Interface-free thermal management system for high power devices co-fabricated with electronic circuit
A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
1. A thermal-interface-material (TIM)-free thermal management apparatus, comprising:
a thermally-conductive unitary structure comprising:
an integrated circuit (IC) side;
a cooling system side oppositely disposed from the IC side;
a plurality of micro-pillars extending outwardly from the IC side, wherein the micro-pillars comprise a height in a range of 10 micrometers to 1000 micrometers and a diameter in a range of 1 micrometer to 50 micrometers; and
a cooling system extending from the cooling system side, the cooling system selected from the group: a vapor chamber, a micro-channel cooler, a jet-impingement chamber, or an air-cooled heat sink;
wherein the IC side, the cooling system side, the cooling system, and the plurality of micro-pillars or porous structures are parts of a monolithic body without a thermal-interface-material in between the parts.
2. The apparatus of claim 1 , wherein the cooling system is a jet impingement cooler and wherein the unitary structure further comprises:
an array of jets disposed in complementary opposition to a heat acquisition surface within the jet impingement cooler.
3. The apparatus of claim 1 , further comprising:
a device configured to emit heat seated on the plurality of micro-pillars.
4. The apparatus of claim 1 , wherein the thermally-conductive unitary structure further comprises an electrical circuit portion.
5. An apparatus, comprising:
an integrated and unitary body of homogenous material having:
an integrated circuit (IC) layer;
a plurality of micro-pillars extending from the IC layer, wherein the micro-pillars comprise a height in a range of 10 micrometers to 1000 micrometers and a diameter in a range of 1 micrometer to 50 micrometers;
a first heat exchange layer in thermal communication with the integrated circuit layer, the first heat exchange layer selected from the group: a vapor chamber, a micro-channel cooler, a jet-impingement cooler, or an air-cooled heat sink; and
a second heat exchange layer in thermal communication with the first heat exchange layer, the second heat exchange layer selected from the group comprising a plurality of fins or tabs,
wherein the IC layer, the first heat exchange layer, and second heat exchange layer are parts of a monolithic body without a thermal-interface-material in between the parts.
6. The apparatus of claim 1 , further comprising a solder layer deposited on the micro-pillars.
7. The apparatus of claim 1 , wherein the thermally-conductive unitary structure is formed by additive manufacturing.
8. The apparatus of claim 1 , wherein the micro-pillars are configured to elastically deform along a length responsive to a heat differential.
9. The apparatus of claim 5 , further comprising a solder layer deposited on the micro-pillars.
10. The apparatus of claim 9 , wherein the solder layer is configured to for attachment of an electronic device.
11. The apparatus of claim 5 , wherein the integrated and unitary body of homogenous material is formed by additive manufacturing.
12. The apparatus of claim 5 , wherein the micro-pillars are configured to elastically deform along a length responsive to a heat differential.