rolling Hills Estates, CA)
Assignee: JARIET TECHNOLOGIES, INC.
H03M1/0626H03M1/00H03M1/66H03M1/747
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,985,768
App. No.
16/990,905
Granted
Apr 20, 2021
Kind
B2
Abstract

A ultra-high speed DAC apparatus (e.g., with a full sampling frequency not less than 20 GHz) may include one or more digital pre-coders and DAC modules. Each DAC module may include multiple current-mode DAC systems and a first power combiner. The gate length of transistors within each DAC module may be between 6 and 40 nm. Each current-mode DAC system includes a transmission line (e.g., 40 to 80 microns long) coupled to multiple interleaving sub-DAC systems (within the current-mode DAC systems) and the first power combiner. The first power combiner combines, without interleaving, analog signals that have been interleaved within the current-mode DAC systems. The impedance of the first power combiner matches the impedance of each of the current-mode DAC systems and a load of the first power combiner. A second power combiner combines, without interleaving, analog signals from the DAC modules.

Claims (56)

1. A system, comprising:

a first digital-to-analog (DAC) system comprising a first sub-DAC system and a second sub-DAC system;

a second DAC system comprising a third sub-DAC system and a fourth sub-DAC system; and

a power combiner comprising a first input node, a second input node, and an output node,

wherein:

the first DAC system is configured to generate a first interleaved signal, based on a first signal from the first sub-DAC system and a second signal from the second sub-DAC system;

the second DAC system is configured to generate a second interleaved signal, based on a third signal from the third sub-DAC system and a fourth signal from the fourth sub-DAC system;

the power combiner is configured to combine, without interleaving, the first interleaved signal and the second interleaved signal;

an impedance of the first DAC system at the first input node is configured to match an impedance of the power combiner at the first input node;

an impedance of the second DAC system at the second input node is configured to match an impedance of the power combiner at the second input node; and

an impedance of the power combiner at the output node is configured to match an impedance of a load at the output node.

2. The system of claim 1 , wherein the first sub-DAC system and the third sub-DAC system are configured to provide partially overlapping sampling clock signals.

3. The system of claim 1 , wherein the first sub-DAC system and the third sub-DAC system are configured to provide carved quadrature clock signals.

4. The system of claim 1 , wherein the first sub-DAC system comprises a DAC driver circuit comprising a plurality of DAC unit cells, wherein the plurality of DAC unit cells are positioned laterally adjacent to each other, located along a length of a first transmission line, and coupled to the first transmission line, and wherein the length of the first transmission line is based on a number of the plurality of DAC unit cells.

5. The system of claim 4 , wherein the number of the plurality of DAC unit cells is based on a number of input bits of the DAC driver circuit, and wherein when the DAC driver circuit is an N-bit DAC driver circuit, the number of the plurality of DAC units cells is greater than or equal to N, where N is an integer greater than 1.

6. The system of claim 4 , wherein the first DAC system comprises a first transmission line coupled to the first and second sub-DAC systems and the power combiner, and

wherein the length of the first transmission line is based on a number of input bits of the DAC driver circuit.

7. The system of claim 1 , wherein the power combiner comprises passive components without active components and is configured to operate in voltage-mode.

8. The system of claim 1 , wherein a first transmission line of the first DAC system is coupled to an array of load resistors to covert a current-mode operation to a voltage-mode operation and to provide a matching impedance to the power combiner.

9. The system of claim 1 , wherein the first DAC system comprises a first transmission line coupled to the first and second sub-DAC systems and the power combiner, and

wherein the system comprises a third transmission line that is located between and coupled to the first transmission line and the power combiner, the third transmission line having a length greater than 0.5 millimeters.

10. The system of claim 1 , wherein the first DAC system comprises a first transmission line coupled to the first and second sub-DAC systems and the power combiner, and

wherein a length of the first transmission line is greater than 50 microns.

