Antenna module and electronic device including the same

1. An antenna module, comprising:

an antenna package comprising a patch antenna;

an integrated circuit (IC) package comprising an IC;

a connection member configured such that a portion of the connection member is disposed between the antenna package and the IC package, and having a laminated structure electrically connecting the patch antenna to the IC; and

a chip antenna disposed on the connection member and comprising a first electrode electrically connected to the IC, a dielectric body disposed on a surface of the first electrode, and a second electrode spaced apart from the first electrode and disposed on the dielectric body,

wherein the connection member comprises a first region disposed between the antenna package and the IC package, and a second region extending farther than the antenna package in a direction different from a direction in which the connection member is laminated, and

wherein the chip antenna is disposed in the second region.

2. The antenna module of claim 1 , wherein the antenna package further comprises a dielectric layer, and

wherein the connection member further comprises an insulating layer having a flexibility greater than a flexibility of the dielectric layer.

3. The antenna module of claim 2 , wherein a portion of the insulating layer provides an arrangement space of the chip antenna, and

wherein the dielectric body has a flexibility greater than the flexibility of the dielectric layer.

4. The antenna module of claim 2 , wherein the connection member further comprises:

a first feed line electrically connecting the patch antenna and the IC to each other;

a second feed line electrically connecting the first electrode and the IC to each other; and

a ground layer disposed between at least a portion of each of the first and second feed lines and the patch antenna.

5. The antenna module of claim 4 , wherein a portion of the ground layer and a remaining portion of the ground layer are disposed in the first and second regions, respectively, and

the second electrode is electrically connected to the ground layer.

6. The antenna module of claim 4 , wherein the connection member further comprises a third region extending farther than the antenna package, in a direction different from the direction in which the second region extends, and

wherein the third region provides a layout space of a base signal line through which a base signal, having a frequency lower than a frequency within a bandwidth of the chip antenna, passes.

7. The antenna module of claim 4 , wherein the IC package further comprises:

a core member spaced apart from the IC, and comprising a core via and a core insulating layer;

a first electrical connection structure electrically connecting an end of the core via to the connection member; and

a second electrical connection structure electrically connected to another end of the core via.

8. The antenna module of claim 7 , wherein the IC package further comprises:

a plating member disposed on the core member; and

a heat slug disposed on an inactive surface of the IC and electrically connected to the plating member, and

wherein the IC is electrically connected to the connection member by an active surface of the IC.

9. The antenna module of claim 8 , wherein the IC package further comprises:

a passive component electrically connected to the connection member; and

an encapsulant sealing the IC and the passive component.

10. The antenna module of claim 2 , wherein the second region of the connection member comprises:

a rigid region providing a layout space of the chip antenna; and

a flex region connecting the first region of the connection member to the rigid region, and

wherein the flex region is more flexible than the rigid region.

11. The antenna module of claim 2 , further comprising a second chip antenna disposed in the second region and spaced apart from the chip antenna.

12. The antenna module of claim 2 , further comprising a second chip antenna spaced apart from the chip antenna,

wherein the connection member further comprises a third region extending farther than the antenna package, in a direction different from the direction in which the second region extends, and

wherein the connection member provides a layout space of the second chip antenna.

13. The antenna module of claim 1 , wherein the patch antenna comprises patch antenna patterns spaced apart from each other, and

wherein the antenna package further comprises feed vias electrically connected to the connection member and electrically connected to the patch antennas, respectively.

14. The antenna module of claim 13 , wherein the patch antenna further comprises:

coupling patch patterns spaced apart from each other and spaced apart from the patch antenna patterns; and

a coupling structure disposed to surround the patch antenna patterns.

15. An electronic device, comprising:

a case;

a set substrate disposed in the case; and

an antenna module disposed in the case and electrically connected to the set substrate, wherein the antenna module comprises:

an antenna package comprising a patch antenna;

an integrated circuit (IC) package comprising an IC;

a connection member configured such that a portion of the connection member is disposed between the antenna package and the IC package, and having a laminated structure electrically connecting the patch antenna to the IC; and

a chip antenna disposed on the connection member and comprising a first electrode electrically connected to the IC, a dielectric body disposed on a surface of the first electrode, and a second electrode spaced apart from the first electrode and disposed on the dielectric body,

wherein the connection member comprises a first region disposed between the antenna package and the IC package, and a second region extending farther than the antenna package in a direction different from a direction in which the connection member is laminated, and

wherein the chip antenna is disposed in the second region.

16. The electronic device of claim 15 , wherein the patch antenna is disposed such that a plane of the patch antenna faces an upper surface of the case or a lower surface of the case, and

wherein a distance by which the chip antenna is spaced from a side surface of the case is less than a distance by which the patch antenna is spaced from the side surface of case.

17. The electronic device of claim 15 , wherein the connection member further comprises a third region extending farther than the antenna package in a direction different from the direction in which the second region extends,

wherein the third region extends to the set substrate.

18. The electronic device of claim 17 , wherein the patch antenna is disposed such that a plane of the patch antenna faces a side surface of the case, and

wherein a distance by which the chip antenna is spaced from the side surface of the case is greater than a distance by which the patch antenna is spaced from the case.