IP Library Granted Patent US 11,019,243
Granted Patent B2
US 11,019,243 · App. 16/616,208 · Granted May 25, 2021

Camera unit and mobile body

Inventors: Tomonori Agawa (Kanagawa, JP); Eiji Oba (Tokyo, JP); Hiroo Suzuki (Kanagawa, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H04N5/2257G02B7/025H04N5/2254
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Quick Facts
Patent No.
US 11,019,243
App. No.
16/616,208
Granted
May 25, 2021
Kind
B2
Abstract

The present technology relates to a camera unit and a mobile body capable of improving Electromagnetic Compatibility (EMC) performance. The camera unit includes a shield arranged at least on a side of one side surface of a sensor substrate to which an image sensor is attached and a contact portion that has conductivity and is provided on the sensor substrate so as to have contact with a portion on a side of a side surface of the sensor substrate of the shield. The present technology is applied to, for example, a camera unit or the like mounted on a mobile body such as a vehicle.

Claims (37)

1. A camera unit, comprising:

a sensor substrate;

an image sensor on a specific surface of the sensor substrate;

a first shield on a plurality of sides of the specific surface of the sensor substrate; and

a plurality of contact portions on the specific surface of the sensor substrate, wherein

the plurality of contact portions has conductivity,

a first contact portion of the plurality of contact portions is on a first end of the specific surface of the sensor substrate,

a second contact portion of the plurality of contact portions is on a second end of the specific surface of the sensor substrate,

the first end is opposite to the second end,

the first contact portion is in contact with a first portion of the first shield,

the second contact portion is in contact with a second portion of the first shield, and

the first portion of the first shield is on at least a side of the plurality of sides of the specific surface of the sensor substrate.

2. The camera unit according to claim 1 , further comprising a second shield on the specific surface of the sensor substrate, wherein

the second shield is different from the first shield, and

the sensor substrate is configured to receive light on the specific surface.

3. The camera unit according to claim 2 , wherein the second shield includes an opening through which the light enters the image sensor.

4. The camera unit according to claim 1 , further comprising a lens unit configured to collect light to the image sensor, wherein the lens unit is attachable to the sensor substrate with adhesive.

5. The camera unit according to claim 1 , wherein

the plurality of contact portions is configured to bias the first shield, and

the first contact portion of the plurality of contact portions is in contact with the first portion of the first shield based on the bias of the first shield.

6. The camera unit according to claim 1 , wherein

the first shield includes a plurality of holes, and

contact state between each contact portion of the plurality of contact portions and the first shield is viewable through a respective hole of the plurality of holes.

7. A mobile body, comprising:

a driving system control unit configured to control driving of the mobile body; and

a camera unit, wherein the camera unit includes:

a sensor substrate;

an image sensor on a specific surface of the sensor substrate;

a shield on a plurality of sides of the specific surface of the sensor substrate; and

a plurality of contact portions on the specific surface of the sensor substrate, wherein

the plurality of contact portions has conductivity,

a first contact portion of the plurality of contact portions is on a first end of the specific surface of the sensor substrate,

a second contact portion of the plurality of contact portions is on a second end of the specific surface of the sensor substrate,

the first end is opposite to the second end,

the first contact portion is in contact with a first portion of the shield,

the second contact portion is in contact with a second portion of the shield, and

the first portion of the shield is on at least a side of the plurality of sides of the specific surface of the sensor substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2020
From: AGAWA, TOMONORI; OBA, EIJI; SUZUKI, HIROO
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 051642/0807 →
Priority Claims (1)
JP JP2017-106646 · May 30, 2017 · national
Continuity (1)
Related Publication 20200195822A1 · Jun 18, 2020