Apparatus and method for treating substrate
A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.
1. An apparatus for treating a substrate, the apparatus comprising:
a processing vessel having a processing space inside;
a substrate support unit configured to support and rotate the substrate or a jig in the processing space;
a liquid dispensing unit including a treating liquid dispensing member configured to dispense a treating liquid for treating the substrate and a cleaning solution dispensing member configured to dispense a cleaning solution for cleaning the processing vessel; and
a controller configured to control the substrate support unit and the liquid dispensing unit,
wherein the substrate support unit includes:
a support plate having a vacuum line formed therein to clamp the substrate by vacuum pressure; and
a pressure-reducing member configured to produce the vacuum pressure in the vacuum line, and
wherein the controller controls the substrate support unit and the liquid dispensing unit to perform a first clamping step of clamping the substrate to the support plate by producing a first vacuum pressure in the vacuum line when treating the substrate by dispensing the treating liquid onto the substrate supported on the substrate support unit and clamping the jig to the support plate by producing a second vacuum pressure different from the first vacuum pressure, in the vacuum line when cleaning the processing vessel by dispensing the cleaning solution onto the jig supported on the substrate support unit.
2. The apparatus of claim 1 , wherein the second vacuum pressure is higher than the first vacuum pressure.
3. The apparatus of claim 2 , wherein the controller performs a second clamping step of clamping the jig to the support plate by a third vacuum pressure different from the second vacuum pressure when cleaning the processing vessel by dispensing the cleaning solution onto the jig supported on the substrate support unit.
4. The apparatus of claim 3 , wherein the third vacuum pressure is the same as the first vacuum pressure.
5. The apparatus of claim 3 , wherein the controller repeatedly performs the first clamping step and the second clamping step while cleaning the processing vessel by dispensing the cleaning solution onto the jig.
6. The apparatus of claim 1 , further comprising:
a lifting unit configured to adjust a relative height between the substrate support unit and the processing vessel,
wherein the controller controls the lifting unit, and
wherein the controller varies the relative height between the substrate support unit and the processing vessel while cleaning the processing vessel by dispensing the cleaning solution onto the jig.
7. The apparatus of claim 1 , wherein the jig has the same size as the substrate.
8. The apparatus of claim 7 , wherein the support plate has a smaller size than the substrate.