Thin film transistor, method for fabricating the same, array substrate, and display panel

1. A thin film transistor, comprising: a first conductive layer on a base substrate; a first insulation layer on a side of the first conductive layer facing away from the base substrate; a second conductive layer on a side of the first insulation layer facing away from the first conductive layer; and an active layer arranged on a side of the first insulation layer facing the first conductive layer, and/or a side of the first insulation layer facing the second conductive layer; wherein the first conductive layer comprises: a first gate line extending in a first direction, a first gate connected with the first gate line, a first data line extending in a second direction, a first source connected with the first data line, and a first drain; wherein the second direction is perpendicular to the first direction, and the first data line or the first gate line is arranged with a first broken zone at their intersection; the second conductive layer comprises: a second gate line extending in the first direction, a second gate connected with the second gate line, a second data line extending in the second direction, a second source connected with the second data line, and a second drain; wherein the second data line or the second gate line is arranged with a second broken zone at their intersection, wherein orthographic projections of the second gate line, the second gate, the second data line, the second source, and the second drain of the second conductive layer onto the base substrate overlap respectively with orthographic projections of the first gate line, the first gate, the first data line, the first source, and the first drain of the first conductive layer onto the base substrate; and the first gate line is connected with the second gate line, the first data line is connected with the second data line, and the first drain is connected with the second drain, through via-holes.

2. The thin film transistor according to claim 1 , wherein a second insulation layer is arranged on a side of the second conductive layer facing away from the first insulation layer; and when the first gate line is arranged with the first broken zone, and the second data line is arranged with the second broken zone, a side of the first data line facing away from the first source is provided with first protrusions at two sides of the first broken zone, and the second data line is provided with second protrusions at regions thereof corresponding to the first protrusions; and the first gate line on the two sides of the first broken zone is bridged with the second gate line via a first electrode above the second insulation layer through via-holes, and the second data line on two sides of the second broken zone is bridged with the first protrusions of the first data line through the second protrusions, wherein the second protrusions are bridged with the first protrusions via a second electrode above the second insulation layer through via-holes.

3. The thin film transistor according to claim 1 , wherein a second insulation layer is arranged on a side of the second conductive layer facing away from the first insulation layer; and when the first gate line is arranged with the first broken zone, and the second data line is arranged with the second broken zone, a side of the first gate line facing away from the first gate is provided with third protrusions at two sides of the first broken zone, and the second gate line is provided with fourth protrusions at regions thereof corresponding to the third protrusions; and the first gate line on the two sides of the first broken zone is bridged with the fourth protrusions of the second gate line through the third protrusions, wherein the third protrusions are bridged with the fourth protrusions via a third electrode above the second insulation layer through via-holes; and the second data line on two sides of the second broken zone is bridged with the first data line via a fourth electrode above the second insulation layer through via-holes.

4. The thin film transistor according to claim 1 , wherein a second insulation layer is arranged on a side of the second conductive layer facing away from the first insulation layer; and when the first data line is arranged with the first broken zone, and the second gate line is arranged with the second broken zone, a side of the first data line facing away from the first source is provided with first protrusions at two sides of the first broken zone, and the second data line is provided with second protrusions at regions thereof corresponding to the first protrusions; and the first gate line on the two sides of the first broken zone is bridged with the second protrusions of the second data line through the first protrusions, wherein the first protrusions are bridged with the second protrusions via a second electrode above the second insulation layer through via-holes; and the second gate line on two sides of the second broken zone is bridged with the first gate line via a first electrode above the second insulation layer through via-holes.

5. The thin film transistor according to claim 1 , wherein a second insulation layer is arranged on a side of the second conductive layer facing away from the first insulation layer; and when the first data line is arranged with the first broken zone, and the second gate line is arranged with the second broken zone, a side of the first gate line facing away from the first gate is provided with third protrusions at two sides of the first broken zone, and the second gate line is provided with fourth protrusions at regions thereof corresponding to the third protrusions; and the first data line on the two sides of the first broken zone is bridged with the second data line via a fourth electrode above the second insulation layer through via-holes; and the second gate line on two sides of the second broken zone is bridged with the third protrusions of the first gate line through the fourth protrusions, wherein the fourth protrusions are bridged with the third protrusions via a third electrode above the second insulation layer through via-holes.

6. The thin film transistor according to claim 2 , wherein a pixel electrode is arranged on a side of the second insulation layer facing away from the second conductive layer, and the first electrode and the second electrode are arranged at a same layer as the pixel electrode.

7. The thin film transistor according to claim 4 , wherein a pixel electrode is arranged on a side of the second insulation layer facing away from the second conductive layer, and the first electrode and the second electrode are arranged at a same layer as the pixel electrode.

8. The thin film transistor according to claim 3 , wherein a pixel electrode is arranged on a side of the second insulation layer facing away from the second conductive layer, and the third electrode and the fourth electrode are arranged at a same layer as the pixel electrode.

9. The thin film transistor according to claim 5 , wherein a pixel electrode is arranged on a side of the second insulation layer facing away from the second conductive layer, and the third electrode and the fourth electrode are arranged at a same layer as the pixel electrode.

