In-package magnetic switching using glass core technology
Embodiments disclosed herein comprise package substrates and methods of forming such package substrates. In an embodiment, a package substrate comprises a core, where the core comprises glass. In an embodiment, an opening if formed through the core. In an embodiment, a magnetic region is disposed in the opening.
1 . A package substrate, comprising:
a core, wherein the core comprises glass;
an opening through the core, wherein the opening has an hourglass shaped cross-section;
a magnetic region disposed in the opening; and
an unfilled opening in the core, the unfilled opening laterally spaced apart from the magnetic region in the opening.
2 . The package substrate of claim 1 , wherein the magnetic region comprises a first magnetic layer and a second magnetic layer, wherein the first magnetic layer is spaced away from the second magnetic layer by a barrier layer.
3 . The package substrate of claim 2 , wherein the first magnetic layer is a pinned ferromagnet, and wherein the second magnetic layer is an unpinned ferromagnet.
4 . The package substrate of claim 1 , wherein a first barrier layer is above the magnetic region, and wherein a second barrier layer is below the magnetic region.
5 . The package substrate of claim 4 , further comprising:
a conductive trace embedded in the glass core adjacent to the magnetic region.
6 . The package substrate of claim 4 , wherein at least one surface of the conductive trace is contacted by a material other than the glass core.
7 . The package substrate of claim 1 , wherein the unfilled opening is a channel configured for flowing a coolant is adjacent to the opening.
8 . An electronic package, comprising:
a core;
a buildup layer over the core;
a plurality of openings through the core, wherein each of the plurality of openings has an hourglass shaped cross-section;
a plurality of magnetic tunnel junctions (MTJs) in corresponding ones of the openings in the core, wherein the plurality of MTJs are coupled to each other to form a memory cell; and
an unfilled opening in the core, the unfilled opening laterally spaced apart from the plurality of MTJs in the plurality of openings.
9 . The electronic package of claim 8 , wherein each MTJ of the plurality of MTJs comprises:
a first magnetic layer in the opening;
a barrier layer under the first magnetic layer in the opening; and
a second magnetic layer under the barrier layer in the opening.
10 . The electronic package of claim 9 , wherein the first magnetic layer is a pinned ferromagnet, and wherein the second magnetic layer is an unpinned ferromagnet.
11 . The electronic package of claim 10 , wherein a low resistance state through the MTJ occurs when the unpinned ferromagnet and the pinned ferromagnet have parallel magnetisms, and wherein a high resistance state through the MTJ occurs when the unpinned ferromagnet and the pinned ferromagnet have antiparallel magnetisms.
12 . The electronic package of claim 11 , wherein the low resistance state is a binary logic 1 and wherein the high resistance state is a binary logic 0 .
13 . An electronic package, comprising:
a core;
a buildup layer over the core;
a magnetic switch embedded in the core, wherein the magnetic switch comprises:
an opening through the core, wherein the opening has an hourglass shaped cross-section;
a first barrier layer in the opening;
a magnetic layer below the first barrier in the opening;
a second barrier layer below the magnetic layer in the opening; and
a conductive trace adjacent to the magnetic layer; and
an unfilled opening in the core, the unfilled opening laterally spaced apart from the opening of the magnetic switch.
14 . The electronic package of claim 13 , wherein flowing current through the conductive trace aligns a magnetism in the magnetic layer to allow electrical conduction through the magnetic layer.
15 . The electronic package of claim 13 , wherein the conductive trace has a trapezoidal cross-section.
16 . The electronic package of claim 15 , wherein a surface of the conductive trace is covered by a material other than the core.
17 . The electronic package of claim 13 , wherein the magnetic switch is coupled to an antenna.
18 . The electronic package of claim 17 , wherein the magnetic switch allows for propagation of signals from the antenna to a die when current is flowing in a first direction in the conductive trace, and for propagation of signals from the die to the antenna when current is flowing in a second direction in the conductive trace.
19 . The electronic package of claim 13 , further comprising a plurality of magnetic switches.
20 . The electronic package of claim 19 , wherein the plurality of magnet switches are each coupled to a single die at first ends of the plurality of magnets, and wherein second ends of the plurality of magnetic switches are each coupled to different devices.
21 . An electronic system, comprising:
a board;
a package substrate coupled to the board, wherein the package substrate comprises:
a core;
a buildup layer over the core;
an opening through the core, wherein the opening has an hourglass shaped cross-section; and
a magnetic region disposed in the opening;
an unfilled opening in the core, the unfilled opening laterally spaced apart from the magnetic region in the opening a die coupled to the package substrate.
22 . The electronic package of claim 21 , wherein the magnetic region is between a pair of barrier layers.
23 . The electronic package of claim 21 , wherein the magnetic region comprises:
a first magnetic layer that is a pinned ferromagnet;
a barrier layer; and
a second magnetic layer that is an unpinned ferromagnet.
24 . A package substrate, comprising:
a core, wherein the core comprises glass;
an opening through the core; and
a magnetic region disposed in the opening, wherein a channel configured for flowing a coolant is adjacent to the opening.