IP Library Granted Patent US 11,010,003
Granted Patent B2
US 11,010,003 · App. 16/731,348 · Granted May 18, 2021

Touch sensor module, window stack structure including the same and image display device including the same

Inventors: Chang Jun Maeng (Gyeonggi-do, KR); Heon Kim (Gyeonggi-do, KR); Hyun Min Shin (Gyeonggi-do, KR)
Assignee: DONGWOO FINE-CHEM CO., LTD.
G06F3/0443G02F1/133528G06F3/0412
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Quick Facts
Patent No.
US 11,010,003
App. No.
16/731,348
Granted
May 18, 2021
Kind
B2
Abstract

A touch sensor module includes a touch sensor layer including sensing electrodes and traces extending from the sensing electrodes, an optical layer on the touch sensor layer to cover the sensing electrodes, a circuit connection structure spaced apart from the optical layer and electrically connected to the traces on an end portion of the touch senor layer, and a colored resin pattern filling a gap between the optical layer and the circuit connection structure. An optical disturbance at the gap is prevented by the colored resin pattern.

Claims (26)

1. A touch sensor module, comprising:

a touch sensor layer comprising sensing electrodes and traces extending from the sensing electrodes;

an optical layer on the touch sensor layer to cover the sensing electrodes;

a circuit connection structure spaced apart from the optical layer and electrically connected to the traces on an end portion of the touch senor layer; and

a colored resin pattern filling a gap between the optical layer and the circuit connection structure;

wherein the touch sensor layer comprises an active region in which the sensing electrodes are arranged and a bonding region allocated at a peripheral end portion of the touch sensor layer, and the circuit connection structure are connected to the traces on the bonding region; and

the colored resin pattern at least partially fills a remaining portion of the bonding region except for a region on which the circuit connection structure is disposed in a planar view.

2. The touch sensor module according to claim 1 , wherein a top surface of the optical layer is higher than a top surface of the circuit connection structure.

3. The touch sensor module according to claim 2 , wherein the colored resin pattern contacts sidewalls of the optical layer and the circuit connection structure.

4. The touch sensor module according to claim 3 , wherein the colored resin pattern covers the top surface of the circuit connection structure.

5. The touch sensor module according to claim 4 , wherein the colored resin pattern does not cover the top surface of the optical layer.

6. The touch sensor module according to claim 1 ,

wherein the circuit connection structure is electrically connected to the end portions of the traces on the bonding region.

7. The touch sensor module according to claim 1 , wherein the optical layer includes at least one of a polarizer, a polarizing plate, a retardation film, a reflective sheet, a luminance enhancing film or a refractive index matching film.

8. The touch sensor module according to claim 1 , wherein the circuit connection structure includes a flexible printed circuit board (FPCB).

9. The touch sensor module according to claim 8 , further comprising a conductive intermediate structure interposed between the traces and the circuit connection structure.

10. The touch sensor module according to claim 9 , wherein a conductive intermediate structure includes an anisotropic conductive film (ACF).

11. The touch sensor module according to claim 1 , wherein the colored resin pattern includes an adhesive resin.

12. A window stack structure, comprising:

a window substrate; and

the touch sensor module according to claim 1 on the window substrate.

13. An image display device, comprising:

a display panel; and

the touch sensor module according to claim 1 on the display panel.

14. The image display device according to claim 13 , further comprising a main board disposed below the touch sensor module,

wherein the circuit connection structure of the touch sensor module is bent to be electrically connected to the main board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2019
From: MAENG, CHANG JUN; KIM, HEON; SHIN, HYUN MIN
To: DONGWOO FINE-CHEM CO., LTD.
Reel/Frame 051392/0368 →
Priority Claims (1)
KR 10-2019-0000839 · Jan 3, 2019 · national
Continuity (1)
Related Publication 20200218399A1 · Jul 9, 2020