Systems and methods for providing heat-rejecting media on a cable assembly
An active device module may include an active device, a housing configured to house the active device, and heat-rejecting media thermally coupled to the active device and mechanically coupled to the housing such that when the active device module is coupled to an input/output interface of an information handling system, at least a portion of the heat-rejecting media resides external to a chassis enclosing components of the information handling system such that physical shape and size of the heat-rejecting media is not constrained by the chassis.
1. An active device module, comprising:
an active device;
a cable coupled to the active device;
a housing configured to house the active device; and
heat-rejecting media thermally coupled to the active device and mechanically coupled to the housing such that when the active device module is coupled to an input/output interface of an information handling system:
at least a portion of the heat-rejecting media resides external to a chassis enclosing components of the information handling system such that physical shape and size of the heat-rejecting media is not constrained by the chassis; and
the heat rejecting media dissipates heat generated internal to the chassis by the active device;
wherein the heat-rejecting media is integrated within a strain relief feature configured to provide strain relief to the cable, such that a plurality of fins of the heat-rejecting media are parallel to an axis of the cable and extend along the cable for a selected distance external to the chassis, such that air exhausted from the chassis is operable to flow along the plurality of fins.
2. The active device module of claim 1 , wherein the heat-rejecting media comprises a heatsink.
3. The active device module of claim 2 , wherein the heat-rejecting media further comprises a heat spreader mechanically coupled to the housing and thermally coupled to the heatsink.
4. The active device module of claim 1 , wherein the strain relief feature is configured to provide mechanical support of an extension of the housing to which the heat-rejecting media is mechanically coupled.
5. The active device module of claim 1 , wherein the heat-rejecting media comprises:
a thermally-conductive plate mechanically and thermally coupled to the housing; and
an extension of thermally-conductive material mechanically and thermally coupled to the thermally-conductive plate wrapped around the cable such that the extension of thermally-conductive material conforms to a shape and a position of the cable.
6. The active device module of claim 1 , wherein the heat-rejecting media comprises:
a thermally-conductive wire thermally coupled to the active device;
one or more thermally-conductive fins thermally coupled to the thermally-conductive wire; and
an overmold surrounding the cable and thermally-conductive wire such that the fins are exposed and extend from the combination of the overmold and the cable.
7. A method for making an active device module comprising:
housing an active device within a housing;
communicatively coupling a cable to the active device; and
mechanically coupling heat-rejecting media to the housing and thermally coupling the heat-rejecting media to the active device such that when the active device module is coupled to an input/output interface of an information handling system:
at least a portion of the heat-rejecting media resides external to a chassis enclosing components of the information handling system such that physical shape and size of the heat-rejecting media is not constrained by the chassis; and
the heat-rejecting media dissipates heat generated internal to the chassis by the active device;
wherein the heat-rejecting media is integrated within a strain relief feature configured to provide strain relief to the cable, such that a plurality of fins of the heat-rejecting media are parallel to an axis of the cable and extend along the cable for a selected distance external to the chassis, such that air exhausted from the chassis is operable to flow along the plurality of fins.
8. The method of claim 7 , wherein the heat-rejecting media comprises a heatsink.
9. The method of claim 8 , wherein the heat-rejecting media further comprises a heat spreader mechanically coupled to the housing and thermally coupled to the heatsink.
10. The method of claim 7 , wherein the strain relief feature is configured to provide mechanical support of an extension of the housing to which the heat-rejecting media is mechanically coupled.
11. The method of claim 7 , wherein the heat-rejecting media comprises:
a thermally-conductive plate mechanically and thermally coupled to the housing; and
an extension of thermally-conductive material mechanically and thermally coupled to the thermally-conductive plate wrapped around the cable such that the extension of thermally-conductive material conforms to a shape and a position of the cable.
12. The method of claim 7 , wherein the heat-rejecting media comprises:
a thermally-conductive wire thermally coupled to the active device;
one or more thermally-conductive fins thermally coupled to the thermally-conductive wire; and
an overmold surrounding the cable and thermally-conductive wire such that the fins are exposed and extend from the combination of the overmold and the cable.