Display panel, display device, and method for manufacturing display panel

1. A display panel comprising:

a display substrate having a first surface and a second surface opposite to the first surface, the display substrate including a display area and a non-display area in the first surface and a first terminal on the first surface in the non-display area;

a Chip-On-Film (COF) component disposed on the second surface, the Chip-On-Film component comprising a COF film and an integrated circuit (IC) chip on a surface of the COF film, which faces away from the display substrate, and a second terminal on the surface of the COF film;

a connection hole: located in the non-display area and at least penetrating the display substrate and the COF film; and

an electrical connector disposed in the connection hole and electrically coupled to the first terminal on the first surface of the display substrate and the second terminal on the surface, which faces away from the display substrate, of the COF film.

2. The display panel according to claim 1 further comprising:

a bonding layer disposed between the COF film and the second surface of the display substrate.

3. The display panel according to claim 2 , wherein:

the connection hole and the electrical connector penetrate through the display substrate, the bonding layer and the COF film.

4. The display panel according to claim 1 , wherein the connection hole has an aperture greater than or equal to 25 μm.

5. The display panel according to claim 1 , wherein display substrate is an electroluminescent display substrate or a quantum dot display substrate.

6. The display panel according to claim 1 , wherein the COF film is configured to at least partially overlap the non-display area of the display substrate.

7. The display panel according to claim 1 , wherein the display substrate is a flexible display substrate.

8. The display panel according to claim 1 , further comprising:

a flexible circuit board attached to a side of the COF film, which faces the display substrate, and electrically connected to the COF film.

9. The display panel according to claim 2 , wherein the bonding layer is an anisotropic conductive paste.

10. A display device comprising the display panel according to claim 1 .

11. A method of manufacturing a display panel, comprising:

providing a display substrate having a first surface and a second surface opposite to the first surface, the display substrate including a display area and a non-display area in the first surface and a first terminal on the first surface in the non-display area;

providing a Chip-On-Film (COF) component on the display substrate, wherein the Chip-On-Film component comprises a COF film and an integrated circuit (IC) chip on a surface of the COF film, which faces away from the display substrate, and a second terminal on the surface of the COF film;

attaching the COF film to the second side of the display substrate through a bonding layer;

forming a connection hole in the non-display area, the connection hole penetrating through the display substrate, the COF film, and the bonding layer; and

forming an electrical connector in the connection hole,

wherein the electrical connector is electrically coupled to the first terminal on the first surface of the display substrate and the second terminal on the surface, which faces away from the display substrate, of the COF film.

12. The method according to claim 11 , wherein the bonding layer is anisotropic conductive paste.

13. The method according to claim 11 , further comprising:

providing a flexible circuit board attached to a side of the COF film, which faces the display substrate, and electrically connected to the COF film.

14. The method according to claim 11 , wherein:

the connection hole is formed by a laser drilling process.

15. The method according to claim 11 , wherein the display substrate is a flexible display substrate.