Circuit board and method for manufacturing the same
A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer.
1. A circuit board comprising:
a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and
second layers containing non-fusible fluororesin that are arranged on two surfaces of the first layer.
2. The circuit board according to claim 1 , wherein the fluororesin included in the second layers contains inorganic fine particles.
3. The circuit board according to claim 2 , further comprising third layers containing non-fusible fluororesin that cover the second layers.
4. The circuit board according to claim 1 , wherein tetrafluoroethylene-perfluoroalkoxyethylene copolymer resin (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-ethylene copolymer (ETFE), vinylidene fluoride resin (PVDF), chlorotrifluoroethylene resin (CTFE), or a combination thereof is used as the fusible fluororesin.
5. The circuit board according to claim 1 , wherein polytetrafluoroethylene (PTFE) is used as the non-fusible fluororesin.
6. The circuit board according to claim 1 ,
wherein the fluororesin included in the second layers contains inorganic fine particles, and
a mixing ratio between the fluororesin and the inorganic fine particles included in the second layer is 5:5 to 3:7 when expressed as a volume ratio.
7. A method for manufacturing a circuit board, comprising:
forming a first layer by impregnating a fiber base material with a dispersion liquid of fusible fluororesin and heating the fiber base material at a temperature lower than the melting point of the fusible fluororesin; and
forming second layers containing non-fusible fluororesin on two surfaces of the first layer.
8. The method for manufacturing a circuit board according to claim 7 , wherein the fluororesin included in the second layers contains inorganic fine particles.
9. The method for manufacturing a circuit board according to claim 8 , wherein a mixing ratio between the fluororesin and the inorganic fine particles included in the second layer is 5:5 to 3:7 when expressed as a volume ratio.
10. The method for manufacturing a circuit board according to claim 8 , the method further comprising forming third layers containing non-fusible fluororesin that cover the second layers.