IP Library › Granted Patent US 11,011,195
Granted Patent B2
US 11,011,195 · App. 16/357,181 · Granted May 18, 2021

Manufacturing method for multi-layer PZT microactuator having a poled but inactive PZT constraining layer

Inventors: Kuen Chee Ee (Chino, CA); Long Zhang (Murrieta, CA); Peter Hahn (Bangkok, TH); David Glaess (Bangkok, TH)
Assignee: Magnecomp Corporation
G11B5/483G11B5/4873G11B5/5552G11B5/56H01L41/25H01L41/257H01L41/293H01L41/297H01L41/312Y10T29/42
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Quick Facts
Patent No.
US 11,011,195
App. No.
16/357,181
Granted
May 18, 2021
Kind
B2
Abstract

A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer.

Claims (26)

1. A method of manufacturing a piezoelectric microactuator assembly, the method comprising:

forming a top electrode layer onto a top face of a PZT element;

placing a mask at different locations on the top electrode layer to form a space between at least two portions of mask;

applying a conductive epoxy in the space between the at least two portions of the mask;

applying a constraint layer to the conductive epoxy;

removing the mask leaving the constraint layer on the conductive epoxy;

forming a bottom electrode layer onto a bottom face of the PZT element opposite the top electrode layer; and

polarizing the PZT element to form an active piezoelectric layer.

2. The method of claim 1 , further comprising placing the PZT element onto a first transfer tape prior to forming the top electrode layer.

3. The method of claim 2 , further comprising removing the first transfer tape when removing the at least two masks.

4. The method of claim 1 , wherein the top electrode layer is formed by sputtering and/or electrodeposition.

5. The method of claim 1 , wherein the space between the at least two portions of the mask covers more than 50% of a surface of the top electrode.

6. The method of claim 1 , wherein the constraint layer includes unpoled piezoelectric material.

7. The method of claim 1 , wherein the constraint layer includes a stainless steel layer.

8. The method of claim 1 , further comprising applying a second transfer tape to the constraint layer after applying the constraint layer to the conductive epoxy.

9. The method of claim 1 , wherein the bottom electrode layer is formed by sputtering and/or electrodeposition.

10. The method of claim 1 , wherein the constraint layer includes silicon.

11. The method of claim 1 , wherein applying the constraint layer to the conductive epoxy includes bonding the constraint layer to the conductive epoxy without any additional layer between the constraint layer and the conductive epoxy, the constraint layer having a Young's modulus that is equal to or less than 50 GPa.

12. The method of claim 1 , wherein applying the constraint layer to the conductive epoxy includes bonding the constraint layer to the conductive epoxy without any additional layer between the constraint layer and the conductive epoxy, the constraint layer having a Young's modulus that is greater than 50 GPa.

13. The method of claim 1 , wherein the constraint layer has a Young's modulus of greater than 100 GPa.

14. The method of claim 1 , wherein the constraint layer has a Young's modulus of greater than 100 GPa and the constraint layer is applied directly to the conductive epoxy without any organic material between the conductive epoxy and the constraint layer.

15. The method of claim 1 , wherein the active piezoelectric layer has a first portion that is covered by the constraint layer and a second portion that is not covered by the constraint layer.

16. The method of claim 15 , further comprising disposing and electrically bonding an electrical connection to the active piezoelectric layer on the uncovered second portion.

17. The method of claim 16 , wherein the electrical connection on the uncovered second portion rises to a height that is no higher than the constraint layer.

18. The method of claim 1 , wherein the active piezoelectric layer is configured to be actuated by a voltage that causes the active piezoelectric layer to expand and bend in a direction that causes the top face of the PZT element to become net concave in shape.

19. The method of claim 1 , wherein the active piezoelectric layer is configured to be actuated by a voltage that causes the active piezoelectric layer to contract, the piezoelectric element bends in a direction that causes the top face of the PZT element to become net convex in shape.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2019
From: EE, KUEN CHEE; ZHANG, LONG; HAHN, PETER; GLAESS, DAVID
To: MAGNECOMP CORPORATION
Reel/Frame 049000/0286 →
Continuity (11)
Continuation 15682299 · Aug 21, 2017
Continuation 15227780 · Aug 3, 2016
Continuation In Part 15055618 · Feb 28, 2016
Continuation 14672122 · Mar 28, 2015
Continuation In Part 14214525 · Mar 14, 2014
Continuation In Part 14566666 · Dec 10, 2014
Provisional Application 61802972 · Mar 18, 2013
Provisional Application 61877957 · Sep 14, 2013
Provisional Application 62061074 · Oct 7, 2014
Provisional Application 62085471 · Nov 28, 2014
Related Publication 20190214042A1 · Jul 11, 2019
Cited By (1)
US 12,230,301