11. A method for an apparatus comprising a first digital-to-analog (DAC) system, a second DAC system and a power combiner, wherein the first DAC system comprises a first sub-DAC system and a second sub-DAC system, wherein the second DAC system comprises a third sub-DAC system and a fourth sub-DAC system, wherein the power combiner comprises a first input node, a second input node, and an output node, the method comprising:

generating, at the first DAC system, a first interleaved signal, based on a first signal from the first sub-DAC system and a second signal from the second sub-DAC system;

generating, at the second DAC system, a second interleaved signal, based on a third signal from the third sub-DAC system and a fourth signal from the fourth sub-DAC system;

combining, at the power combiner without interleaving, the first interleaved signal and the second interleaved signal; and

outputting, at the power combiner, a combined signal,

wherein:

an impedance of the first DAC system at the first input node matches an impedance of the power combiner at the first input node;

an impedance of the second DAC system at the second input node matches an impedance of the power combiner at the second input node; and

an impedance of the power combiner at the output node matches an impedance of a load at the output node.

12. The method of claim 11 , wherein a DAC driver circuit of each of the first and second sub-DAC systems operates at a clock frequency of 10 GHz or higher, and

wherein each of the first and second DAC systems comprises a transmission line which is coupled to the power combiner and has a length greater than 10 microns.

13. The method of claim 11 , wherein the first and second DAC systems operate in a current mode, and

wherein the power combiner operates in a voltage mode.

14. The method of claim 11 , comprising:

providing, at the first sub-DAC system and the third sub-DAC system, partially overlapping sampling clock signals.

15. The method of claim 11 , wherein the first sub-DAC system comprises a DAC driver circuit comprising a plurality of DAC unit cells, wherein the plurality of DAC unit cells are coupled to a first transmission line, and wherein a length of the first transmission line is based on a number of the plurality of DAC unit cells.

16. An apparatus comprising:

means for generating a first interleaved signal, based on a first signal from a first sub-digital-to-analog (DAC) system and a second signal from a second sub-DAC system;

means for generating a second interleaved signal, based on a third signal from a third sub-DAC system and a fourth signal from a fourth sub-DAC system;

means for combining, without interleaving, the first interleaved signal and the second interleaved signal;

means for outputting a combined signal,

wherein:

an impedance of the means for generating the first interleaved signal, at a first input node, is configured to match an impedance of the means for combining, at the first input node;

an impedance of the means for generating the second interleaved signal, at a second input node, is configured to match an impedance of the means for combining, at the second input node; and

an impedance of the means for outputting the combined signal, at an output node, is configured to match an impedance of a load, at the output node.

17. The apparatus of claim 16 , wherein a DAC driver circuit of each of the first and second sub-DAC systems is configured to operate at a clock frequency of 10 GHz or higher, and

wherein each of the means for generating the first and second interleaved signals comprises a transmission line,

wherein the transmission line is coupled to the means for combining and has a length greater than 10 microns.

18. The apparatus of claim 16 , wherein each of the means for generating the first and second interleaved signals is configured to operate in a current mode, and

wherein the means for combining is configured to operate in a voltage mode.

19. The apparatus of claim 16 , comprising:

means for providing, at the first sub-DAC system and the third sub-DAC system, partially overlapping sampling clock signals.

20. The apparatus of claim 16 , wherein the first sub-DAC system comprises a DAC driver circuit comprising a plurality of DAC unit cells, wherein the plurality of DAC unit cells are coupled to a first transmission line, and wherein a length of the first transmission line is based on a number of the plurality of DAC unit cells.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2021
From: WONG, ARK-CHEW; ALEXANDER, RICHARD DENNIS; HORNBUCKLE, CRAIG A.
To: JARIET TECHNOLOGIES, INC.
Reel/Frame 054835/0111 →
Continuity (3)
Continuation 16623755
Provisional Application 62528921 · Jul 5, 2017
Related Publication 20200373932A1 · Nov 26, 2020