Semiconductor device
A semiconductor device includes an insulating layer on a substrate, a channel region on the insulating layer, a gate structure on the insulating layer, the gate structure crossing the channel region, source/drain regions on the insulating layer, the source/drain regions being spaced apart from each other with the gate structure interposed therebetween, the channel region connecting the source/drain regions to each other, and contact plugs connected to the source/drain regions, respectively. The channel region includes a plurality of semiconductor patterns that are vertically spaced apart from each other on the insulating layer, the insulating layer includes first recess regions that are adjacent to the source/drain regions, respectively, and the contact plugs include lower portions provided into the first recess regions, respectively.
1. A semiconductor device, comprising:
a substrate;
a first transistor on the substrate, the first transistor comprising a first channel region, first source/drain regions spaced apart from each other with the first channel region interposed therebetween, and a first gate structure crossing the first channel region in a direction,
a second transistor on the substrate, the second transistor comprising a second channel region, second source/drain regions spaced apart from each other with the second channel region interposed therebetween, and a second gate structure crossing the second channel region in the direction,
a first contact plug electrically connected to at least one of the first source/drain regions; and
a second contact plug electrically connected to at least one of the second source/drain regions,
wherein the first source/drain regions have conductivity types different from those of the second source/drain regions,
wherein a bottom surface of the first contact plug is lower than a bottom surface of the at least one of the first source/drain regions, relative to the substrate, and
wherein a bottom surface of the second contact plug is higher than a bottom surface of the at least one of the second source/drain regions, relative to the substrate.
2. The device of claim 1 , wherein the first transistor is an NMOSFET, and the second transistor is a PMOSFET.
3. The device of claim 1 , wherein each of the first and second channel regions comprises a plurality of semiconductor patterns that are stacked on the substrate and are spaced apart from each other.
4. The device of claim 3 , wherein each of the first and second gate structures comprises a gate insulating pattern and a gate electrode, and
the gate insulating pattern and the gate electrode extend between the semiconductor patterns.
5. The device of claim 1 , wherein the bottom surface of the first contact plug is lower than a bottom surface of a lowermost portion of the first gate stucture.
6. The device of claim 1 , wherein the bottom surface of the first contact plug is higher than a top surface of the substrate.
7. The device of claim 1 , wherein the first source/drain regions and the second source/drain regions comprise respective semiconductor materials that are different from each other.
8. A semiconductor device, comprising:
a substrate;
source/drain regions on the substrate;
a channel region between the source/drain regions, the channel region including a plurality of semiconductor patterns that are vertically spaced apart from each other on the substrate;
a gate electrode on the channel region; and
a contact plug extending towards the substrate through at least one of the source/drain regions,
wherein a bottom surface of the contact plug is lower than a bottom surface of a lowermost portion of the gate electrode, relative to the substrate.
9. The device of claim 8 , wherein the gate electrode extends between the semiconductor patterns.
10. The device of claim 8 , wherein the channel region is vertically spaced apart from the substrate with an insulating layer interposed therebetween.
11. The device of claim 8 , wherein the gate electrode is vertically spaced apart from the substrate with an insulating layer interposed therebetween.
12. The device of claim 8 , wherein the contact plug is vertically spaced apart from the substrate with an insulating layer interposed therebetween.
13. The device of claim 8 , wherein the source/drain regions, the channel region and the gate electrode constitute an NMOSFET.