Etch processing system having reflective endpoint detection
Embodiments include wafer and photomask processing equipment. An etch processing system including an endpoint detection system having a light source and a photodetector is described. In an example, the light source emits light toward an alignment region over a substrate support member of an etch chamber, and the photodetector receives a reflection of the light from the alignment region. The reflection is monitored for endpoint and process control. A second light source emits light toward the alignment region, and a camera receives the light to image the alignment region. The image can be used to align the light emitted by the endpoint detection system to a spot location within the alignment region, e.g., within an alignment opening of a substrate mounted on the substrate support member.
1. An etch processing system, comprising:
an etch chamber having a chamber body around a substrate support member, wherein the etch chamber has a chamber lid and a plurality of lid windows, the plurality of lid windows comprising a first lid window located near a perimeter of the chamber lid radially outward from a center of the chamber lid at a first position, and the plurality of lid windows comprising a second lid window located near the perimeter of the chamber lid at a second position, the second position of the second lid window being circumferentially offset from the first position of the first lid window;
a substrate mounted on the substrate support member, wherein the substrate includes an alignment region; and
an endpoint detection system including a light source to emit a first light toward the alignment region over the substrate support member, and a photodetector to receive a reflection of the first light from the alignment region, wherein the circumferential offset provides one of the first lid window or the second lid window vertically above the alignment region regardless of an orientation of the a substrate on the substrate support member.
2. The etch processing system of claim 1 further comprising a camera to image the reflection of the first light and a second light from the alignment region, and wherein the first light travels through the one of the plurality of lid windows toward the alignment region and the reflection of the first light and the second light travel through the one of the plurality of lid windows toward the photodetector and the camera.
3. The etch processing system of claim 2 further comprising a focusing optics to direct the first light through the one of the plurality of lid windows to the alignment region, to direct the reflection of the first light to the photodetector, and to direct the reflection of the first light and the second light to the camera.
4. The etch processing system of claim 3 , wherein the focusing optics include one or more of a curved mirror or a plurality of lenses to focus the first light into a beam spot in the alignment region.
5. The etch processing system of claim 4 further comprising an adjustment mechanism operably coupled to one or more of the substrate support member or the endpoint detection system to move a spot location of the beam spot in the alignment region.
6. The etch processing system of claim 3 , wherein the focusing optics include a beam splitter between the camera and the one of the plurality of lid windows to direct the reflection of the first light and the second light to the camera.
7. The etch processing system of claim 2 further comprising a second light source to emit the second light toward the alignment region.
8. The etch processing system of claim 7 , wherein the first light travels toward the alignment region orthogonal to a top surface of the substrate support member, and wherein the second light travels toward the alignment region oblique to the top surface.
9. An etching process assembly, comprising:
an etch chamber having a chamber body around a substrate support member, wherein the etch chamber has a chamber lid and a plurality of lid windows, the plurality of lid windows comprising a first lid window located near a perimeter of the chamber lid radially outward from a center of the chamber lid at a first position, and the plurality of lid windows comprising a second lid window located near the perimeter of the chamber lid at a second position, the second position of the second lid window having a circumferential offset from the first position of the first lid window;
a substrate mounted on the substrate support member, wherein the substrate includes an alignment region having an etch layer over a base layer, and a patterned mask layer over the etch layer, and wherein the patterned masked layer includes an alignment opening, wherein the circumferential offset provides one of the first lid window or the second lid window vertically above the alignment region regardless of an orientation of the substrate on the substrate support member;
an endpoint detection system including a light source to emit a first light toward the alignment region of the substrate and a photodetector to receive a reflection of the first light from the base layer through the alignment opening; and
a camera to image the reflection of the first light and a second light from the alignment region.
10. The etch processing system of claim 9 , wherein the reflection of the first the first light and the second light travel to the camera from the alignment region through the one of the plurality of lid windows.
11. The etching process assembly of claim 10 further comprising a focusing optics to focus the first light into a beam spot within the alignment opening.
12. The etching process assembly of claim 9 further comprising a second light source to emit the second light toward the alignment region.
13. The etching process assembly of claim 12 , wherein the first light is directed into the alignment opening orthogonal to a top surface of the patterned mask layer, and wherein the second light is directed onto the alignment region oblique to the top surface.