Lens heating systems and methods for an LED lighting system
Systems and methods for lighting system lens heating are described. The systems and methods include a substantially clear thermoplastic substrate; and a conductive ink or film circuit on the thermoplastic substrate.
1. A lens heating system comprising:
a substantially clear thermoplastic substrate;
a conductive ink or film circuit, positioned on the thermoplastic substrate to heat the thermoplastic substrate;
a lens heater circuit including a circuit board and a lens heater, operatively coupled to a lens heater controller, the controller configured to:
determine a temperature associated with an outer lens surface; and
activate the lens heater in response to a determination that the temperature is less than or equal to a threshold temperature; and
a spring connector comprising a plurality of pins, the pins configured to couple to the conductive ink or film circuit, the pins further configured to provide an electrical connection between the pins and the conductive ink or film circuit, and the spring connector being surface-mounted to the circuit board.
2. The system of claim 1 , wherein the controller is coupled to a thermistor, the thermistor configured to determine the temperature associated with the outer lens surface.
3. The system of claim 2 , wherein the thermistor is a negative temperature coefficient (NTC) thermistor.
4. The system of claim 1 , wherein the spring connectors are positioned at least partially within a lens coupled to the substantially clear thermoplastic substrate.
5. The system of claim 1 , further comprising a second spring connector coupled to a second busbar of the conductive ink or film circuit, and wherein the spring connector is coupled to a first busbar of the conductive ink or film circuit.
6. A method for heating a lens of a lighting system, the method comprising:
applying a conductive ink or film circuit on a substantially clear thermoplastic substrate;
applying the conductive ink or film circuit on the substantially clear thermoplastic substrate to at least one of an interior lens side and an exterior lens side;
positioning a spring connector comprising a plurality of pins against the conductive ink or film circuit, and establishing an electrical connection between the pins and the conductive ink or film circuit;
positioning the spring connector at least partially within the lens coupled to the substantially clear thermoplastic substrate; and
applying a controlled power to the conductive ink or film circuit to heat the lens.
7. The method of claim 6 , wherein the positioning comprises:
moving the spring connector towards the conductive ink or film circuit until the pins have flexed a predetermined amount corresponding to establishing the electrical connection.
8. The method of claim 6 further comprising:
receiving a value from a wireless module; and
supplying power to the conductive ink or film circuit based on the value.
9. The method of claim 6 further comprising:
receiving a value from a speed sensor;
determining the speed value is above a predetermined threshold; and
supplying, in response to determining the speed value is above the predetermined threshold, a predetermined amount of power to the conductive ink or film circuit.
10. The method of claim 6 further comprising:
receiving a value from an optical sensor;
determining the optical value is below a predetermined threshold; and
supplying, in response to determining the optical value is below the predetermined threshold, a predetermined amount of power to the conductive ink or film circuit.
11. A heated lighting system comprising:
a substantially clear thermoplastic substrate;
a conductive ink or film circuit, positioned on the thermoplastic substrate to heat the thermoplastic substrate;
a lens in contact with the thermoplastic substrate; and
a interconnect assembly including a plurality of spring connectors, the spring connectors positioned in contact with the conductive ink or film circuit, and the interconnect assembly positioned at least partially within the lens.
12. The system of claim 11 , wherein the interconnect assembly is configured to supply power to the conductive ink or film circuit.
13. The system of claim 11 , wherein the lens is bonded to at least a portion of the interconnect assembly and at least a portion of the thermoplastic substrate.
14. The system of claim 11 , wherein the conductive ink or film circuit is positioned on an exterior surface of the lens.
15. The system of claim 11 , wherein the lens is constructed from a thermoplastic polymer.
16. A lens heating system comprising:
a substantially clear thermoplastic substrate;
a conductive ink or film circuit, positioned on the thermoplastic substrate to heat the thermoplastic substrate;
a lens heater circuit including a lens heater operatively coupled to a lens heater controller, the controller configured to:
determine a temperature associated with an outer lens surface; and
activate the lens heater in response to a determination that the temperature is less than or equal to a threshold temperature; and
a spring connector comprising a plurality of pins, the pins configured to couple to the conductive ink or film circuit, the pins further configured to provide an electrical connection between the pins and the conductive ink or film circuit,
wherein the spring connector is positioned at least partially within a lens coupled to the substantially clear thermoplastic substrate.
17. The system of claim 16 , wherein the controller is coupled to a thermistor, the thermistor configured to determine the temperature associated with the outer lens surface.
18. The system of claim 17 , wherein the thermistor is a negative temperature coefficient (NTC) thermistor.
19. The system of claim 16 , further comprising a second spring connector coupled to a second busbar of the conductive ink or film circuit, and wherein the spring connector is coupled to a first busbar of the conductive ink or film circuit.
20. The system of claim 16 , wherein the lens heater circuit further comprises a circuit board, the spring connector being surface-mounted to the circuit board.
21. A lens heating system comprising:
a substantially clear thermoplastic substrate;
a conductive ink or film circuit, positioned on the thermoplastic substrate to heat the thermoplastic substrate;
a spring connector comprising a plurality of pins, the pins configured to couple to the conductive ink or film circuit, the pins further configured to provide an electrical connection between the pins and the conductive ink or film circuit; and
a lens heater circuit including a lens heater operatively coupled to a lens heater controller, the controller configured to:
determine a temperature associated with an outer lens surface;
activate the lens heater in response to a determination that the temperature is less than or equal to a threshold temperature;
receive at least one sensor value from at least one of a speed sensor and an optical sensor;
determine the at least one sensor value is below a predetermined threshold; and
supply, in response to determining the at least one sensor value is below the predetermined threshold, a predetermined amount of power to the conductive ink or film circuit.