Method of forming cooling holes
A method of forming a film cooling hole in a component having an internal surface and an external surface is disclosed herein that includes forming the component with a first feature on the external surface, measuring a geometry of the external surface to determine a first placement of the first feature, and drilling the film cooling hole through the component at the first placement.
1. A method of forming a film cooling hole in a component having an internal surface and an external surface, the method comprising:
forming the component with a first feature on the external surface and a second feature on an internal surface, the first feature being an indentation;
measuring a geometry of the external surface to determine a first placement of the first feature with the first placement being at a location of maximum depth of the first feature;
introducing thermal energy to the internal surface of the component;
measuring a change in temperature along the external surface as the component cools in response to the thermal energy to determine a second placement of the second feature using an algorithm that includes comparing a first temperature versus time response curve for a given wall thickness and material to a second temperature versus time response curve for a different wall thickness of the component in response to the introduction of thermal energy; and
drilling the film cooling hole through the component at the first placement to the second placement.
2. The method of claim 1 , wherein the measurement of the geometry of the external surface is performed using a structured light scanner.
3. The method of claim 1 , wherein the step of measuring the geometry of the external surface to determine the first placement of the first feature further comprises:
mapping the first placement of the first feature onto a computer model of the component.
4. The method of claim 1 , wherein the measurement of the change in temperature along the external surface to determine the second placement is performed using flash thermography and an infrared camera.
5. The method of claim 1 , wherein the step of measuring the change in temperature along the external surface to determine the second placement of the second feature further comprises:
mapping the second placement of the second feature onto a computer model of the component.
6. The method of claim 1 , wherein the step of forming the component with the second feature on the internal surface further comprises:
forming the second feature having an indentation.
7. The method of claim 1 , wherein the step forming the component with the first feature on the external surface further comprises:
forming the first feature having multiple lobes.
8. The method of claim 1 , wherein drilling the film cooling hole through the component at the first placement is performed using a laser.
9. The method of claim 1 , wherein drilling the film cooling hole through the component at the first placement is performed using electric discharge machining.
10. A method of forming a hole in a component with improved accuracy, the method comprising:
casting the component with the component having at least one external feature on an external surface with the at least one external feature being a first indentation;
determining a first placement of the first indentation;
casting the component with the component having at least one internal feature on an internal surface with the at least one internal feature being a second indentation;
determining a second placement of the second indentation by introducing thermal energy to the internal surface of the component and measuring a change in temperature along the external surface as the component cools in response to the thermal energy to determine a second placement of the second feature using an algorithm that includes comparing a first temperature versus time response curve for a given wall thickness and material to a second temperature versus time response curve for a different wall thickness of the component in response to the introduction of thermal energy; and
forming the hole through the component with the hole extending between the first placement and the second placement.
11. The method of claim 10 , wherein the step of determining a first placement of the at least one external feature is performed by a structured light scanner.
12. The method of claim 10 , further comprising:
mapping the first placement onto a computer model of the component.
13. The method of claim 10 , wherein the step of determining a second placement of the at least one internal feature is performed using thermography with a thermal imaging camera.
14. The method of claim 10 , further comprising:
mapping the second placement onto a computer model of the component.