IP Library › Granted Patent US 11,023,022
Granted Patent B2
US 11,023,022 · App. 16/751,327 · Granted Jun 1, 2021

Apparatus and method for improving thermal cycling reliability of multicore microprocessor

Inventors: Hoeseok Yang (Suwon-si, KR); Beomsik Kim (Cheonan-si, KR)
Assignee: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
G06F1/206G06F1/203G06F1/3206G06F1/3243
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Quick Facts
Patent No.
US 11,023,022
App. No.
16/751,327
Granted
Jun 1, 2021
Kind
B2
Abstract

The present disclosure relates to an apparatus and method for improving thermal cycling reliability of a multicore microprocessor, and a method for a method for improving thermal cycling reliability of a multicore microprocessor according to an embodiment of the present disclosure includes determining an optimal temperature of a microprocessor to maximize a mean time to failure of the microprocessor, and increasing at least one of an operating frequency of the microprocessor or a processor utilization of the microprocessor to make a temperature of the microprocessor equal to or higher than the optimal temperature.

Claims (61)

1. A method for improving thermal cycling reliability of a multicore microprocessor, performed by a thermal cycling reliability improving apparatus of the multicore microprocessor, comprising:

determining a next mapping policy based on a next task set including multiple tasks to be performed in the microprocessors;

determining an optimal temperature of the microprocessor to maximize a mean time to failure of the microprocessor based on the next mapping policy; and

based on a temperature of the microprocessor being lower than the optimal temperature, increasing at least one of an operating frequency of the microprocessor or a processor utilization of the microprocessor to make the temperature of the microprocessor be equal to or higher than the optimal temperature,

wherein the next mapping policy includes assignment policy information by which each of the multiple tasks is assigned to each of cores of the microprocessor and next operating frequency information for each of the cores that will perform an assigned task.

2. A method for improving thermal cycling reliability of a multicore microprocessor, performed by a thermal cycling reliability improving apparatus of the multicore microprocessor, comprising:

acquiring a next task set including multiple tasks to be performed in the microprocessor;

determining a next mapping policy that minimizes a temperature standard deviation between cores of the microprocessor based on the next task set;

calculating an initial temperature of the microprocessor based on the determined next mapping policy;

determining an optimal temperature profile for the microprocessor based on the initial temperature, a minimum operating temperature and a maximum operating temperature of the microprocessor; and

adjusting at least one of an operating frequency for each of the cores of the microprocessor or a processor utilization of the microprocessor to make a difference between the optimal temperature profile and a temperature of the microprocessor be equal to or lower than a predetermined threshold value,

wherein the next mapping policy includes assignment policy information by which each of the multiple tasks is assigned to each of the cores and next operating frequency information for each of the cores that will perform an assigned task, and

wherein the adjusting of the at least one of the operating frequency or the processor utilization comprises increasing the at least one of the operating frequency for each of the cores or the processor utilization of the microprocessor when the difference between the optimal temperature profile and the temperature of the microprocessor becomes higher than the predetermined threshold value according to decrease of the temperature of the microprocessor.

3. The method for improving thermal cycling reliability of a multicore microprocessor of claim 2 ,

wherein the determining of the next mapping policy includes:

(a) assigning any one of the multiple tasks to any one of the cores;

(b) determining the next operating frequency information for the core that has been assigned the any one task based on a real-time limitation and a power minimization condition;

(c) calculating temperatures of all the cores;

(d) calculating a temperature standard deviation between cores based on the calculated temperatures of all the cores;

(e) repeating the processes (a) to (d) with respect to the other cores among the cores for the any one task; and

(f) determining the assignment policy information in order for a core that minimizes the temperature standard deviation between cores to perform the any one task.

4. The method for improving thermal cycling reliability of a multicore microprocessor of claim 3 ,

wherein the determining of the next mapping policy is performed repeatedly until the assignment policy information for all of the multiple tasks and the next operating frequency information for all of the cores are determined.

5. The method for improving thermal cycling reliability of a multicore microprocessor of claim 4 ,

wherein the determining of the next mapping policy is performed repeatedly from a task with the longest execution time to a task with the shortest execution time among the multiple tasks.

