IP Library Granted Patent US 10,996,001
Granted Patent B2
US 10,996,001 · App. 17/009,206 · Granted May 4, 2021

Heatsink

Inventors: Yosuke Watanabe (Tokyo, JP); Kenya Kawabata (Tokyo, JP); Yoshikatsu Inagaki (Tokyo, JP); Tatsuro Miura (Tokyo, JP); Kazuaki Aotani (Tokyo, JP); Toshiaki Nakamura (Tokyo, JP)
Assignee: FURUKAWA ELECTRIC CO., LTD.
F28D15/0233F28D15/0275F28D15/046F28F1/28F28F3/025F28D2021/0029F28F2215/00
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Quick Facts
Patent No.
US 10,996,001
App. No.
17/009,206
Granted
May 4, 2021
Kind
B2
Abstract

The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited. A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; a pipe body connected to a heat radiating portion of the heat transport member; and a heat radiating fin group which is thermally connected to the pipe body and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the pipe body and that is filled with a working fluid, the internal space of the heat transport member communicating with an internal space of the pipe body, and a cross-sectional area of an internal space in a direction orthogonal to a heat transport direction of the heat transport member in the heat radiating portion is smaller than the cross-sectional area in a heat insulating portion between the heat receiving portion and the heat radiating portion.

Claims (13)

1. A heatsink comprising:

a heat transport member having a heat receiving portion thermally connected to a heating element; a pipe body connected to a heat radiating portion of the heat transport member; and a heat radiating fin group which is thermally connected to the pipe body and in which a plurality of heat radiating fins is arranged, wherein

the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the pipe body and that is filled with a working fluid, the internal space of the heat transport member communicating with an internal space of the pipe body,

a cross-sectional area of an internal space in a direction orthogonal to a heat transport direction of the heat transport member in the heat radiating portion is smaller than the cross-sectional area in a heat insulating portion between the heat receiving portion and the heat radiating portion,

a wick structure extended from the heat receiving portion to the heat radiating portion is provided in the internal space of the heat transport member, a different wick structure is provided in an inner surface of the pipe body, and the wick structure and the different wick structure are connected via a connection member having capillary force, the connection member being a wick member having capillary force, and

the wick structure provided in the heat transport member is a sintered body of metal powder, and the different wick structure provided in the pipe body is a plurality of narrow grooves.

2. The heatsink according to claim 1 , wherein the cross-sectional area in the heat receiving portion is the same as the cross-sectional area in the heat insulating portion.

3. The heatsink according to claim 1 , wherein the cross-sectional area in the heat receiving portion is larger than the cross-sectional area in the heat insulating portion.

4. The heatsink according to claim 1 , wherein the pipe body is extended in an arrangement direction of the heat radiating fins.

5. The heatsink according to claim 1 , wherein an extension direction of the pipe body is not parallel to the heat transport direction of the heat transport member.

6. The heatsink according to claim 1 , wherein a plurality of the pipe bodies is provided and is extended in a plurality of directions from the heat transport member.

7. The heatsink according to claim 1 , wherein at least one surface of the heat transport member has a planar shape.

8. The heatsink according to claim 1 , wherein the heat transport member has a step portion in a direction orthogonal to the heat transport direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2020
From: WATANABE, YOSUKE; KAWABATA, KENYA; INAGAKI, YOSHIKATSU; MIURA, TATSURO; AOTANI, KAZUAKI; NAKAMURA, TOSHIAKI
To: FURUKAWA ELECTRIC CO., LTD.
Reel/Frame 053676/0848 →
Priority Claims (1)
JP JP2019-078219 · Apr 17, 2019 · national
Continuity (2)
Continuation PCTJP2020016355 · Apr 14, 2020
Related Publication 20200393201A1 · Dec 17, 2020