Flexible substrate with bubble-prevention layer and display device including the same

1. A display device, comprising:

a display module configured to display an image;

a printed circuit board disposed below the display module; and

a flexible substrate bent to connect the display module to the printed circuit board, the flexible substrate comprising a first bonding region, a bending region, and a second bonding region, which are arranged in a specific direction when viewed in a plan view,

wherein the first bonding region is connected to the display module,

the second bonding region is connected to the printed circuit board,

the bending region is defined between the first and second bonding regions to connect the first bonding region to the second bonding region, and

the flexible substrate comprises:

a circuit layer electrically connecting the display module to the printed circuit board;

a cover layer disposed on the circuit layer; and

a bubble-prevention layer configured to move bubbles and exhaust them away from the flexible substrate, the bubble-prevention layer disposed between the cover layer and the circuit layer and configured to overlap with each of the first and second bonding regions,

wherein the bubble-prevention layer comprises a fine pattern formed on at least one surface contacting the cover layer or the circuit layer, the fine pattern comprising a plurality of protrusions and a space defined by gaps, dents, or grooves between the protrusions configured to remove a bubble from the space,

wherein the display module includes a display region configured to display the image and a non-display region surrounding the display region,

the non-display region includes a pad region to which the printed circuit board is connected, and

the bubble-prevention layer overlaps the pad region, and the bubble-prevention layer does not overlap the display area.

2. The display device of claim 1 , wherein the flexible substrate has a first thickness in each of the first and second bonding regions and has a second thickness, which is smaller than the first thickness, in at least a portion of the bending region.

3. The display device of claim 2 , wherein the bubble-prevention layer comprises:

first portions configured to overlap with the first and second bonding regions, respectively, and spaced apart from each other with the bending region interposed therebetween; and

a second portion disposed between the first portions and configured to overlap with the bending region, and

the second portion is thinner than each of the first portions.

4. The display device of claim 2 , wherein the cover layer and the circuit layer are disposed in direct contact with each other in the bending region.

5. The display device of claim 4 , wherein the bubble-prevention layer is configured to not overlap with the bending region.

6. The display device of claim 2 , wherein the bending region comprises a maximum stress region, and

a thickness of the flexible substrate is smaller in the maximum stress region than in other regions of the bending region.

7. The display device of claim 6 , wherein the bubble-prevention layer is configured to overlap with a region on the flexible substrate other than the maximum stress region.

8. The display device of claim 1 , wherein the bubble-prevention layer comprises a plurality of bubble-prevention patterns disposed in each of the first and second bonding regions.

9. The display device of claim 8 , wherein the bubble-prevention patterns are arranged to have a stripe shape on each of the first and second bonding regions.

10. The display device of claim 9 , wherein the bubble-prevention patterns extend in a direction perpendicular to the specific direction.

11. The display device of claim 9 , wherein the bubble-prevention patterns are arranged in a direction perpendicular to the specific direction.

12. The display device of claim 1 , wherein the cover layer comprises an electromagnetic interference shielding layer.

13. The display device of claim 1 , wherein the cover layer comprises a metallic material.

14. The display device of claim 1 , wherein the cover layer comprises a protection layer disposed to protect the circuit layer.

15. The display device of claim 1 , wherein the flexible substrate comprises a plurality of flexible substrates, and

at least one of the plurality of flexible substrates is configured to provide an input signal, which is provided to the display module from an outside of the display module, to the printed circuit board.

16. The display device of claim 15 , wherein the display module comprises:

a display layer comprising a plurality of organic light emitting devices; and

an input sensing layer disposed on the display layer, the input sensing layer comprising a plurality of sensing electrodes configured to sense the input signal, and

the flexible substrates are arranged side-by-side on a same surface of the display module.

17. The display device of claim 15 , wherein the display module comprises:

a display panel configured to display the image; and

an input sensing panel disposed on the display panel, wherein the input sensing panel comprises a plurality of sensing electrodes configured to sense the input signal.

18. The display device of claim 17 , wherein the plurality of flexible substrate comprises:

a first flexible substrate configured to connect the display panel to the printed circuit board; and

a second flexible substrate configured to connect the input sensing panel to the printed circuit board.

