Integrated circuit packages in headphones and method for forming and operating the same
Embodiments of the present disclosure provide an integrated circuit package in a true wireless stereo (TWS) headphone. The integrated circuit package includes a package substrate, an inductor structure, a sensing chip, and a semiconductor device. The inductor structure is on a first surface of the package substrate configured to sense a deformation of the TWS headphone. The sensing chip is attached to a second surface of the package substrate and configured to sense an inductance change in the inductor structure. The semiconductor device is attached to the second surface of the package substrate configured to process a sensed inductance change.
1. An integrated circuit package in a true wireless stereo (TWS) headphone, comprising:
a package substrate;
an inductor structure on a first surface of the package substrate configured to sense a deformation of the TWS headphone;
a sensing chip attached to a second surface of the package substrate and configured to sense an inductance change in the inductor structure; and
a semiconductor device attached to the second surface of the package substrate configured to process the sensed inductance change.
2. The integrated circuit package of claim 1 , further comprising a plurality of first solder balls in contact with the package substrate and the sensing chip, wherein the sensing chip is conductively connected to the package substrate through the plurality of first solder balls.
3. The integrated circuit package of claim 2 , further comprising a plurality of second solder balls in contact with the package substrate and the semiconductor device, wherein the semiconductor device is conductively connected to the package substrate through the plurality of second solder balls.
4. The integrated circuit package of claim 3 , wherein
the semiconductor device is conductively connected to the sensing chip through the plurality of first solder balls and second solder balls.
5. The integrated circuit package of claim 3 , wherein the inductor structure is conductively connected to the semiconductor device through the plurality of second solder balls.
6. The integrated circuit package of claim 1 , wherein:
the sensing chip is above the semiconductor device;
the package substrate is above the sensing chip; and
the inductor structure is above the package substrate.
7. The integrated circuit package of claim 1 , wherein the inductor structure comprises a planar coil.
8. The integrated circuit package of claim 7 , wherein
a dimension of an outer periphery of the inductor structure is equal to or greater than twice a distance between a central plane of the inductor structure and a metal film in the TWS headphone.
9. The integrated circuit package of claim 7 , wherein
the distance between a central plane of the inductor structure and a metal film is about 0.5 mm to about 2 mm;
the dimension of the outer periphery of the inductor structure is in a range of about 1 mm to about 4 mm.
10. The integrated circuit package of claim 7 , wherein a width of the planar coils is in a range of about 0.1 mm to about 0.3 mm.
11. The integrated circuit package of claim 1 , wherein the semiconductor device comprises a motherboard configured to process an electrical signal reflecting the sensed inductance change from the sensing chip.
12. The integrated circuit package of claim 1 , wherein the package substrate comprises an interposer layer conductively connected to the sensing chip and the semiconductor device.
13. The integrated circuit package of claim 1 , wherein the inductor structure is attached onto the first surface of the package substrate using an adhesive.
14. The integrated circuit package of claim 1 , wherein the inductor structure is an integral part of the package substrate.
15. A method for operation control in true wireless stereo (TWS) headphones, by an integrated circuit, comprising:
sensing, by an inductor structure, a deformation of the TWS headphone, wherein the inductor structure is positioned on a first surface of a package substrate and facing a metal film attached to a shell of the TWS headphones;
sensing, by a sensing chip, an inductance change in the inductor structure, wherein the sensing chip is positioned on a second surface of the package substrate, the second surface being on an opposite side of the package substrate;
processing the sensed inductance change, by a semiconductor device positioned on a second surface of the package substrate, the second surface being on an opposite side of the package substrate;
determining, by the semiconductor device, the deformation of the shell based on the inductance change; and
determining, by the semiconductor device, an operation of the TWS headphones, the sensing chip, based on the deformation of the shell.
16. The method of claim 15 , wherein the inductor structure is a planar inductor comprising a coil in one layer on the package substrate.
17. The method of claim 15 , wherein the package substrate is a ball-grid-array (BGA) substrate.
18. The method of claim 17 , wherein the package substrate is conductively connected to the sensing chip through a plurality of first solder balls.
19. The method of claim 17 , wherein:
the package substrate is conductively connected to the processor through a plurality of second solder balls.
20. An integrated circuit package in a true wireless stereo (TWS) headphone, comprising:
a package substrate;
an inductor structure on a first surface of the package substrate;
a sensing chip attached to a second surface of the package substrate and configured to sense an inductance change caused by an interaction between the inductor structure and a metal film attached to a shell of the TWS headphones; and
a motherboard attached to the second surface of the package substrate and configured to process an electrical signal from the sensing chip, the electrical signal reflecting the inductance change.