10. The thin film transistor according to claim 1 , wherein the first gate is connected with the second gate through a via-hole, and the first source is connected with the second source through a via-hole.

11. The thin film transistor according to claim 1 , wherein a material of the active layer is a metal oxide semiconductor.

12. The thin film transistor according to claim 11 , wherein the active layer is arranged on the side of the first insulation layer facing the first conductive layer, and a material of the first conductive layer is a conductive metal oxide or a metal.

13. The thin film transistor according to claim 1 , wherein a material of the second conductive layer is same as a material of the first conductive layer.

14. An array substrate, comprising a thin film transistor, wherein thin film transistor comprises: a first conductive layer on a base substrate; a first insulation layer on a side of the first conductive layer facing away from the base substrate; a second conductive layer on a side of the first insulation layer facing away from the first conductive layer; and an active layer arranged on a side of the first insulation layer facing the first conductive layer, and/or a side of the first insulation layer facing the second conductive layer; wherein the first conductive layer comprises: a first gate line extending in a first direction, a first gate connected with the first gate line, a first data line extending in a second direction, a first source connected with the first data line, and a first drain; wherein the second direction is perpendicular to the first direction, and the first data line or the first gate line is arranged with a first broken zone at their intersection; the second conductive layer comprises: a second gate line extending in the first direction, a second gate connected with the second gate line, a second data line extending in the second direction, a second source connected with the second data line, and a second drain; wherein the second data line or the second gate line is arranged with a second broken zone at their intersection, wherein orthographic projections of the second gate line, the second gate, the second data line, the second source, and the second drain of the second conductive layer onto the base substrate overlap respectively with orthographic projections of the first gate line, the first gate, the first data line, the first source, and the first drain of the first conductive layer onto the base substrate; and the first gate line is connected with the second gate line, the first data line is connected with the second data line, and the first drain is connected with the second drain, through via-holes.

15. The array substrate according to claim 14 , wherein a second insulation layer is arranged on a side of the second conductive layer facing away from the first insulation layer; and when the first gate line is arranged with the first broken zone, and the second data line is arranged with the second broken zone, a side of the first data line facing away from the first source is provided with first protrusions at two sides of the first broken zone, and the second data line is provided with second protrusions at regions thereof corresponding to the first protrusions, and the first gate line on the two sides of the first broken zone is bridged with the second gate line via a first electrode above the second insulation layer through via-holes, and the second data line on two sides of the second broken zone is bridged with the first protrusions of the first data line through the second protrusions, wherein the second protrusions are bridged with the first protrusions via a second electrode above the second insulation layer through via-holes; or, a side of the first gate line facing away from the first gate is provided with third protrusions at two sides of the first broken zone, and the second gate line is provided with fourth protrusions at regions thereof corresponding to the third protrusions, and the first gate line on the two sides of the first broken zone is bridged with the fourth protrusions of the second gate line through the third protrusions, wherein the third protrusions are bridged with the fourth protrusions via a third electrode above the second insulation layer through via-holes, and the second data line on two sides of the second broken zone is bridged with the first data line via a fourth electrode above the second insulation layer through via-holes; or, when the first data line is arranged with the first broken zone, and the second gate line is arranged with the second broken zone, a side of the first data line facing away from the first source is provided with first protrusions at two sides of the first broken zone, and the second data line is provided with second protrusions at regions thereof corresponding to the first protrusions, and the first gate line on the two sides of the first broken zone is bridged with the second protrusions of the second data line through the first protrusions, wherein the first protrusions are bridged with the second protrusions via a second electrode above the second insulation layer through via-holes, and the second gate line on two sides of the second broken zone is bridged with the first gate line via a first electrode above the second insulation layer through via-holes; or, a side of the first gate line facing away from the first gate is provided with third protrusions at two sides of the first broken zone, and the second gate line is provided with fourth protrusions at regions thereof corresponding to the third protrusion, and the first data line on the two sides of the first broken zone is bridged with the second data line via a fourth electrode above the second insulation layer through via-holes; and the second gate line on two sides of the second broken zone is bridged with the third protrusions of the first gate line through the fourth protrusions, wherein the fourth protrusions are bridged with the third protrusions via a third electrode above the second insulation layer through via-holes.

16. A display panel, comprising the array substrate according to claim 14 .

17. A method for fabricating the thin film transistor according to claim 1 , the method comprising:

forming the first conductive layer on the base substrate;

forming the first insulation layer on the side of the first conductive layer facing away from the base substrate; and

forming the second conductive layer on the side of the first insulation layer facing away from the first conductive layer;

wherein the method further comprises: before the first insulation layer is formed on the side of the first conductive layer facing away from the base substrate, forming the active layer on a side of the first conductive layer facing away from the base substrate; and/or,

before the second conductive layer is formed on the side of the first insulation layer facing away from the first conductive layer, forming the active layer on a side of the first insulation layer facing away from the first conductive layer.

18. The method according to claim 17 , wherein the method further comprises:

forming a second insulation layer on a side of the second conductive layer facing away from the first insulation layer; and

forming a pixel electrode layer on a side of the second insulation layer facing away from the second conductive layer.