6. The method for improving thermal cycling reliability of a multicore microprocessor of claim 2 ,

wherein the determining of the optimal temperature profile includes:

determining a minimum temperature profile based on the minimum operating temperature and the initial temperature;

determining a maximum temperature profile based on the maximum operating temperature and the initial temperature;

estimating a mean time to failure of the microprocessor in the minimum temperature profile and the maximum temperature profile; and

determining the optimal temperature profile within a range between the minimum temperature profile and the maximum temperature profile based on the mean time to failure.

7. The method for improving thermal cycling reliability of a multicore microprocessor of claim 6 ,

wherein in the estimating of the mean time to failure, the mean time to failure is estimated based on a Monte Carlo simulator.

8. The method for improving thermal cycling reliability of a multicore microprocessor of claim 2 ,

wherein the adjusting of at least one of the operating frequency for each of the cores of the microprocessor or the processor utilization of the microprocessor includes:

calculating the difference between the optimal temperature profile and the temperature of the microprocessor.

9. The method for improving thermal cycling reliability of a multicore microprocessor of claim 8 ,

wherein in the increasing of at least one of the operating frequency for each of the cores of the microprocessor or the processor utilization of the microprocessor, a virtual task is assigned to a core that will increase a processor utilization to increase the processor utilization of the microprocessor.

10. The method for improving thermal cycling reliability of a multicore microprocessor of claim 2 ,

wherein the microprocessor and a printed circuit board on which the microprocessor is mounted are provided in a system with a built-in satellite payload.

11. An apparatus for improving thermal cycling reliability of a multicore microprocessor, comprising:

an initial mapping unit that determines a next mapping policy for multiple tasks to be performed in the microprocessor and outputs an initial temperature of the microprocessor based on the next mapping policy;

an optimal profile search unit that determines an optimal temperature profile based on the initial temperature, a minimum operating temperature and a maximum operating temperature of the microprocessor; and

a runtime mapping unit that adjusts at least one of an operating frequency for each of cores of the microprocessor or a processor utilization of the microprocessor based on a difference between the optimal temperature profile and a temperature of the microprocessor,

wherein the next mapping policy includes assignment policy information by which each of the multiple tasks is assigned to each of the cores and next operating frequency information for each of the cores that will perform an assigned task, and

wherein the runtime mapping unit increases the at least one of the operating frequency or the processor utilization of the microprocessor to make the difference be equal to or less than a predetermined threshold value when the difference between the optimal temperature profile and the temperature of the microprocessor becomes higher than the predetermined threshold value according to decrease of the temperature of the microprocessor.

12. The apparatus for improving thermal cycling reliability of a multicore microprocessor of claim 11 ,

wherein the initial mapping unit performs:

(a) assigning any one of the multiple tasks to any one of the cores;

(b) determining the next operating frequency information for the core that has been assigned the any one task based on a real-time limitation and a power minimization condition;

(c) calculating temperatures of all the cores;

(d) calculating a temperature standard deviation between cores based on the calculated temperatures of all the cores;

(e) repeating the processes (a) to (d) with respect to the other cores among the cores for the any one task;

(f) determining the assignment policy information in order for a core that minimizes the temperature standard deviation between cores to perform the any one task; and

(g) repeating the processes (a) to (f) until the assignment policy information for all of the multiple tasks and the next operating frequency information for all of the cores are determined.

13. The apparatus for improving thermal cycling reliability of a multicore microprocessor of claim 11 ,

wherein the optimal profile search unit includes:

a profile range determination unit that determines a minimum temperature profile based on the minimum operating temperature and the initial temperature and determines a maximum temperature profile based on the maximum operating temperature and the initial temperature; and

a mean life calculation unit that determines the optimal temperature profile within a range between the minimum temperature profile and the maximum temperature profile based on a mean time to failure of the microprocessor.

14. The apparatus for improving thermal cycling reliability of a multicore microprocessor of claim 11 ,

wherein the runtime mapping unit calculates the difference between the optimal temperature profile and the temperature of the microprocessor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2020
From: YANG, HOESEOK; KIM, BEOMSIK
To: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
Reel/Frame 051606/0581 →
Priority Claims (1)
KR 10-2019-0064663 · May 31, 2019 · national
Continuity (1)
Related Publication 20200379527A1 · Dec 3, 2020