Underfill control structures and method
A semiconductor device and method of reducing the risk of underbump metallization poisoning from the application of underfill material is provided. In an embodiment a spacer is located between a first underbump metallization and a second underbump metallization. When an underfill material is dispensed between the first underbump metallization and the second underbump metallization, the spacer prevents the underfill material from creeping towards the second underbump metallization. In another embodiment a passivation layer is used to inhibit the flow of underfill material as the underfill material is being dispensed.
1. A semiconductor device comprising:
a first surface device located within a first opening, wherein the first opening extends through passivation layer;
an underfill material within the first opening, wherein the underfill material extends below a topmost surface of the passivation layer; and
an external connector extending through the passivation layer to make physical contact with a first portion of a redistribution layer, a second portion of the redistribution layer being in electrical contact with the first surface device, the external connector is separated from the first opening by the passivation layer.
2. The semiconductor device of claim 1 , wherein the first surface device is separated from the external connector by a distance of between about 50 μm and about 1000 μm.
3. The semiconductor device of claim 2 , wherein the first surface device is separated from the external connector by a distance of between about 50 μm and about 300 μm.
4. The semiconductor device of claim 2 , further comprising a second external connector extending through the passivation layer, wherein the second external connector is separated from the first surface device by a distance of between about 50 μm and about 1000 μm.
5. The semiconductor device of claim 4 , wherein the second external connector is separated from the first surface device by a distance of between about 50 μm and about 300 μm.
6. The semiconductor device of claim 1 , wherein the underfill material extends out of the first opening.
7. The semiconductor device of claim 1 , wherein the external connector comprises:
an underbump metallurgy (UBM) extending through the passivation layer; and
a solder region on the UBM.
8. The semiconductor device of claim 1 , wherein the external connector comprises a solder region extending through the passivation layer to the first portion of the redistribution layer.
9. The semiconductor device of claim 1 , wherein a sidewall of the underfill material extends between a sidewall of the first opening and a sidewall of the redistribution layer.
10. A package comprising:
a semiconductor die encapsulated in a molding compound;
a redistribution structure over the semiconductor die and the molding compound, wherein the redistribution structure comprises:
a redistribution line; and
a passivation layer covering a first portion of the redistribution line and exposing a second portion of the redistribution line;
an external connector extending through the passivation layer to the first portion of the redistribution line;
a surface device directly bonded to the second portion of the redistribution line; and
an underfill between the redistribution structure and the surface device, wherein the underfill extends below a top surface of the passivation layer.
11. The package of claim 10 , wherein the underfill covers a top surface of the second portion of the redistribution line.
12. The package of claim 10 , wherein the underfill contacts a sidewall of the passivation layer.
13. The package of claim 12 , wherein the sidewall of the passivation layer surrounds the underfill in a top down view.
14. The package of claim 12 , wherein the sidewall of the passivation layer separates external connector from the underfill.
15. The package of claim 10 , further comprising a through via extending through the molding compound adjacent the semiconductor die.
16. The package of claim 10 , wherein the surface device is a passive device.
17. A package comprising:
a die encapsulated in a molding compound:
a redistribution line over and electrically connected to the die;
a passivation layer partially covering the redistribution line;
a passive device bonded to the redistribution line; and
an underfill between the redistribution line and the passive device, wherein the underfill extends below a topmost surface of the passivation layer, and wherein a sidewall of the passivation layer surrounds the underfill in a top down view.
18. The package of claim 17 further comprising an external connector extending through the passivation layer to the redistribution line, wherein the passivation layer separates the external connector from the underfill.
19. The package of claim 17 , wherein the underfill contacts the sidewall of the passivation layer.
20. The package of claim 17 , wherein the underfill contacts a top surface of the redistribution line.