IP Library › Granted Patent US 11,008,462
Granted Patent B2
US 11,008,462 · App. 16/605,886 · Granted May 18, 2021

Heat-conductive sheet

Inventor: Hiroki Kudoh (Kawaguchi, JP)
Assignee: SEKISUI POLYMATECH CO., LTD.
C08L83/04C08J5/18H01L23/36C08J2383/04C08K3/042C08K5/541C08K7/06C08K2201/001C08L2203/20
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Quick Facts
Patent No.
US 11,008,462
App. No.
16/605,886
Granted
May 18, 2021
Kind
B2
Abstract

A thermally conductive sheet contains a matrix composed of an organopolysiloxane having a crosslinked structure, a thermally conductive filler dispersed in the matrix, and a silicon compound. The silicon compound is at least one selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds.

Claims (12)

1. A thermally conductive sheet comprising:

a matrix composed of an organopolysiloxane having a crosslinked structure;

a thermally conductive filler comprising a graphitized carbon fiber dispersed in the matrix; and

at least one silicon compound selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds,

wherein a proportion of a mass of the silicon compound to a total mass of the matrix and the silicon compound is 0.1% by mass or more and 50% by mass or less, and

wherein the silicon compound comprises a compound in which a proportion of decrease in mass is in the range of 5% or more and 60% or less at a point in time when 60 min has passed from a heating start in a thermogravimetric analysis under a condition where temperature is elevated to 100° C. from a heating start temperature of 25° C. at a heating up rate of 10° C./min and then kept constant at 100° C.

2. The thermally conductive sheet according to claim 1 , wherein the silicon compound comprises the alkoxysilane compound, and

a proportion of the mass of the alkoxysilane compound to a total mass of the matrix and the alkoxysilane compound is 0.1% by mass or more and 10% by mass or less.

3. The thermally conductive sheet according to claim 1 , wherein the silicon compound comprises the alkoxysiloxane compound, and

a proportion of a mass of the alkoxysiloxane compound to a total mass of the matrix and the alkoxysiloxane compound is 5% by mass or more and 50% by mass or less.

4. The thermally conductive sheet according to claim 1 , wherein the silicon compound further comprises a compound in which a proportion of decrease in mass is less than 5% at a point in time when 60 min has passed from a heating start in a thermogravimetric analysis under a condition where temperature is elevated to 100° C. from a heating start temperature of 25° C. at a heating-up rate of 10° C./min and then kept constant at 100° C.

5. The thermally conductive sheet according to claim 1 , wherein the silicon compound comprises a compound having an alkyl group bonded to a silicon atom.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2019
From: KUDOH, HIROKI
To: SEKISUI POLYMATECH CO., LTD.
Reel/Frame 050748/0797 →
Priority Claims (1)
JP JP2017-125104 · Jun 27, 2017 · national
Continuity (1)
Related Publication 20200385577A1 · Dec 10, 2020
Cited By (1)
US 12,370,729