19. The display device of claim 1 , wherein a thickness of the bubble-prevention layer ranges from about 25 μm to about 35 μm.

20. The display device of claim 1 , wherein a thickness of the cover layer ranges from about 25 μm to about 35 μm.

21. A display device, comprising:

a display module configured to display an image;

a printed circuit board disposed below the display module; and

a flexible substrate comprising two opposite ends that are connected to the display module and the printed circuit board, respectively,

wherein the flexible substrate comprises:

a circuit layer comprising two opposite ends, which are in contact with the display module and the printed circuit board, respectively, thereby connecting the display module electrically to the printed circuit board;

a bubble-prevention layer configured to move bubbles and exhaust them away from the flexible substrate, the bubble-prevention layer disposed on the two opposite ends of the circuit layer; and

a cover layer disposed on the circuit layer and the bubble-prevention layer to cover the circuit layer and the bubble-prevention layer,

wherein at least a portion of the flexible substrate positioned between the two opposite ends of the flexible substrate is bent to form a bent portion, and

wherein a thickness of the bent portion of the flexible substrate is smaller than a thickness of each of the two opposite ends of the flexible substrate,

wherein the bubble-prevention layer comprises a fine pattern formed on at least one surface contacting the cover layer or the circuit layer, the fine pattern comprising a plurality of protrusions and a space defined by gaps, dents, or grooves between the protrusions configured to remove a bubble from the space,

wherein the display module includes a display region configured to display the image and a non-display region surrounding the display region,

the non-display region includes a pad region to which the printed circuit board is connected, and

the bubble-prevention layer overlaps the pad region, and the bubble-prevention layer does not overlap the display area.

22. The display device of claim 21 , wherein the bubble-prevention layer is configured to increase an adhesion strength between the circuit layer and the cover layer.

23. A display device, comprising:

a display module configured to display an image;

a printed circuit board disposed below the display module; and

a flexible substrate comprising at least one bent portion to connect the display module to the printed circuit board,

wherein the flexible substrate comprises:

a circuit layer comprising a plurality of signal lines;

a bubble-prevention layer configured to move bubbles and exhaust them away from the flexible substrate, the bubble-prevention layer comprising a pair of patterns, which are provided at two opposite ends of the flexible substrate and are spaced apart from each other; and

a cover layer disposed on the circuit layer and the bubble-prevention layer to cover the circuit layer and the bubble-prevention layer,

wherein the bubble-prevention layer comprises a fine pattern formed on at least one surface contacting the cover layer or the circuit layer, the fine pattern comprising a plurality of protrusions and a space defined by gaps, dents, or grooves between the protrusions configured to remove a bubble from the space,

wherein the display module includes a display region configured to display the image and a non-display region surrounding the display region,

the non-display region includes a pad region to which the printed circuit board is connected, and

the bubble-prevention layer overlaps the pad region, and the bubble-prevention layer does not overlap the display area.

24. The display device of claim 23 , wherein the circuit layer and the cover layer are disposed in direct contact with each other in the at least one bent portion of the flexible substrate.

25. The display device of claim 23 , wherein the cover layer comprises a metallic material.

26. A flexible substrate for a display module, comprising:

a circuit layer comprising a plurality of signal lines and having a flexible property;

a cover layer disposed on the circuit layer; and

a bubble-prevention layer configured to move bubbles and exhaust them away from the flexible substrate, the bubble-prevention layer disposed between the cover layer and the circuit layer, wherein:

the circuit layer comprises bonding regions, which are electrically coupled to a printed circuit board or driving devices, and a bending region, which is at least partially bent,

the bubble-prevention layer is disposed on the bonding regions,

a thickness of the flexible substrate is greater in the bonding regions than in the bending region, and

the bubble-prevention layer comprises a fine pattern formed on at least one surface contacting the cover layer or the circuit layer, the fine pattern comprising a plurality of protrusions and a space defined by gaps, dents, or grooves between the protrusions configured to remove a bubble from the space,

wherein the display module includes a display region configured to display the image and a non-display region surrounding the display region,

the non-display region includes a pad region to which the printed circuit board is connected, and

the bubble-prevention layer overlaps the pad region, and the bubble-prevention layer does not overlap the display area.