Polymeric adhesive for anchoring compliant materials to another surface
Methods, compositions, and kits for adhering polymers and other materials to another material, and in particular to bone or bone-like structures or surfaces. A composition of matter includes a urethane dimethacrylate-methyl methacrylate copolymer with a plurality of first polymer regions based on urethane dimethacrylate and a plurality of second polymer regions based on methyl methacrylate. The method includes placing an orthopedic joint implant having an attachment surface in a joint space, applying a first non-urethane-containing precursor, a second urethane-containing precursor, and a initiator to the attachment surface; contacting the first and second precursors and the initiator with the joint surface; and copolymerizing the first and second precursors and forming an adhesive copolymer and attaching the implant to the joint.
1. A device comprising: (a) a polymeric implant, (b) a metal or ceramic material, and (c) a urethane dimethacrylate-methyl methacrylate copolymer adhering the polymeric implant to the metal or ceramic material, the urethane dimethacrylate-methyl methacrylate copolymer comprising a plurality of first polymer regions based on urethane dimethacrylate and a plurality of second polymer regions based on methyl methacrylate.
2. The device of claim 1 , wherein the plurality of first polymer regions based on urethane dimethacrylate comprises a plurality of hard segments and soft segments.
3. The device of claim 1 , wherein the implant is an orthopedic joint implant comprising a polyurethane IPN or a polyurethane semi-IPN.
4. The device of claim 1 , wherein the implant is an orthopedic joint implant comprising a polyether urethane IPN or a polyether urethane semi-IPN.
5. The device of claim 1 , wherein the first polymer regions based on urethane dimethacrylate comprise about 60%-99% (w/w) of the copolymer and the second polymer regions based on methyl methacrylate comprise about 1%-40% (w/w) of the copolymer.
6. The device of claim 1 , wherein the first polymer regions based on urethane dimethacrylate comprise about 60%-80% (w/w) of the copolymer and the second polymer regions based on methyl methacrylate comprise about 20%-40% (w/w) of the copolymer.
7. The device of claim 2 , wherein the hard segment of the first polymer region based on urethane dimethacrylate comprises one or more of: 1,5 naphthalene diisocyanate (NDI), 2,6 toluene diisocyanate or 2,4 toluene diisocyanate (TDI), 3,3-bitoluene diisocyanate (TODI), cyclohexyl diisocyanate (CHDI), hexamethyl diisocyanate (HDI), isophorone diisocyanate (IPDI), methylene bis(p-phenyl) isocyanate, methylene diphenylisocyanate (MDI), and methylene bis (p-cyclohexyl isocyanate) (HMDI).
8. The device of claim 2 , wherein the soft segment of the first polymer region based on urethane dimethacrylate comprises one or more of: polybutadiene, polyethylene oxide (PEO), hydroxy terminated butadiene, hydroxybutyl terminated polydimethylsiloxane (PDMS), hydroxyl terminated polyisobutylene, poly (1,6 hexyl 1,2 ethyl carbonate), polycaprolactone, polycarbonate, polyethylene adipate, polyhexamethylene carbonate glycol, polypropylene oxide (PPO), polytetramethylene adipate, poly(dimethylsiloxane), and poly(tetramethylene oxide) (PTMO).
9. The device of claim 2 , wherein the hard segment of the first polymer region based on the urethane dimethacrylate comprises methylene diphenylisocyanate (MDI) and the soft segment of the first polymer region based on the urethane dimethacrylate comprises poly(tetramethylene oxide) (PTMO).
10. The device of claim 1 , wherein the urethane dimethacrylate-methyl methacrylate copolymer defines a compressive modulus between about 30 MPa and about 2000 MPa.
11. The device of claim 1 , wherein the urethane dimethacrylate-methyl methacrylate copolymer defines a tensile modulus between about 30 MPa and 2000 MPa.
12. The device of claim 1 , wherein the urethane dimethacrylate-methyl methacrylate copolymer defines a tensile failure strain between about 25% and about 200%.
13. The device of claim 1 , further comprising a radiopaque material.
14. A method of adhering a polymeric implant to a metal or ceramic material comprising copolymerizing a mixture containing a first non-urethane-containing precursor, a second urethane-containing precursor, and an initiator to form an adhesive copolymer comprising a non-urethane-containing portion based on the first precursor and a urethane-containing portion based on the second precursor, wherein the adhesive copolymer is a urethane dimethacrylate-methyl methacrylate copolymer that comprises a plurality of first polymer regions based on urethane dimethacrylate and a plurality of second polymer regions based on methyl methacrylate.
15. The method of claim 14 , wherein the mixture further comprises an accelerator and an inhibitor.
16. The method of claim 14 , wherein the initiator comprises a free-radical initiator.
17. The method of claim 14 , wherein the free-radical initiator comprises a photoinitiator, a thermal initiator, or both.
18. The method of claim 17 , wherein the initiator comprises a photoinitiator, and wherein the method comprises projecting light onto the photoinitiator thereby activating the photoinitiator and copolymerize the first non-urethane-containing precursor with the second urethane-containing precursor to form the adhesive copolymer.
19. The method of claim 18 , wherein projecting light includes projecting a blue light, a UV light or a broad spectrum light.
20. The method of claim 18 , wherein the polymeric implant includes a semi-transparent material, and projecting light includes projecting light through at least a portion of the semi-transparent material.