Display module, display device, and method of manufacturing the display module

1. A method of manufacturing a display module, the method comprising:

providing a carrier substrate;

providing a base layer on an upper surface of the carrier substrate, wherein the base layer comprises a display area and a pad area;

providing a circuit layer on the display area of the base layer and the pad area of the base layer;

forming a through hole through the circuit layer and the pad area of the base layer;

forming a conductive part, which is disposed through the circuit layer and the pad area of the base layer, by providing a conductive material from an upper surface of the circuit layer to the through hole formed through the circuit layer and the pad area of the base layer; and

providing a circuit member below the base layer to be electrically connected to the circuit laver through the conductive part.

2. The method of claim 1 , wherein

the pad area of the base layer defines a first pad area, a bending area, and a second pad area, and

the forming the through hole comprises:

forming a first contact hole in the circuit layer on the first pad area and in the first pad area of the base layer; and

forming a second contact hole in the circuit layer on the second pad area and in the second pad area of the base layer.

3. The method of claim 2 , further comprising:

removing a portion of the bending area; and

bending the bending area in a way such that the first contact hole and the second contact hole overlap each other when viewed from a plan view in a thickness direction of the display module,

wherein the forming the conductive part comprises providing the conductive material to the first contact hole and the second contact hole.

4. The method of claim 3 , further comprising:

providing a first mask layer on the upper surface of the circuit layer;

forming a first mask pattern by patterning the first mask layer;

forming the first contact hole and the second contact hole using the first mask pattern;

removing the portion of the bending area using the first mask pattern;

providing a second mask layer on the upper surface of the circuit layer;

forming a second mask pattern by patterning the second mask layer; and

patterning the circuit layer using the second mask pattern.

5. The method of claim 3 , further comprising:

providing a mask layer on the upper surface of the circuit layer;

forming a first mask pattern by patterning the mask layer;

forming the first contact hole and the second contact hole using the first mask pattern;

forming a second mask pattern by ashing a portion of the first mask pattern; and

patterning the circuit layer using the second mask pattern.

6. The method of claim 3 , further comprising:

after the bending the bending area, grinding a portion of the bending area.

7. The method of claim 3 , wherein the removing the portion of the bending area comprises removing the portion of the bending area in a way such that a first thickness in the bending area of the base layer is less than a second thickness in the first pad area of the base layer.

8. The method of claim 3 , wherein

the removing the portion of the bending area comprises removing the portion of the bending area in a way such that the first pad area and the second pad area are connected to each other by a remaining portion of the bending area.

9. The method of claim 2 , further comprising:

half-cutting an upper surface of the base layer or a lower surface of the bending area of the base layer; and

bending the bending area in a way such that the first contact hole and the second contact hole overlap each other when viewed from a plan view in a thickness direction of the display module,

wherein the forming the conductive part comprises providing the conductive material to the first contact hole and the second contact hole.

10. The method of claim 2 , wherein

the base layer comprises a first alignment pattern disposed in the first pad area and a second alignment pattern disposed in the second pad area, and

the method further comprising bending the bending area in a way such that the second alignment pattern is aligned with the first alignment pattern.

11. The method of claim 1 , wherein

the base layer comprises a first alignment pattern, and

the circuit member comprises a second alignment pattern,

the method further comprising disposing the circuit member on a back surface of the base layer in a way such that the second alignment pattern is aligned with the first alignment pattern.

12. The method of claim 1 , wherein

the base layer is provided in plurality, and

the providing the base layer comprises:

providing a preliminary base layer, portions of which define base layers, respectively, on the carrier substrate; and

forming a connection portion connecting the base layers to each other by removing a portion of the preliminary base layer,

wherein the forming the connection portion and the forming the through hole are performed at the same time.

13. The method of claim 12 , further comprising:

separating the base layers from each other by cutting the connection portion.